scholarly journals Effects of material properties on mechanical performance of Nitinol stent designed for femoral artery: Finite element analysis

2012 ◽  
Vol 19 (6) ◽  
pp. 1564-1571 ◽  
Author(s):  
F. Nematzadeh ◽  
S.K. Sadrnezhaad
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Femoral Artery ◽  
Material Properties ◽  
Mechanical Performance ◽  
Element Analysis ◽  
Nitinol Stent

Effect of Material Properties on the Mechanical Performance of Nitinol Esophageal Stent: Finite Element Analysis

2013 ◽  
Vol 773-774 ◽  
pp. 9-17
Author(s):  
Fardin Nematzadeh ◽  
Sayed Khatiboleslam Sadrnezhaad ◽  
A.H. Kokabi ◽  
M. Razani ◽  
A.H. Mohagheghi
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Material Properties ◽  
Mechanical Performance ◽  
Gastrointestinal Diseases ◽  
Clinical Applications ◽  
Main Approach ◽  
Element Analysis ◽  
Nitinol Wire ◽  
Element Simulation

Stent placement has been a main approach to treat gastrointestinal diseases during past decade. Nitinol superelastic stents have been considered as a solution to such difficulties as restenosis after implantation, low twisting ability, inadequate radial mechanical strength and inappropriate dynamic behaviors associated with the ducts. In this paper, effects of Aftemperatures on mechanical performance of z-shaped Nitinol wire stent under crimping test for clinical applications are investigated by finite element simulation. Having 60% crimping and high radial resistive strength, favorable superelastic behaviors are attained at Aftemperature of 22°C. The performance of the stent is seen to be drastically different with a mere change of 1° in the segments angle.

scholarly journals On the Design of a Biodegradable POC-HA Polymeric Cardiovascular Stent

2012 ◽  
Author(s):  
Joonas Ponkala ◽  
Mohsin Rizwan ◽  
Panos S. Shiakolas
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Material Properties ◽  
Three Dimensional ◽  
Polymeric Composite ◽  
Coronary Stent ◽  
Element Analysis ◽  
Material Models ◽  
Solid Models ◽  
Biodegradable Stents

The current state of the art in coronary stent technology, tubular structures used to keep the lumen open, is mainly populated by metallic stents coated with certain drugs to increase biocompatibility, even though experimental biodegradable stents have appeared in the horizon. Biodegradable polymeric stent design necessitates accurate characterization of time dependent polymer material properties and mechanical behavior for analysis and optimization. This manuscript presents the process for evaluating material properties for biodegradable biocompatible polymeric composite poly(diol citrate) hydroxyapatite (POC-HA), approaches for identifying material models and three dimensional solid models for finite element analysis and fabrication of a stent. The developed material models were utilized in a nonlinear finite element analysis to evaluate the suitability of the POC-HA material for coronary stent application. In addition, the advantages of using femtosecond laser machining to fabricate the POC-HA stent are discussed showing a machined stent. The methodology presented with additional steps can be applied in the development of a biocompatible and biodegradable polymeric stents.

scholarly journals Finite Element Analysis on Behavior of Reinforced Hollow High Strength Concrete Filled Square Steel Tube Short Columns under Axial Compression

2021 ◽  
Vol 2101 (1) ◽  
pp. 012059
Author(s):  
Z J Yang ◽  
X Li ◽  
G C Li ◽  
S C Peng
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
High Strength Concrete ◽  
Mechanical Performance ◽  
Concrete Strength ◽  
High Strength ◽  
Steel Tube ◽  
Element Analysis ◽  
Steel Strength ◽  
Square Steel Tube

Abstract Hollow concrete-filled steel tubular (CFST) member is mainly adopted in power transmission and transformation structures, but when it is used in the superstructure with complex stress, the hollow CFST member has a low bearing capacity and is prone to brittle failure. To improve the mechanical performance of hollow CFST members, a new type of reinforced hollow high strength concrete-filled square steel tube (RHCFSST) was proposed, and its axial compression performance was researched. 18 finite element analysis (FEA) models of axially loaded RHCFSST stub columns were established through FEA software ABAQUS. The whole stress process of composite columns was studied, and parametric studies were carried out to analyze the mechanical performance of the member. Parameters of the steel strength, steel ratio, deformed bar and sandwich concrete strength were varied. Based on the simulation results, the stress process of members can be divided into four stages: elastic stage, elastoplastic stage, descending stage and gentle stage. With the increase of steel strength, steel ratio, the strength of sandwich concrete and the addition of deformed bars, the ultimate bearing capacity of members also increases. Additionally, the increment of those parameters will improve the ductility of the member, except for the sandwich concrete strength.

Warpage Simulation During Fan-Out Wafer-Level Packaging Process with Uncertainty of Material Properties

2021 ◽  
Vol 21 (5) ◽  
pp. 2987-2991
Author(s):  
Geumtaek Kim ◽  
Daeil Kwon
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Material Properties ◽  
Coefficient Of Thermal Expansion ◽  
Input Output ◽  
Wafer Level ◽  
High Input ◽  
Element Analysis ◽  
Packaging Process ◽  
Wafer Level Packaging

Along with the reduction in semiconductor chip size and enhanced performance of electronic devices, high input/output density is a desired factor in the electronics industry. To satisfy the high input/output density, fan-out wafer-level packaging has attracted significant attention. While fan-out wafer-level packaging has several advantages, such as lower thickness and better thermal resistance, warpage is one of the major challenges of the fan-out wafer-level packaging process to be minimized. There have been many studies investigating the effects of material properties and package design on warpage using finite element analysis. Current warpage simulations using finite element analysis have been routinely conducted with deterministic input parameters, although the parameter values are uncertain from the manufacturing point of view. This assumption may lead to a gap between the simulation and the field results. This paper presents an uncertainty analysis of wafer warpage in fan-out wafer-level packaging by using finite element analysis. Coefficient of thermal expansion of silicon is considered as a parameter with uncertainty. The warpage and the von Mises stress are calculated and compared with and without uncertainty.

Sign in / Sign up

Export Citation Format

Share Document