scholarly journals Microstructure and mechanical properties of lead-free Sn-Cu-Ni composite solder paste reinforced with silicon (Si) particles

2017 ◽  
Author(s):  
R. M. Said ◽  
M. A. A. Mohd Salleh ◽  
M. I. I. Ramli ◽  
N. Saud ◽  
M. M. Al Bakri Abdullah ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Composite Solder ◽  
Lead Free ◽  
Solder Paste ◽  
Microstructure And Mechanical Properties

Synthesis and Characterization of Nano-Composite Lead-Free Solder

2005 ◽  
Vol 23 ◽  
pp. 145-150 ◽  
Author(s):  
D.C. Lin ◽  
C.Y. Kuo ◽  
T.S. Srivatsan ◽  
M. Petraroli ◽  
G.X. Wang
Keyword(s):  
Composite Solder ◽  
Nano Particles ◽  
Lead Free ◽  
Microstructural Development ◽  
Solder Paste ◽  
Second Phases ◽  
Series Of Experiments ◽  
Free Solder ◽  
Particle Reinforced Composite

A series of experiments conducted on a lead-free eutectic solder (Sn-3.5%Ag) have shown that addition of trace amounts of nanometer-sized particles does have an influence on mechanical properties of materials. In this study, three different types of nanoparticles (copper, nickel and iron) were chosen as the reinforcing candidate. For each particulate reinforcement the reflow process was performed under identical cooling conditions. Addition of trace amounts of nano-particles alters the kinetics governing solidification of the composite solder paste while concurrently exerting an influence on microstructural development, particularly the formation and presence of second phases in the solidified end product. The nano-sized powder particle-reinforced composite solder revealed an increase in microhardness compared to the unreinforced monolithic counterpart.

The Effect of Nano-Cu Particles on Mechanical Properties of Micro-Joining Joint with Lead-Free Solder

2011 ◽  
Vol 291-294 ◽  
pp. 929-933
Author(s):  
Ying Ming Shen ◽  
Fang Juan Qi ◽  
Min Xie ◽  
Jian Li
Keyword(s):  
Mechanical Properties ◽  
Solder Joint ◽  
Lead Free ◽  
Fatigue Properties ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Shearing Strength ◽  
Free Solder

The effect of nano-Cu particles on mechanical bend reliability of micro-joining joint with Sn-3.5Ag lead free solder was studied in this paper. The results show that 0.5% nano-Cu composite lead free solder show significantly better shearing strength and mechanical bend fatigue properties than eutectic Sn-3.5Ag solder paste, 1.0% nano-Cu composites and 1.5% nano-Cu composites. The further analysis shows that adding nano-Cu particles make much effect on intermetallic (IMC) in the interface of micro-joint and the inside of the solder joint. The different interface of micro-joining joint induced different mechanical properties.

Influence of milling time on the synthesis, microstructure and mechanical properties of lead-free K0.5Bi0.5TiO3 ceramics

2019 ◽  
Vol 196 (1) ◽  
pp. 105-111 ◽  
Author(s):  
Piotr Czaja ◽  
Jan Suchanicz ◽  
Dariusz Bochenek ◽  
Wojciech Piekarczyk ◽  
Piotr Jeleń ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Milling Time ◽  
Lead Free ◽  
Microstructure And Mechanical Properties
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