Electrical and mechanical properties of electrically conductive adhesives from epoxy, micro-silver flakes, and nano-hexagonal boron nitride particles after humid and thermal aging

2013 ◽  
Vol 44 ◽  
pp. 232-236 ◽  
Author(s):  
Hui-Wang Cui ◽  
Dong-Sheng Li ◽  
Qiong Fan ◽  
Hua-Xiang Lai
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