Endicott Biofuels LLC and Davy Process Technology Ltd enter into a technical collaboration to build next generation biodiesel facilities in the US

2008 ◽  
Vol 2008 (7) ◽  
pp. 3
Keyword(s):  
Next Generation ◽  
Process Technology ◽  
The Us ◽  
Technical Collaboration

Reliability Performance of 1200 V and 1700 V 4H-SiC DMOSFETs for Next Generation Power Conversion Applications

2014 ◽  
Vol 778-780 ◽  
pp. 967-970 ◽  
Author(s):  
Donald A. Gajewski ◽  
Sei Hyung Ryu ◽  
Mrinal Das ◽  
Brett Hull ◽  
Jonathan Young ◽  
...  
Keyword(s):  
Wide Bandgap ◽  
Large Sample Size ◽  
Next Generation ◽  
Process Technology ◽  
Power Switching ◽  
Comprehensive Reliability ◽  
Reliability Performance ◽  
Acceptance Tests ◽  
Frequency Power

We present new reliability results on the Cree, Inc., 4H-SiC, DMOSFET devices. The Cree DMOSFETs were developed to meet the demand of next-generation, high-frequency power switching applications, such as: dc-ac inversion, dc-dc conversion, and ac-dc rectification, with continually improving energy efficiency. The Cree Generation 2 DMOSFET process technology is now commercially available with 1200 V and 1700 V ratings. We have performed intrinsic reliability studies to ensure excellent wear-out performance and long field lifetime of the products. We have also performed large sample size qualification reliability acceptance tests to ensure the quality of the manufacturing and packaging processes. These comprehensive reliability studies establish new benchmarks for wide bandgap transistors and demonstrate that Crees MOSFETs meet or exceed all industrial reliability requirements. This achievement facilitates broad market adoption of this disruptive power switch technology.

scholarly journals Deconstructing legitimized racism on Haida Gwaii

2021 ◽  
pp. 117718012110383
Author(s):  
Michaela M McGuire
Keyword(s):  
Self Determination ◽  
Next Generation ◽  
Haida Gwaii ◽  
Integral Component ◽  
Critical Commentary ◽  
The Us

In this critical commentary, I examine the manifestation of racial tensions on Haida Gwaii—an archipelago in what is now known as Canada—between settlers and citizens of the Haida Nation. Racism has been entrenched and legitimized over generations leaving its implications unquestioned. When settler communities border colonially imposed reserves, racialized boundaries and tensions result. Indigenous claims to the land and to self-determination call into question the legitimacy of colonialism and subsequently reinforce the us versus them mentality. The assertion of Haida Nationhood and self-determination disrupts the rhetoric of settler superiority. Haida peoples are deemed a threat needing to be controlled. Challenging racialized hierarchies, settler complacency, and racism in all its manifestations is an integral component to ensuring that the next generation of Haida citizens can live freely without fear of the pain of racism, ignorance, and shame.

A Brief Review of Models Representing Creep of Alloy 617

2005 ◽  
Author(s):  
Robert W. Swindeman ◽  
Michael J. Swindeman ◽  
Weiju Ren
Keyword(s):  
High Temperature ◽  
Nuclear Plant ◽  
Next Generation ◽  
Alloy 617 ◽  
Temperature Range ◽  
Damage Models ◽  
The Us ◽  
Creep Models ◽  
High Temperature Gas

Alloy 617 is being considered for the construction of components to operate in the Next Generation Nuclear Plant (NGNP). Service temperatures will range from 650 to 1000°C. To meet the needs of the conceptual designers of this plant, a materials handbook is being developed that will provide information on alloy 617, as well as other materials of interest. The database for alloy 617 to be incorporated into the handbook was produced in the 1970s and 1980s, while creep and damage models were developed from the database for use in the design of high-temperature gas-cooled reactors. In the work reported here, the US database and creep models are briefly reviewed. The work reported represents progress toward a useful model of the behavior of this material in the temperature range of 650 to 1000°C.

Optical Fault Isolation and Nanoprobing Techniques for the 10 nm Technology Node and Beyond

2015 ◽  
Author(s):  
Martin von Haartman ◽  
Samia Rahman ◽  
Satyaki Ganguly ◽  
Jai Verma ◽  
Ahmad Umair ◽  
...  
Keyword(s):  
Process Development ◽  
State Of The Art ◽  
Fault Isolation ◽  
Generation Process ◽  
Next Generation ◽  
Process Technology ◽  
Technology Node ◽  
Test Chips ◽  
Semiconductor Process

Abstract Resolution of optical fault isolation (FI) and nanoprobing tools needs to keep pace with the device downscaling to be effective for semiconductor process development. In this paper we present and discuss state-of-the-art FI and nanoprobing techniques evaluated on Intel test-chips fabricated on next generation process technology. Promising results were obtained but further improvements are necessary for the 7nm node and beyond.

Study Photo Imagable dielectric (PID) and non-PID on process, fabrication and reliability by using panel glass substrate for next generation interconnection

2019 ◽  
Vol 2019 (1) ◽  
pp. 000216-000222
Author(s):  
Chun-Hsien Chien ◽  
Chien-Chou Chen ◽  
Wen-Liang Yeh ◽  
Wei-Ti Lin ◽  
Cheng-Hui Wu ◽  
...  
Keyword(s):  
Stress Test ◽  
Dielectric Materials ◽  
Circuit Board ◽  
Strip Line ◽  
Organic Substrates ◽  
Next Generation ◽  
Glass Panel ◽  
Process Technology ◽  
Fine Line ◽  
Ic Foundry

Abstract In 1965, Gordon E. Moore, the co-founder of Intel stated that numbers of transistors on a chip will double every 18 months and his theory called the Moore's Law. The law had been the guiding principle of chip design over 50 years. The technology dimension is scaling very aggressively in IC foundry. For example, TSMC announced their 5nm Fin Field-Effect Transistor (FinFET) process technology is optimized for both mobile and high performance computing applications. It is scheduled to start risk production in the second half of 2019.[1] To overview the semiconductor supply chain included IC foundry, wafer bumping, IC carrier, PCB (Printed circuit board) and OSAT (oversea assembly and testing)… etc., the IC carrier and PCB technology dimension scaling are far behind than the IC foundry since many reasons for the traditional industry. The industry needs different kinds of breakthrough approaches for the scaling of via and strip line in next generation interconnection. Traditional organic substrates faces many challenges of warpage, surface roughness and material dimension stability issues for manufacturing and high density I/Os with very fine line interconnections. To breakthrough these challenges, the materials of glass carrier, new photo-imagable dielectric (PID) and advanced equipment were evaluated for the fine line and fine via interconnection. In the papers, there are many PID and non-PID materials were surveyed and compared for fine via (< 10μm) interconnection or low loss of high frequency application. The first candidate was chosen for redistribution layers (RDL) fabrication by using 370mm × 470mm glass panels. Semi additive process (SAP) was used for direct metallization on glass panel with different build-up dielectric materials to form daisy chain test vehicles. The process, fabrication integration and electrical measurement results of daisy chain showed good continuity and electric resistance in the glass panel substrate. The reliability of the thermal cycling test (TCT) and highly accelerated stress test (HAST) were evaluated as well in this study.

Preparing the Next Generation of Innovators through Collaboration

2010 ◽  
pp. 67-81
Author(s):  
Marjorie Darrah ◽  
Angela Dowling
Keyword(s):  
21St Century ◽  
Global Economy ◽  
Business Community ◽  
Next Generation ◽  
Positive Evidence ◽  
Leadership Responsibility ◽  
Global Issue ◽  
The Us ◽  
People Skills ◽  
Changing Economy

Every country is challenged to stay competitive in the new global economy. The education system within a country must play a pivotal role in ensuring the next generation is prepared to meet the challenges of the 21st Century workplace. Companies have realized that collaboration is a key competency that will bring success in the global economy. It is necessary that teachers understand the needs of our changing economy and incorporate methods to facilitate collaboration, communication, creativity, leadership, responsibility, self-direction, and people skills. This challenge is a global issue and this chapter discusses the steps the US is taking to ensure that its citizenry remains innovative, how the business community is using collaboration to be competitive, the issues encountered in schools to meet challenges of the 21st Century, and positive evidence that the landscape of education is changing in response to the desperate need to produce the next generation of innovators.

Pharmacy Automation and Technology - What Will the Next Generation of Your Patients Expect and Demand?

2010 ◽  
Vol 45 (4) ◽  
pp. 336-340
Author(s):  
Bill G. Felkey ◽  
Brent I. Fox
Keyword(s):  
Language Barriers ◽  
Next Generation ◽  
The Us ◽  
Us Census

The next US Census is quickly approaching. We have already seen a changing demographic in this country. The changes are more pronounced in some areas, while being less obvious in others. As the US demographics continue to change, how will this impact your institution's relationship with its patients? More important, how might language barriers impact your patients' care? These topics are addressed below.

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