A Review of TiO2-nanoparticle Reinforced Lead-Free Solder Composites Used in Electronic Components Soldering

2022 ◽  
Author(s):  
Montajar Sarkar ◽  
Fahmida Gulshan ◽  
Abu Raihan Md. Harunur Rashid ◽  
Muhammad Hasanuzzaman
Keyword(s):  
Tio2 Nanoparticle ◽  
Lead Free ◽  
Lead Free Solder ◽  
Electronic Components ◽  
Free Solder

Reliability behavior of lead-free solder joints in electronic components

2012 ◽  
Vol 24 (1) ◽  
pp. 172-190 ◽  
Author(s):  
Liang Zhang ◽  
Ji-guang Han ◽  
Cheng-wen He ◽  
Yong-huan Guo
Keyword(s):  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Electronic Components ◽  
Free Solder

Effect of aluminum content on structure, transport and mechanical properties of Sn-Zn eutectic lead free solder alloy rapidly solidified from melt.

2015 ◽  
Vol 10 (1) ◽  
pp. 2641-2648
Author(s):  
Rizk Mostafa Shalaby ◽  
Mohamed Munther ◽  
Abu-Bakr Al-Bidawi ◽  
Mustafa Kamal
Keyword(s):  
Mechanical Properties ◽  
Melting Point ◽  
Lead Free ◽  
Al Alloy ◽  
Lead Free Solder ◽  
Pronounced Increase ◽  
Mass Unit ◽  
Size Refinement ◽  
Free Solder ◽  
Lead Free Solders

The greatest advantage of Sn-Zn eutectic is its low melting point (198 oC) which is close to the melting point. of Sn-Pb eutectic solder (183 oC), as well as its low price per mass unit compared with Sn-Ag and Sn-Ag-Cu solders. In this paper, the effect of 0.0, 1.0, 2.0, 3.0, 4.0, and 5.0 wt. % Al as ternary additions on melting temperature, microstructure, microhardness and mechanical properties of the Sn-9Zn lead-free solders were investigated. It is shown that the alloying additions of Al at 4 wt. % to the Sn-Zn binary system lead to lower of the melting point to 195.72 ˚C.  From x-ray diffraction analysis, an aluminium phase, designated α-Al is detected for 4 and 5 wt. % Al compositions. The formation of an aluminium phase causes a pronounced increase in the electrical resistivity and microhardness. The ternary Sn-9Zn-2 wt.%Al exhibits micro hardness superior to Sn-9Zn binary alloy. The better Vickers hardness and melting points of the ternary alloy is attributed to solid solution effect, grain size refinement and precipitation of Al and Zn in the Sn matrix.  The Sn-9%Zn-4%Al alloy is a lead-free solder designed for possible drop-in replacement of Pb-Sn solders.  

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