Miniature bulge test and energy release rate in HIPed aluminum/aluminum interfacial fracture

2018 ◽  
Vol 120 ◽  
pp. 179-198 ◽  
Author(s):  
C. Liu ◽  
M.L. Lovato ◽  
K.D. Clarke ◽  
D.J. Alexander ◽  
W.R. Blumenthal
Keyword(s):  
Energy Release Rate ◽  
Energy Release ◽  
Release Rate ◽  
Interfacial Fracture ◽  
Bulge Test

scholarly journals Effect of Substrate Compliance on Measuring Delamination Properties of Elastic Thin Foil

2018 ◽  
Vol 85 (5) ◽  
Author(s):  
C. Liu
Keyword(s):  
Energy Release Rate ◽  
Energy Release ◽  
Release Rate ◽  
Model Problem ◽  
Hot Isostatic Pressing ◽  
Interfacial Crack ◽  
Interfacial Strength ◽  
Thin Foil ◽  
Bulge Test ◽  
Thin Elastic Plate

Through the analysis of a model problem, a thin elastic plate bonded to an elastic foundation, we address several issues related to the miniature bulge test for measuring the energy-release rate associated with the interfacial fracture of a bimaterial system, where one of the constituents is a thin foil. These issues include the effect of the substrate compliance on the interpretation of the energy release rate, interfacial strength, and the identification of the boundary of the deforming bulge or the location of the interfacial crack front. The analysis also suggests a way for measuring the so-called foundation modulus, which characterizes the property of the substrate. An experimental example, a stainless steel thin foil bonded to an aluminum substrate through hot-isostatic-pressing (HIP), is used to illustrate and highlight some of the conclusions of the model analysis.

Adhesion Thin Ductile Films Using Stressed Overlayers and Nanoindentation

2002 ◽  
Vol 750 ◽  
Author(s):  
M. J. Cordill ◽  
N. R. Moody ◽  
D. F. Bahr
Keyword(s):  
Fracture Toughness ◽  
Silicon Dioxide ◽  
Energy Release Rate ◽  
Fracture Energy ◽  
Energy Release ◽  
Release Rate ◽  
Pure Shear ◽  
Interfacial Fracture ◽  
Shear Mode ◽  
Interfacial Fracture Toughness

ABSTRACTDifferently stressed films of tungsten on silicon dioxide have been studied to determine the interfacial fracture toughness and the Mode I fracture energy release rate of tungsten on glass. Tungsten films with a low compressive stress (less than 1GPa) had nanoindentation tests performed on them to induce buckling. Using mechanics based models and the dimensions of the buckles the fracture energy release rate and the phase angle of loading (Ψ) were calculated to be between 3.8 and 13 J/m2. By varying the residual stress in the film it was possible to examine regions of pure shear (Mode II) interfacial fracture as well as mixed mode interfacial fracture toughness of this system. A similar tungsten film was then used as stressed overlayer on sputtered Pt films on silicon dioxide to determine the fracture energy release rate. Nanoindentation was required to induce buckling, as the overlayer alone did not cause spontaneous buckling. The stressed overlayer method and nanoindentation were used to determine the interfacial toughness of the Pt/silica system to be 1.4 J/m2.

Modeling of Interfacial Delamination in Plastic IC Packages Under Hygrothermal Loading

2004 ◽  
Vol 127 (3) ◽  
pp. 268-275 ◽  
Author(s):  
Andrew A. O. Tay
Keyword(s):  
Fracture Mechanics ◽  
Energy Release Rate ◽  
Energy Release ◽  
Release Rate ◽  
Integrated Circuit ◽  
Thermal Stresses ◽  
Strain Energy Release ◽  
Interfacial Fracture ◽  
Combined Effects ◽  
Interfacial Fracture Mechanics

Ever since the discovery of the “popcorn” failure of plastic-encapsulated integrated-circuit (IC) packages in the 1980s, much effort has been devoted to understanding the failure mechanism and modeling it. It has been established that such failures are due to the combined effects of thermal stresses and hygrostresses that arise during solder reflow of plastic IC packages. In recent years interfacial fracture mechanics has been applied successfully to the analysis of delamination or crack propagation along interfaces in plastic IC packages. This paper presents some fundamental aspects of interfacial fracture mechanics and describes some of the numerical techniques available for calculating the strain energy release rate and mode mixity at the tips of cracks at interfaces in plastic-encapsulated IC packages. A method of calculating the combined effects of thermal stress and hygrostress on the energy release rate is also described. Some case studies are presented that illustrate how the techniques are applied to predicting delaminaton in IC packages. Some experimental verification of predictive methodology is also presented.

Calculating Energy Release Rate as a Function of Crack Length Using a Multiple-Step Crack Closure Technique in Tire Finite Element Models

2018 ◽  
Vol 46 (3) ◽  
pp. 130-152
Author(s):  
Dennis S. Kelliher
Keyword(s):  
Finite Element ◽  
Energy Release Rate ◽  
Crack Length ◽  
Energy Release ◽  
Crack Closure ◽  
Release Rate ◽  
Fatigue Behavior ◽  
Three Dimensions ◽  
Quantitative Prediction ◽  
Closure Technique

ABSTRACT When performing predictive durability analyses on tires using finite element methods, it is generally recognized that energy release rate (ERR) is the best measure by which to characterize the fatigue behavior of rubber. By addressing actual cracks in a simulation geometry, ERR provides a more appropriate durability criterion than the strain energy density (SED) of geometries without cracks. If determined as a function of crack length and loading history, and augmented with material crack growth properties, ERR allows for a quantitative prediction of fatigue life. Complications arise, however, from extra steps required to implement the calculation of ERR within the analysis process. This article presents an overview and some details of a method to perform such analyses. The method involves a preprocessing step that automates the creation of a ribbon crack within an axisymmetric-geometry finite element model at a predetermined location. After inflating and expanding to three dimensions to fully load the tire against a surface, full ribbon sections of the crack are then incrementally closed through multiple solution steps, finally achieving complete closure. A postprocessing step is developed to determine ERR as a function of crack length from this enforced crack closure technique. This includes an innovative approach to calculating ERR as the crack length approaches zero.

scholarly journals Effect of the Characteristic Size and Content of Graphene on the Crack Propagation Path of Alumina/Graphene Composite Ceramics

Materials ◽  
2021 ◽  
Vol 14 (3) ◽  
pp. 611
Author(s):  
Benshuai Chen ◽  
Guangchun Xiao ◽  
Mingdong Yi ◽  
Jingjie Zhang ◽  
Tingting Zhou ◽  
...  
Keyword(s):  
Crack Propagation ◽  
Energy Release Rate ◽  
Energy Release ◽  
Release Rate ◽  
Volume Content ◽  
Phase Interface ◽  
Average Energy ◽  
Characteristic Size ◽  
Composite Ceramics ◽  
Graphene Composite

In this paper, the Voronoimosaic model and the cohesive element method were used to simulate crack propagation in the microstructure of alumina/graphene composite ceramic tool materials. The effects of graphene characteristic size and volume content on the crack propagation behavior of microstructure model of alumina/graphene composite ceramics under different interfacial bonding strength were studied. When the phase interface is weak, the average energy release rate is the highest as the short diameter of graphene is 10–50 nm and the long diameter is 1600–2000 nm. When the phase interface is strong, the average energy release rate is the highest as the short diameter of graphene is 50–100 nm and the long diameter is 800–1200 nm. When the volume content of graphene is 0.50 vol.%, the average energy release rate reaches the maximum. When the velocity load is 0.005 m s−1, the simulation result is convergent. It is proven that the simulation results are in good agreement with the experimental phenomena.

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