New Method to Measure Tensile Strength of Low Modulus Thin Films

A new method for preparing thin films for use in beta-spectrometry and 4π-counting is described. These films, made of polyvinylchloride-acetate copolymer are readily prepared with superficial densities as low as 1 μgm. per cm.2 The films have good tensile strength and show excellent resistance to acids, alkalies, and many organic reagents. The thickness of the films may be determined (a) gravimetrically, (b) radiometrically, and (c) optically either by transmission or reflection. The films can be made conducting by distilling a thin gold layer on to them. The thickness of the gold layer can be determined spectrophotometrically.

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New Method of Calculating Bulk and Surface States in Thin Films

Physical Review Letters ◽

10.1103/physrevlett.28.1264 ◽

1972 ◽

Vol 28 (19) ◽

pp. 1264-1268 ◽

Cited By ~ 59

Author(s):

Gerald P. Alldredge ◽

Leonard Kleinman

Keyword(s):

Thin Films ◽

Surface States ◽

New Method

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The epitaxial growth of the LaCaMnO thin films with the CMR effects prepared by a new method: Precursor film sintering

Journal of Crystal Growth ◽

10.1016/j.jcrysgro.2006.08.021 ◽

2006 ◽

Vol 296 (2) ◽

pp. 207-212 ◽

Cited By ~ 7

Author(s):

Hui Liu ◽

Ying Luo ◽

Ming Li

Keyword(s):

Thin Films ◽

Epitaxial Growth ◽

New Method ◽

Precursor Film

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New method for determining the nonlinear optical coefficients of thin films

Applied Physics Letters ◽

10.1063/1.108199 ◽

1992 ◽

Vol 61 (2) ◽

pp. 145-146 ◽

Cited By ~ 18

Author(s):

Y. Hase ◽

K. Kumata ◽

S. S. Kano ◽

M. Ohashi ◽

T. Kondo ◽

...

Keyword(s):

Thin Films ◽

Nonlinear Optical ◽

New Method

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Influence of Flax Fibre Hybridization on Mechanical Behaviour of Sisal Fibre-Polypropylene Composites Prepared with an Injection Moulding Machine

Advances in Materials Science and Engineering ◽

10.1155/2021/4594465 ◽

2021 ◽

Vol 2021 ◽

pp. 1-7

Author(s):

J. Allen Jeffrey ◽

A. Sivakumar ◽

R. Naveen Kumar ◽

A. Anbazhagan ◽

G. Manojkumar ◽

...

Keyword(s):

Tensile Strength ◽

Flax Fibre ◽

Physical Parameters ◽

Sisal Fibre ◽

Polypropylene Composites ◽

Specific Strength ◽

Flax Fibres ◽

Low Weight ◽

Moulding Machine ◽

Low Modulus

Due to their low weight, high specific strength, and low environmental impact, sisal fibre-polypropylene composites have gained popularity. However, the material has a low modulus and poor moisture resistance, among other shortcomings. This study investigated how flax fibre hybridization affects the physical parameters of sisal fibre-polypropylene composites. We used maleic anhydride-grafted polypropylene to improve compatibility between fibres and polypropylene. Adding flax fibres to polypropylene-silica composites resulted in increased tensile strength, flexibility, and impact strength, according to researchers. Water resistance was further improved by adding flax fibres. Tensile strength values of polypropylene-sisal fibre composites filled with 0, 5, 10, 15, and 20 wt% of flax fibres were 29.46, 30.56, 31.57, 33.12, and 34.64 MPa, respectively.

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Vapor deposition of parylene-F using hydrogen as carrier gas

Journal of Materials Research ◽

10.1557/jmr.1999.0036 ◽

1999 ◽

Vol 14 (1) ◽

pp. 246-250 ◽

Cited By ~ 4

Author(s):

D. Mathur ◽

G-R. Yang ◽

T-M. Lu

Keyword(s):

Thin Films ◽

Vapor Deposition ◽

Device Fabrication ◽

New Method ◽

Silicon Substrates ◽

Microelectronic Device ◽

Precursor Method ◽

Liquid Precursor ◽

Carrier Gas ◽

Liquid Precursors

A new method for depositing parylene-F (PA-F) thin films on silicon substrates has been explored. Hydrogen has been used as a carrier gas along with liquid precursors, dibromotetrafluoro-p-xylene and 1,4-bis(trifluoromethyl)benzene, to deposit PA-F. The properties of this film have been compared with the films obtained by the Gorham dimer method and the liquid precursor method using FTIR, XPS, and XRD. The PA-F films deposited by the dimer or liquid precursor acquired some kind of microcrystallinity on annealing. However, the PA-F films deposited in the presence of hydrogen were amorphous on annealing. This property could be potentially exploited for application in microelectronic device fabrication.

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