Approximate stochastic equation for reduced distribution function as applied to nucleation in critical fluid

1975 ◽  
Vol 53 (2) ◽  
pp. 117-118 ◽  
Author(s):  
K. Kawasaki
Keyword(s):  
Distribution Function ◽  
Stochastic Equation

Influence of extinction phenomenon on determination of the orientation distribution function

2006 ◽  
Vol 2006 (suppl_23_2006) ◽  
pp. 175-180
Author(s):  
G. Gómez-Gasga ◽  
T. Kryshtab ◽  
J. Palacios-Gómez ◽  
A. de Ita de la Torre
Keyword(s):  
Distribution Function ◽  
Orientation Distribution Function ◽  
Orientation Distribution

The Approximation of Sum of Independent Distributions by the Erlang Distribution Function

2002 ◽  
Vol 7 (1) ◽  
pp. 55-60 ◽  
Author(s):  
Antanas Karoblis
Keyword(s):  
Distribution Function ◽  
Exponential Distribution ◽  
Queueing Theory ◽  
Erlang Distribution ◽  
Estimation Of Error

The exponential distribution and the Erlang distribution function are been used in numerous areas of mathematics, and specifically in the queueing theory. Such and similar applications emphasize the importance of estimation of error of approximation by the Erlang distribution function. The article gives an analysis and technique of error’s estimation of an accuracy of such approximation, especially in some specific cases.

Electrostatic Adhesion Testing for the Evaluation of Metallization Adhesion

1997 ◽  
Vol 473 ◽  
Author(s):  
H. S. Yang ◽  
F. R. Brotzen ◽  
D. L. Callahan ◽  
C. F. Dunn
Keyword(s):  
Thin Film ◽  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Distribution Function ◽  
Quantitative Measurement ◽  
Multilayer Films ◽  
Adhesion Testing ◽  
Novel Technique ◽  
Electrostatic Adhesion ◽  
Scanning Electron

ABSTRACTQuantitative measurement of the adhesion strength of thin film metallizations has been achieved by a novel technique employing electrostatic forces to generate delaminating stresses. This technique has been used in testing the adhesion of Al-Cu, Cu, and Al multilayer films deposited on Si. Micro-blister-type failure is revealed by scanning electron microscopy. The delamination process and the geometry of the blister are discussed. The measured adhesion data fit a Weibull distribution function.

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