Thermal Fatigue in Solder Joints

JOM ◽  
1988 ◽  
Vol 40 (6) ◽  
pp. 18-22 ◽  
Author(s):  
D. R. Frear ◽  
Dennis Grivas ◽  
J. W. Morris
Keyword(s):  
Thermal Fatigue ◽  
Solder Joints

scholarly journals Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis

2001 ◽  
Vol 42 (5) ◽  
pp. 809-813 ◽  
Author(s):  
Young-Eui Shin ◽  
Kyung-Woo Lee ◽  
Kyong-Ho Chang ◽  
Seung-Boo Jung ◽  
Jae Pil Jung
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Lead Free ◽  
Element Analysis ◽  
Thermal Fatigue Life

Predicting Thermal Fatigue Lifetimes for SMT Solder Joints

1992 ◽  
Vol 114 (4) ◽  
pp. 472-476 ◽  
Author(s):  
J. Sauber ◽  
J. Seyyedi
Keyword(s):  
Finite Element ◽  
Solder Joint ◽  
Thermal Cycling ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Finite Element Models ◽  
Creep Tests ◽  
Creep Equation ◽  
Joint Behavior ◽  
Creep Strains

A power-law type creep equation has been added to finite element models to calculate solder joint response to time, temperature, and stress level. The ability of the models to predict solder joint behavior was verified by running a series of creep tests. The models were then solved to determine the solder joint creep strains which occur during thermal cycling. These creep strains were used to predict the degradation of pull strength resulting from thermal cycling. More than 8,600 solder joints were thermally cycled and then individually pull tested to verify the accuracy of the method.

Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C

2009 ◽  
Vol 38 (6) ◽  
pp. 843-851 ◽  
Author(s):  
Olli Nousiainen ◽  
Tero Kangasvieri ◽  
Risto Rautioaho ◽  
Jouko Vähäkangas
Keyword(s):  
Thermal Fatigue ◽  
Composite Solder ◽  
Solder Joints ◽  
Lead Free ◽  
Temperature Range ◽  
Fatigue Endurance
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