The effect of heater wall thickness on heat transfer in nucleate pool-boiling at high heat flux

1985 ◽  
Vol 28 (7) ◽  
pp. 1367-1375 ◽  
Author(s):  
N.Rajendra Prasad ◽  
J.S. Saini ◽  
R. Prakash
Energies ◽  
2021 ◽  
Vol 14 (13) ◽  
pp. 3893
Author(s):  
Mohd Danish ◽  
Mohammed K. Al Mesfer ◽  
Khursheed B. Ansari ◽  
Mudassir Hasan ◽  
Abdelfattah Amari ◽  
...  

In the current work, the heat flux in nucleate pool boiling has been predicted using the macrolayer and latent heat evaporation model. The wall superheat (ΔT) and macrolayer thickness (δ) are the parameters considered for predicting the heat flux. The influence of operating parameters on instantaneous conduction heat flux and average heat flux across the macrolayer are investigated. A comparison of the findings of current model with Bhat’s decreasing macrolayer model revealed a close agreement under the nucleate pool boiling condition at high heat flux. It is suggested that conduction heat transfer strongly rely on macrolayer thickness and wall superheat. The wall superheat and macrolayer thickness is found to significantly contribute to conduction heat transfer. The predicted results closely agree with the findings of Bhat’s decreasing macrolayer model for higher values of wall superheat signifying the nucleate boiling. The predicted results of the proposed model and Bhat’s existing model are validated by the experimental data. The findings also endorse the claim that predominant mode of heat transfer from heater surface to boiling liquid is the conduction across the macrolayer at the significantly high heat flux region of nucleate boiling.


Processes ◽  
2019 ◽  
Vol 7 (10) ◽  
pp. 726
Author(s):  
Mohd Danish ◽  
Mohammed Al Mesfer

A mathematical model has been developed for heat exchange in nucleate boiling at high flux applying an energy balance on a macrolayer. The wall superheat, macrolayer thickness, and time are the parameters considered for predicting the heat flux. The influence of the wall superheat and macrolayer thickness on average heat flux has been predicted. The outcomes of the current model have been compared with Bhat’s constant macrolayer model, and it was found that these models are in close agreement corresponding to the nucleate pool boiling regime. It was concluded that the wall superheat and macrolayer thickness contributed significantly to conduction heat transfer. The average conduction heat fluxes predicted by the current model and by Bhat’s model are in close agreement for a thinner macrolayer of approximately 50 µm. For higher values of the wall superheat, which corresponds to the nucleate pool boiling condition, the predicted results strongly agree with the results of Bhat’s model. The findings also validate the claim that conduction across the macrolayer accounts for the main heat transfer mode from the heater surface to boiling liquid at high heat flux in nucleate pool boiling.


2014 ◽  
Vol 136 (4) ◽  
Author(s):  
J. Jung ◽  
S. J. Kim ◽  
J. Kim

Experimental work was undertaken to investigate the process by which pool-boiling critical heat flux (CHF) occurs using an IR camera to measure the local temperature and heat transfer coefficients on a heated silicon surface. The wetted area fraction (WF), the contact line length density (CLD), the frequency between dryout events, the lifetime of the dry patches, the speed of the advancing and receding contact lines, the dry patch size distribution on the surface, and the heat transfer from the liquid-covered areas were measured throughout the boiling curve. Quantitative analysis of this data at high heat flux and transition through CHF revealed that the boiling curve can simply be obtained by weighting the heat flux from the liquid-covered areas by WF. CHF mechanisms proposed in the literature were evaluated against the observations.


2006 ◽  
Vol 129 (3) ◽  
pp. 247-255 ◽  
Author(s):  
X. L. Xie ◽  
W. Q. Tao ◽  
Y. L. He

With the rapid development of the Information Technology (IT) industry, the heat flux in integrated circuit (IC) chips cooled by air has almost reached its limit at about 100W∕cm2. Some applications in high technology industries require heat fluxes well beyond such a limitation. Therefore, the search for a more efficient cooling technology becomes one of the bottleneck problems of the further development of the IT industry. The microchannel flow geometry offers a large surface area of heat transfer and a high convective heat transfer coefficient. However, it has been hard to implement because of its very high pressure head required to pump the coolant fluid through the channels. A normal channel size could not give high heat flux, although the pressure drop is very small. A minichannel can be used in a heat sink with quite a high heat flux and a mild pressure loss. A minichannel heat sink with bottom size of 20mm×20mm is analyzed numerically for the single-phase turbulent flow of water as a coolant through small hydraulic diameters. A constant heat flux boundary condition is assumed. The effect of channel dimensions, channel wall thickness, bottom thickness, and inlet velocity on the pressure drop, temperature difference, and maximum allowable heat flux are presented. The results indicate that a narrow and deep channel with thin bottom thickness and relatively thin channel wall thickness results in improved heat transfer performance with a relatively high but acceptable pressure drop. A nearly optimized structure of heat sink is found that can cool a chip with heat flux of 350W∕cm2 at a pumping power of 0.314W.


2016 ◽  
Vol 61 ◽  
pp. 127-139 ◽  
Author(s):  
Jure Petkovsek ◽  
Yi Heng ◽  
Matevz Zupancic ◽  
Henrik Gjerkes ◽  
Franc Cimerman ◽  
...  

Author(s):  
Qian Li ◽  
Wei Wang ◽  
Chris Oshman ◽  
Benoit Latour ◽  
Chen Li ◽  
...  

Thermal management plays an important role in both high power electronics and energy conversion systems. A key issue in thermal management is the dissipation of the high heat flux generated by functional components. In this paper, various microstructures, nanostructures and hybrid micro/nano-structures were successfully fabricated on copper (Cu) surfaces, and the corresponding pool boiling heat transfer performance was systematically studied. It is found that the critical heat flux (CHF) of hybrid structured surfaces is about 15% higher than that of the surfaces with nanowires only and micro-pillars only. More importantly, the superheat at CHF for the hybrid structured surface is much smaller than that of the micro-pillared surface (about 35%), and a maximum heat transfer coefficient (HTC) of about 90,000W/m2K is obtained. Compared with the known best pool boiling performance on biporous media, a much larger HTC and much lower superheat at a heat flux of 250W/cm2 have been obtained on the novel hybrid-structured surfaces.


Fractals ◽  
2010 ◽  
Vol 18 (04) ◽  
pp. 409-415 ◽  
Author(s):  
BOQI XIAO ◽  
SONGHUA GAO ◽  
LINGXIA CHEN

A fractal model for nucleate pool boiling of nanofluids at high heat flux and critical heat flux (CHF) is developed based on the fractal distribution of nanoparticles and nucleation sites on boiling surfaces in this paper. The formula of calculating high heat flux and CHF for nanofluids in nucleate pool boiling is given by taking into account heat convection between nanoparticles and liquids due to the Brownian motion of nanoparticles in fluids. The proposed model is expressed as a function of temperature of nanofluids, the effective thermal conductivity of nanofluids, the average size of nanoparticles, the fractal dimension of nanoparticles and nucleation sites, the nanoparticles volume fraction of suspension, and physical properties of fluids. No additional/new empirical constant is introduced in this fractal model. An agreement between the proposed model predictions and experimental data is found. The validity of the fractal model for nucleate pool boiling of nanofluids at high heat flux and CHF is thus verified.


Author(s):  
Aranya Chauhan ◽  
Satish G. Kandlikar

Abstract The trend of miniaturization in electronics presents a great challenge in the thermal management of devices. The continuous increase in the number of transistors in the processor leads to high heat flux generation, limiting the performance of the device. Boiling heat transfer offers a great heat removal competency while maintaining the low chip temperatures. The critical heat flux (CHF) dictates the maximum heat removal ability, and heat transfer coefficient (HTC) defines the efficiency of the boiling process. This pool boiling study is focused on using a manifold containing a symmetric dual taper over the heating surface. The heat transfer performance of this configuration is evaluated for different taper angles in the manifold. The macro-convection assisted by vapor columns during boiling enhance the CHF and HTC limit significantly. A CHF of 287 W/cm2 with an HTC of 116 kW/cm2°C was achieved with a plain copper surface, representing greater than a 2-fold increases in each over a plain surface.


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