Plate-like cell growth during directional solidification of a Zn–20wt%Sn high-temperature lead-free solder alloy

Materials Science and Engineering B ◽

10.1016/j.mseb.2013.11.016 ◽

2014 ◽

Vol 182 ◽

pp. 29-36 ◽

Author(s):

Washington L.R. Santos ◽

Crystopher Brito ◽

José M.V. Quaresma ◽

José E. Spinelli ◽

Amauri Garcia

Keyword(s):

High Temperature ◽

Cell Growth ◽

Directional Solidification ◽

Solder Alloy ◽

Lead Free ◽

Lead Free Solder ◽

Lead Free Solder Alloy ◽

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Effect of Addition of Trace Ni and Ge into Sn-Sb-Ag High Temperature Lead-free Solder Alloy on its Mechanical Properties

Journal of Smart Processing ◽

10.7791/jspmee.9.133 ◽

2019 ◽

Vol 9 (3) ◽

pp. 133-139

Author(s):

Kohei MITSUI ◽

Ikuo SHOHJI ◽

Tatsuya KOBAYASHI ◽

Hirohiko WATANABE

Keyword(s):

Mechanical Properties ◽

High Temperature ◽

Solder Alloy ◽

Lead Free ◽

Lead Free Solder ◽

Lead Free Solder Alloy ◽

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Effect of rare earth Ce on the thermal behavior, microstructure and mechanical properties of Zn–30Sn–2Cu high temperature lead-free solder alloy

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-020-04196-8 ◽

2020 ◽

Vol 31 (19) ◽

pp. 16437-16447

Author(s):

Xianwei Zeng ◽

Yichi Liu ◽

Jiankang Zhang ◽

Yi Liu ◽

Xiaowu Hu ◽

...

Keyword(s):

Mechanical Properties ◽

High Temperature ◽

Thermal Behavior ◽

Solder Alloy ◽

Lead Free ◽

Lead Free Solder ◽

Microstructure And Mechanical Properties ◽

Lead Free Solder Alloy ◽

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Effective acquisition of elastoplastic and creep parameters of lead-free solder alloy from high-temperature micro-indentation eliminating the size effect

Mechanics of Materials ◽

10.1016/j.mechmat.2021.103985 ◽

2021 ◽

pp. 103985

Author(s):

Gesheng Xiao ◽

Yuhong Ma ◽

Xinkuo Ji ◽

Tiejun Wang ◽

Xuefeng Shu ◽

...

Keyword(s):

High Temperature ◽

Size Effect ◽

Solder Alloy ◽

Lead Free ◽

Lead Free Solder ◽

Lead Free Solder Alloy ◽

Free Solder ◽

Micro Indentation

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Effects of aluminum addition (x = 0–1 wt%) on the thermal behavior, microstructure and mechanical properties of Zn–30Sn high temperature lead-free solder alloy

Materials Research Express ◽

10.1088/2053-1591/ab24f2 ◽

2019 ◽

Vol 6 (8) ◽

pp. 0865d8

Author(s):

Jiayin Li ◽

Xiaowu Hu ◽

Xudong Zhang ◽

Qinglin Li

Keyword(s):

Mechanical Properties ◽

High Temperature ◽

Thermal Behavior ◽

Solder Alloy ◽

Lead Free ◽

Lead Free Solder ◽

Aluminum Addition ◽

Microstructure And Mechanical Properties ◽

Lead Free Solder Alloy ◽

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Effect of Cooling Rate on the Microstructure, Mechanical Properties, and Creep Resistance of a Cast Zn-Al-Mg High-temperature Lead-Free Solder Alloy

Harsh Environment Electronics ◽

10.1002/9783527813964.ch4 ◽

2019 ◽

pp. 91-114

Author(s):

Reza Mahmudi ◽

Davood Farasheh ◽

Seyyed S. Biriaie

Keyword(s):

Mechanical Properties ◽

High Temperature ◽

Cooling Rate ◽

Solder Alloy ◽

Creep Resistance ◽

Lead Free ◽

Lead Free Solder ◽

Lead Free Solder Alloy ◽

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Microstructure and tensile properties of Sn–1Cu lead-free solder alloy produced by directional solidification

Materials Science and Engineering A ◽

10.1016/j.msea.2012.07.073 ◽

2012 ◽

Vol 556 ◽

pp. 816-823 ◽

Author(s):

Xiaowu Hu ◽

Wenjing Chen ◽

Bin Wu

Keyword(s):

Tensile Properties ◽

Directional Solidification ◽

Solder Alloy ◽

Lead Free ◽

Lead Free Solder ◽

Lead Free Solder Alloy ◽

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Test method for erosion of wave soldering equipment using molten lead-free solder alloy

10.3403/30250507 ◽

2013 ◽

Keyword(s):

Solder Alloy ◽

Test Method ◽

Lead Free ◽

Lead Free Solder ◽

Wave Soldering ◽

Lead Free Solder Alloy ◽

Molten Lead ◽

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A review: Effect of nanoparticles addition on the properties of Sn-Ag-Cu lead free solder alloy

10.1063/5.0052172 ◽

2021 ◽

Author(s):

M. N. Ervina Efzan ◽

M. M. Nur Haslinda ◽

M. M. Al Bakri Abdullah

Keyword(s):

Solder Alloy ◽

Lead Free ◽

Lead Free Solder ◽

Lead Free Solder Alloy ◽

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Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

Fatigue & Fracture of Engineering Materials & Structures ◽

10.1111/ffe.13313 ◽

2020 ◽

Vol 43 (12) ◽

pp. 2883-2891

Author(s):

Q.B. Tao ◽

L. Benabou ◽

Van Nhat Le ◽

Ngoc Anh Thi Nguyen ◽

Hung Nguyen‐Xuan

Keyword(s):

Solder Alloy ◽

Lead Free ◽

Lead Free Solder ◽

Temperature Dependent ◽

Lead Free Solder Alloy ◽

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Enhancement of solder properties of Sn-9Zn lead-free solder alloy

Crystal Research and Technology ◽

10.1002/crat.200610751 ◽

2006 ◽

Vol 41 (12) ◽

pp. 1210-1213 ◽

Author(s):

M. Kamal ◽

E. S. Gouda

Keyword(s):

Solder Alloy ◽

Lead Free ◽

Lead Free Solder ◽

Lead Free Solder Alloy ◽

Download Full-text