Deep Etching of Single- and Polycrystalline Silicon with High Speed, High Aspect Ratio, High Uniformity, and 3D Complexity by Electric Bias-Attenuated Metal-Assisted Chemical Etching (EMaCE)
2014 ◽
Vol 6
(19)
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pp. 16782-16791
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2017 ◽
Vol 16
(4)
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pp. 567-573
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2018 ◽
Vol 28
(5)
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pp. 055006
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2014 ◽
Vol 24
(12)
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pp. 125026
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Keyword(s):
2015 ◽
Vol 4
(9)
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pp. P337-P346
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Keyword(s):
2018 ◽
Vol 29
(21)
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pp. 18178-18178
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Keyword(s):