Fabrication of Conductive Copper Films on Flexible Polymer Substrates by Low-Temperature Sintering of Composite Cu Ink in Air

ABSTRACTDeposition of solution-processed functional materials generally requires additional post-processing to optimize the functionality of the material. We study sintering of Ag nanoparticle (NP) (with average diameter 77nm) deposits for improved electrical conductivity, with emphasis on Argon plasma methods compatible with the low temperature requirements of regular low-cost flexible polymer substrates. The relationship between plasma parameters (such as power and treatment time) versus sintering results (sintered structure depth, film continuity and electrical sheet resistance) will be reported. According to our efforts so far, we have achieved the electrical resistivity of the sintered film at about 20 times greater than the value of bulk silver using a process compatible with the low temperature requirements of common flexible polymer substrates.

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Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions

Scientific Reports ◽

10.1038/srep45150 ◽

2017 ◽

Vol 7 (1) ◽

Cited By ~ 17

Author(s):

Yingqiong Yong ◽

Mai Thanh Nguyen ◽

Hiroki Tsukamoto ◽

Masaki Matsubara ◽

Ying-Chih Liao ◽

...

Keyword(s):

Low Temperature ◽

Copper Films ◽

Low Temperature Sintering ◽

Organic Residues ◽

Complex Particle

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Low-temperature growth of Na doped CIGS films on flexible polymer substrates by pulsed laser ablation from a Na containing target

Surface and Coatings Technology ◽

10.1016/j.surfcoat.2012.06.065 ◽

2013 ◽

Vol 231 ◽

pp. 209-213 ◽

Cited By ~ 20

Author(s):

Chia-Chuan Chen ◽

Xiaoding Qi ◽

Mu-Gong Tsai ◽

Yun-Fang Wu ◽

In-Gann Chen ◽

...

Keyword(s):

Laser Ablation ◽

Low Temperature ◽

Pulsed Laser ◽

Pulsed Laser Ablation ◽

Temperature Growth ◽

Polymer Substrates ◽

Low Temperature Growth ◽

Flexible Polymer

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Low Temperature OFET (Organic Field Effect Transistor) Fabrication by Metal Nanoparticle Imprinting

ASME 2007 InterPACK Conference, Volume 2 ◽

10.1115/ipack2007-33448 ◽

2007 ◽

Author(s):

Seung Hwan Ko ◽

Inkyu Park ◽

Heng Pan ◽

Albert P. Pisano ◽

Costas P. Grigoropoulos

Keyword(s):

Low Temperature ◽

Field Effect ◽

Field Effect Transistor ◽

Metal Nanoparticle ◽

Nano Particles ◽

Organic Field Effect Transistor ◽

Polymer Substrates ◽

Flexible Polymer ◽

Effect Transistor ◽

Transistor Fabrication

The low temperature fabrication of OFET (organic field effect transistor) is presented in this paper. PDMS imprinting mold was used to pattern gold nano-particles suspended in Alpha-Terpineol solvent. After imprinting, nanoparticles was dried and then sintered at plastic compatible low temperature. Finally, air stable semiconductor polymer (modified polythiophene) in dichlorobenzene (o-DCB) solution to fabricate OFETs on flexible polymer substrates. The performance of the transistors were characterized and discussed.

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