Recycled granulate obtained from waste alumina-rich refractory powder by the cold bonding process

2015 ◽  
Vol 41 (7) ◽  
pp. 8996-9002 ◽  
Author(s):  
N. Malenšek ◽  
V. Ducman ◽  
B. Mirtič
Keyword(s):  
Bonding Process ◽  
Refractory Powder ◽  
Cold Bonding

Cold-bonding process for treatment and reuse of waste materials: Technical designs and applications of pelletized products

2020 ◽  
pp. 1-35 ◽  
Author(s):  
Alberto Ferraro ◽  
Francesco Colangelo ◽  
Ilenia Farina ◽  
Marco Race ◽  
Raffaele Cioffi ◽  
...  
Keyword(s):  
Bonding Process ◽  
Waste Materials ◽  
Cold Bonding

Analysis of Two Electrical Failures Caused by Die Attach of Exposed Pad Package

2014 ◽  
Author(s):  
Jinglong Li ◽  
Motohiko Masuda ◽  
Yi Che ◽  
Miao Wu
Keyword(s):  
Bonding Process ◽  
Die Attach ◽  
Die Bonding ◽  
Generic Analysis

Abstract Die attach is well known in die bonding process. Its electrical character is simple. But some failures caused by die attach are not so simple. And it is not proper to analyze by a generic analysis flow. The analysis of two failures caused by die attach are presented in this paper.

Failure Analysis on Power Trench MOSFET Devices with Copper Wire Bonds

2011 ◽  
Author(s):  
Huixian Wu ◽  
Arthur Chiang ◽  
David Le ◽  
Win Pratchayakun
Keyword(s):  
Failure Analysis ◽  
Copper Wire ◽  
New Technology ◽  
Analytical Techniques ◽  
Wire Bonding ◽  
Bonding Process ◽  
Wire Bonds ◽  
Copper Wire Bonding ◽  
Wet Chemical ◽  
Microelectronic Components

Abstract With gold prices steadily going up in recent years, copper wire has gained popularity as a means to reduce cost of manufacturing microelectronic components. Performance tradeoff aside, there is an urgent need to thoroughly study the new technology to allay any fear of reliability compromise. Evaluation and optimization of copper wire bonding process is critical. In this paper, novel failure analysis and analytical techniques are applied to the evaluation of copper wire bonding process. Several FA/analytical techniques and FA procedures will be discussed in detail, including novel laser/chemical/plasma decapsulation, FIB, wet chemical etching, reactive ion etching (RIE), cross-section, CSAM, SEM, EDS, and a combination of these techniques. Two case studies will be given to demonstrate the use of these techniques in copper wire bonded devices.

Evaluation of a New Heparin Bonding Process in Prolonged Extracorporeal Membrane Oxygenation

ASAIO Journal ◽  
1995 ◽  
Vol 41 (3) ◽  
pp. M561-M567 ◽  
Author(s):  
Chisato Nojiri ◽  
Kazuhiko Hagiwara ◽  
Kenji Yokoyama ◽  
Eiichi Kuribayashi ◽  
Keisuke Hidaka ◽  
...  
Keyword(s):  
Extracorporeal Membrane Oxygenation ◽  
Bonding Process ◽  
Membrane Oxygenation ◽  
Heparin Bonding

Fe/Ni diffusion behavior in the shear-extrusion solid state bonding process

2021 ◽  
Vol 67 ◽  
pp. 35-45
Author(s):  
Shuangjie Zhang ◽  
Wei Wang ◽  
Shibo Ma ◽  
Qiang Li
Keyword(s):  
Solid State ◽  
Bonding Process ◽  
Diffusion Behavior ◽  
Solid State Bonding
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