Transient thermal stress analysis for a circumferentially cracked hollow cylinder based on memory-dependent heat conduction model

2018 ◽  
Vol 96 ◽  
pp. 123-133 ◽  
Author(s):  
Zhang-Na Xue ◽  
Zeng-Tao Chen ◽  
Xiao-Geng Tian
Keyword(s):  
Heat Conduction ◽  
Thermal Stress ◽  
Stress Analysis ◽  
Hollow Cylinder ◽  
Conduction Model ◽  
Thermal Stress Analysis ◽  
Heat Conduction Model ◽  
Transient Thermal Stress ◽  
Transient Thermal

Transient thermal stress analysis of multilayered hollow cylinder

2001 ◽  
Vol 151 (1-2) ◽  
pp. 75-88 ◽  
Author(s):  
Z. -Y. Lee ◽  
C. K. Chen ◽  
C. -I. Hung
Keyword(s):  
Thermal Stress ◽  
Stress Analysis ◽  
Hollow Cylinder ◽  
Thermal Stress Analysis ◽  
Transient Thermal Stress ◽  
Transient Thermal
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