An Improved Performance of High Power Application of Al0.25Ga0.75N/AlN/GaN/Al0.25Ga0.75N Pseudo-morphic High Electron Mobility Transistor (PHEMT): Numerical Simulation Study

2021 ◽  
pp. 786-799
Author(s):  
Khaouani Mohammed ◽  
Hamdoune Abdelkader ◽  
Guen Ahlam Bouazza ◽  
Kourdi Zakarya ◽  
Hichem Bencherif
2004 ◽  
Vol 40 (12) ◽  
pp. 775 ◽  
Author(s):  
K. Shiojima ◽  
T. Makimura ◽  
T. Kosugi ◽  
S. Sugitani ◽  
N. Shigekawa ◽  
...  

Author(s):  
Kourdi Zakarya ◽  
Abdelkhader Hamdoun

We present this work by two steps. In the first one, the new structure proposed of the FP-HEMTs device (Field plate High Electron Mobility Transistor) with a T-gate on an 4H-SIC substrate to optimize these electrical performances, multiple field-plates were used with aluminum oxide to split the single electric field peak into several smaller peaks, and as passivation works to reduce scaling leakage current. In the next, we include a modeling of a simulation in the Tcad-Silvaco Software for realizing the study of the influence of negative voltage applied to gate T-shaped in OFF state time and high power with ambient temperature, the performance differences between the 3FP and the SFP devices are discussed in detail.


2020 ◽  
Vol 70 (5) ◽  
pp. 511-514
Author(s):  
Subhash Chander ◽  
Partap Singh ◽  
Samuder Gupta ◽  
D. S. Rawal ◽  
Mridula Gupta

In this paper effect of self-heating has been studied of AlGaN/GaN high electron mobility transistor (HEMT) for different passivation layers which is promising device for high power at high frequencies. The different passivation layers used are aluminium oxide (Al2O3), silicon nitride (SiN) and silicon dioxide (SiO2). The device GaN HEMT has been simulated and characterised for its thermal behaviour by the distribution of lattice temperature inside the device using device simulation tool ATLAS from SILVACO. The transfer and output characteristics with and without self-heating has been studied for electrical characterisation. The channel temperature for different passivation observed is 448 K, 456 K and 471 K forAl2O3, SiN and SiO2 respectively. The observed different temperatures are due to difference in their thermal conductivity. This channel temperature information is critical to study the reliability of the device at high power levels.


2016 ◽  
Vol 65 (16) ◽  
pp. 168501
Author(s):  
Li Zhi-Peng ◽  
Li Jing ◽  
Sun Jing ◽  
Liu Yang ◽  
Fang Jin-Yong

2008 ◽  
Vol 44 (12) ◽  
pp. 771 ◽  
Author(s):  
L.-Y. Chen ◽  
S.-Y. Cheng ◽  
K.-Y. Chu ◽  
C.-W. Hung ◽  
T.-P. Chen ◽  
...  

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