Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints

2010 ◽  
Vol 26 (8) ◽  
pp. 737-742 ◽  
Author(s):  
X.J. Wang ◽  
Q.L. Zeng ◽  
Q.S. Zhu ◽  
Z.G. Wang ◽  
J.K. Shang
Keyword(s):  
Solder Joints ◽  
Shear Properties ◽  
Current Stressing

scholarly journals Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Jianguo Cui ◽  
Keke Zhang ◽  
Di Zhao ◽  
Yibo Pan
Keyword(s):  
Shear Strength ◽  
Thermal Cycling ◽  
Solder Joints ◽  
High Reliability ◽  
Sharp Decrease ◽  
Thermal Shock Test ◽  
Shear Properties ◽  
Equivalent Time ◽  
Ultrasonic Assisted ◽  
Reliability Of Solder Joints

AbstractThrough ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu (x = 0, 0.05, 0.1) soldering test and − 40 to 125 °C thermal shock test, the microstructure and shear properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS and XRD. The results show that the Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints with high quality and high reliability can be obtained by ultrasonic assistance. When the ultrasonic vibration power is 88 W, the ultrasonic-assisted Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints exhibits the optimized performance. During the thermal cycling process, the shear strength of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had a linear relationship with the thickness of interfacial intermetallic compound (IMC). Under the thermal cycling, the interfacial IMC layer of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints consisted of (Cu,Ni)6Sn5 and Cu3Sn. The thickness of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints was linearly related to the square root of equivalent time. The growth of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had an incubation period, and the growth of IMC was slow within 300 cycles. And after 300 cycles, the IMC grew rapidly, the granular IMC began to merge, and the thickness and roughness of IMC increased obviously, which led to a sharp decrease in the shear strength of the solder joints. The 0.05 wt% Ni could inhibit the excessive growth of IMC, improve the shear strength of solder joints and improve the reliability of solder joints. The fracture mechanism of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints changed from the ductile–brittle mixed fracture in the solder/IMC transition zone to the brittle fracture in the interfacial IMC.

In-situ observation of material migration in flip-chip solder joints under current stressing

2006 ◽  
Vol 35 (10) ◽  
pp. 1781-1786 ◽  
Author(s):  
C. M. Tsai ◽  
Yi-Shao Lai ◽  
Y. L. Lin ◽  
C. W. Chang ◽  
C. R. Kao
Keyword(s):  
Flip Chip ◽  
Solder Joints ◽  
In Situ Observation ◽  
Current Stressing ◽  
Material Migration

In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing

2005 ◽  
Vol 53 (7) ◽  
pp. 2029-2035 ◽  
Author(s):  
Y.H. Lin ◽  
Y.C. Hu ◽  
C.M. Tsai ◽  
C.R. Kao ◽  
K.N. Tu
Keyword(s):  
Solder Joints ◽  
Void Formation ◽  
Propagation Mechanism ◽  
In Situ Observation ◽  
Current Stressing

Effects of Current Stressing and Isothermal Aging on the Tensile Strength of Microscale Lead-Free Solder Joints with Different Joint Volumes

2013 ◽  
Vol 634-638 ◽  
pp. 2800-2803 ◽  
Author(s):  
Li Meng Yin ◽  
Yan Fei Geng ◽  
Zhang Liang Xu ◽  
Song Wei
Keyword(s):  
Tensile Strength ◽  
Current Density ◽  
Isothermal Aging ◽  
Solder Joints ◽  
High Current Density ◽  
Copper Wire ◽  
Lead Free ◽  
Lead Free Solder ◽  
Current Stressing ◽  
Free Solder

Adopting an accurate micro-tensile method based on dynamic mechanical analyzer (DMA) instrument, the tensile strength of three kinds of copper-wire/solder/copper-wire sandwich structured microscale lead-free solder joints that underwent current stressing with a direct current density of 1.0×104 A/cm2 and loading time of 48 hours were investigated, and compared with those solder joints isothermal aged at 100 0C for 48 hours and as-reflowed condition. These three kinds of microscale columnar solder joints have different volumes, i.e., a same diameter of 300 μm but different heights of 100 μm, 200 μm and 300 μm. Experimental results show that both current stressing and isothermal aging degrades the tensile strength of microscale solder joints, and the solder joint with smaller volume obtains higher tensile strength under same test condition. In addition, current stressing induces obvious electromigration (EM) issue under high current density of 1.0×104 A/cm2, resulting in the decreasing of tensile strength and different fracture position, mode and surface morphology of microscale solder joints. The degree of strength degradation increases with the increasing of joint height when keep joint diameter constant, this is mainly due to that electromigration leads to voids form and grow at the interface of cathode, and solder joints with larger volume may contains more soldering defects as well.

Effects of electromigration on the growth of intermetallic compounds in Cu/SnBi/Cu solder joints

2008 ◽  
Vol 23 (10) ◽  
pp. 2591-2596 ◽  
Author(s):  
X. Gu ◽  
D. Yang ◽  
Y.C. Chan ◽  
B.Y. Wu
Keyword(s):  
Activation Energy ◽  
Solder Joint ◽  
Intermetallic Compounds ◽  
Direct Current ◽  
Solder Joints ◽  
Cathode Side ◽  
Anode Side ◽  
Kinetics Parameters ◽  
Ambient Temperatures ◽  
Current Stressing

In this study, the effects of electromigration (EM) on the growth of Cu–Sn intermetallic compounds (IMCs) in Cu/SnBi/Cu solder joints under 5 × 103 A/cm2 direct current stressing at 308, 328, and 348 K were investigated. For each Cu/SnBi/Cu solder joint under current stressing, the IMCs at the cathode side grew faster than that at the anode side. The growth of these IMCs at the anode side and the cathode side were enhanced by electric current. The growth of these IMCs at the cathode followed a parabolic growth law. The kinetics parameters of the growth of the IMCs were calculated from the thickness data of the IMCs at the cathode side at different ambient temperatures. The calculated intrinsic diffusivity (D0) of the Cu–Sn IMCs was 9.91 × 10−5 m2/s, and the activation energy of the growth of the total Cu–Sn IMC layer was 89.2 kJ/mol (0.92 eV).

Sign in / Sign up

Export Citation Format

Share Document