Effects of Graphene Nanosheets on the Wettability and Mechanical Properties of Sn-0.3Ag-0.7Cu Lead-Free Solder

2020 ◽  
Vol 49 (12) ◽  
pp. 7394-7399
Author(s):  
Limeng Yin ◽  
Zhongwen Zhang ◽  
Zilong Su ◽  
Cunguo Zuo ◽  
Zongxiang Yao ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Graphene Nanosheets ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Effect of aluminum content on structure, transport and mechanical properties of Sn-Zn eutectic lead free solder alloy rapidly solidified from melt.

2015 ◽  
Vol 10 (1) ◽  
pp. 2641-2648
Author(s):  
Rizk Mostafa Shalaby ◽  
Mohamed Munther ◽  
Abu-Bakr Al-Bidawi ◽  
Mustafa Kamal
Keyword(s):  
Mechanical Properties ◽  
Melting Point ◽  
Lead Free ◽  
Al Alloy ◽  
Lead Free Solder ◽  
Pronounced Increase ◽  
Mass Unit ◽  
Size Refinement ◽  
Free Solder ◽  
Lead Free Solders

The greatest advantage of Sn-Zn eutectic is its low melting point (198 oC) which is close to the melting point. of Sn-Pb eutectic solder (183 oC), as well as its low price per mass unit compared with Sn-Ag and Sn-Ag-Cu solders. In this paper, the effect of 0.0, 1.0, 2.0, 3.0, 4.0, and 5.0 wt. % Al as ternary additions on melting temperature, microstructure, microhardness and mechanical properties of the Sn-9Zn lead-free solders were investigated. It is shown that the alloying additions of Al at 4 wt. % to the Sn-Zn binary system lead to lower of the melting point to 195.72 ˚C.  From x-ray diffraction analysis, an aluminium phase, designated α-Al is detected for 4 and 5 wt. % Al compositions. The formation of an aluminium phase causes a pronounced increase in the electrical resistivity and microhardness. The ternary Sn-9Zn-2 wt.%Al exhibits micro hardness superior to Sn-9Zn binary alloy. The better Vickers hardness and melting points of the ternary alloy is attributed to solid solution effect, grain size refinement and precipitation of Al and Zn in the Sn matrix.  The Sn-9%Zn-4%Al alloy is a lead-free solder designed for possible drop-in replacement of Pb-Sn solders.  

Nanoindentation Characterization of Lead-free Solders and Intermetallic Compounds under Thermal Aging

2010 ◽  
Vol 2010 (1) ◽  
pp. 000314-000318
Author(s):  
Tong Jiang ◽  
Fubin Song ◽  
Chaoran Yang ◽  
S. W. Ricky Lee
Keyword(s):  
Mechanical Properties ◽  
Thermal Aging ◽  
Solder Joints ◽  
Lead Free ◽  
Small Range ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Aging Test ◽  
Free Solder ◽  
Lead Free Solders

The enforcement of environmental legislation is pushing electronic products to take lead-free solder alloys as the substitute of traditional lead-tin solder alloys. Applications of such alloys require a better understanding of their mechanical behaviors. The mechanical properties of the lead-free solders and IMC layers are affected by the thermal aging. The lead-free solder joints on the pads subject to thermal aging test lead to IMC growth and cause corresponding reliability concerns. In this paper, the mechanical properties of the lead-free solders and IMCs were characterized by nanoindentation. Both the Sn-rich phase and Ag3Sn + β-Sn phase in the lead-free solder joint exhibit strain rate depended and aging soften effect. When lead-free solder joints were subject to thermal aging, Young's modulus of the (Cu, Ni)6Sn5 IMC and Cu6Sn5 IMC changed in very small range. While the hardness value decreased with the increasing of the thermal aging time.

Effect of Cooling Rate on the Microstructural and Mechanical Properties of Sn-0.3Ag-0.7Cu-0.05Ni Solder Alloy

2017 ◽  
Vol 751 ◽  
pp. 9-13
Author(s):  
Kogaew Inkong ◽  
Phairote Sungkhaphaitoon
Keyword(s):  
Mechanical Properties ◽  
Cooling Rate ◽  
Solder Alloy ◽  
Testing Machine ◽  
Optical Microscope ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cooling Systems ◽  
Lead Free Solder Alloy ◽  
Free Solder

The effect of cooling rate on the microstructural and mechanical properties of Sn-0.3Ag-0.7Cu-0.05Ni lead-free solder alloy was studied. The microstructure of specimens was characterized by using an optical microscope (OM) and an energy dispersive X-ray spectroscopy (EDX). The mechanical properties were performed by using a universal testing machine (UTM). The results showed that the cooling rate of water-cooled specimens was about 2.37 °C/s and the cooling rate of mold-cooled specimens was about 0.05 °C/s. To compare the different cooling rates, it was found that the grain size of water-cooled specimens was finer than that of the mold-cooled specimens, this resulted in an increment of mechanical properties of solder alloy. A higher tensile strength (33.10 MPa) and a higher elongation (34%) were observed when water-cooled and mold-cooled systems were used, respectively. The microstructure of Sn-0.3Ag-0.7Cu-0.05Ni lead-free solder alloy solidified by both cooling systems exhibited three phases: β-Sn, Ag3Sn and (Cu,Ni)6Sn5 IMCs.

Microstructure, interfacial IMC and mechanical properties of Sn–0.7Cu–xAl (x=0–0.075) lead-free solder alloy

2015 ◽  
Vol 67 ◽  
pp. 209-216 ◽  
Author(s):  
Li Yang ◽  
Yaocheng Zhang ◽  
Jun Dai ◽  
Yanfeng Jing ◽  
Jinguo Ge ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

10108 Mechanical Properties of Lead-free Solder Using Small Specimen

2014 ◽  
Vol 2014.20 (0) ◽  
pp. _10108-1_-_10108-2_
Author(s):  
Yusuke OOGURI ◽  
Tomoya KOBAYASHI ◽  
Shota TANAKA ◽  
Masayoshi TATENO
Keyword(s):  
Mechanical Properties ◽  
Lead Free ◽  
Lead Free Solder ◽  
Small Specimen ◽  
Free Solder

20117 Evaluation of Mechanical properties of Lead-Free Solder on Small Specimen

2013 ◽  
Vol 2013.19 (0) ◽  
pp. 219-220
Author(s):  
Yusuke OOGURI ◽  
Takashi YONEYAMA ◽  
Toshihiri HANAOKA ◽  
Masayoshi TATENO
Keyword(s):  
Mechanical Properties ◽  
Lead Free ◽  
Lead Free Solder ◽  
Small Specimen ◽  
Free Solder

The Effect of Nano-Cu Particles on Mechanical Properties of Micro-Joining Joint with Lead-Free Solder

2011 ◽  
Vol 291-294 ◽  
pp. 929-933
Author(s):  
Ying Ming Shen ◽  
Fang Juan Qi ◽  
Min Xie ◽  
Jian Li
Keyword(s):  
Mechanical Properties ◽  
Solder Joint ◽  
Lead Free ◽  
Fatigue Properties ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Shearing Strength ◽  
Free Solder

The effect of nano-Cu particles on mechanical bend reliability of micro-joining joint with Sn-3.5Ag lead free solder was studied in this paper. The results show that 0.5% nano-Cu composite lead free solder show significantly better shearing strength and mechanical bend fatigue properties than eutectic Sn-3.5Ag solder paste, 1.0% nano-Cu composites and 1.5% nano-Cu composites. The further analysis shows that adding nano-Cu particles make much effect on intermetallic (IMC) in the interface of micro-joint and the inside of the solder joint. The different interface of micro-joining joint induced different mechanical properties.

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