Microstructure, electrical and mechanical properties of Ti2AlN MAX phase reinforced copper matrix composites processed by hot pressing

2021 ◽  
Vol 171 ◽  
pp. 110812
Author(s):  
C. Salvo ◽  
E. Chicardi ◽  
J. Hernández-Saz ◽  
C. Aguilar ◽  
P. Gnanaprakasam ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Hot Pressing ◽  
Copper Matrix ◽  
Max Phase ◽  
Matrix Composites ◽  
Copper Matrix Composites

scholarly journals Enhanced mechanical properties and wear resistance of cold-rolled carbon nanotubes reinforced copper matrix composites

2020 ◽  
Vol 7 (1) ◽  
pp. 015069
Author(s):  
Luong Van Duong ◽  
Nguyen Van Luan ◽  
Nguyen Ngoc Anh ◽  
Tran Bao Trung ◽  
Le Danh Chung ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Carbon Nanotubes ◽  
Wear Resistance ◽  
Copper Matrix ◽  
Matrix Composites ◽  
Copper Matrix Composites ◽  
Cold Rolled

Electrical Behavior of SiCp Reinforced Copper Matrix Composites by Hot Pressing

2009 ◽  
Vol 79-82 ◽  
pp. 1579-1582
Author(s):  
Chang Chun Wang ◽  
Guang Hui Min ◽  
Suk Bong Kang
Keyword(s):  
Electrical Conductivity ◽  
Hot Pressing ◽  
Coating Layer ◽  
Annealing Treatment ◽  
Copper Matrix ◽  
Matrix Composites ◽  
Copper Matrix Composites ◽  
Conducting Property ◽  
Reinforcement Content ◽  
Electrical Conducting

SiCp reinforced copper matrix composites with the reinforcement content of 30-50vol. % were fabricated by hot pressing using Cu-coated and uncoated SiC powder. And the microstructure and electrical conductivity of the composites were also studied. The results showed that with the increasing of SiCp particle size, the electrical conductivity of the composites also increased. And the oxides in the composites can decrease the electrical conductivity of the composites obviously. The electrical conducting property of the composites can be improved by the copper coating layer and suitable annealing treatment. It provided important data for the application of SiCp/Cu composites as electronic packaging materials.

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