Simulation of dual-function speckle interferometry for the measurement of out-of-plane displacement and slope

2021 ◽  
pp. 1-10
Author(s):  
Xing Zhou ◽  
Shuhai Jia ◽  
Hongqiang Yu ◽  
Liming Gao
Keyword(s):  
Speckle Interferometry ◽  
Dual Function ◽  
Out Of Plane ◽  
Plane Displacement

A dual-function ESPI system for the measurement of out-of-plane displacement and slope

2006 ◽  
Vol 44 (6) ◽  
pp. 637-644 ◽  
Author(s):  
B. Bhaduri ◽  
N.K. Mohan ◽  
M.P. Kothiyal
Keyword(s):  
Dual Function ◽  
Out Of Plane ◽  
Plane Displacement

scholarly journals Sensor Integrated Load-Bearing Structures: Measuring Axis Extension with DIC-Based Transducers

Sensors ◽  
2021 ◽  
Vol 21 (12) ◽  
pp. 4104
Author(s):  
Nassr Al-Baradoni ◽  
Peter Groche
Keyword(s):  
Cost Effective ◽  
Image Correlation ◽  
Maximum Deviation ◽  
Single Image ◽  
Eccentric Load ◽  
Load Bearing ◽  
Out Of Plane ◽  
Axis Extension ◽  
Plane Displacement ◽  
Imaging Sensor

In this paper we present a novel, cost-effective camera-based multi-axis force/torque sensor concept for integration into metallic load-bearing structures. A two-part pattern consisting of a directly incident and mirrored light beam is projected onto the imaging sensor surface. This allows the capturing of 3D displacements, occurring due to structure deformation under load in a single image. The displacement of defined features in size and position can be accurately analyzed and determined through digital image correlation (DIC). Validation on a prototype shows good accuracy of the measurement and a unique identification of all in- and out-of-plane displacement components under multiaxial load. Measurements show a maximum deviation related to the maximum measured values between 2.5% and 4.8% for uniaxial loads ( and between 2.5% and 10.43% for combined bending, torsion and axial load. In the course of the investigations, the measurement inaccuracy was partly attributed to the joint used between the sensor parts and the structure as well as to eccentric load.

scholarly journals Locally Corroded Stiffener Effect on Shear Buckling Behaviors of Web Panel in the Plate Girder

2015 ◽  
Vol 2015 ◽  
pp. 1-19 ◽  
Author(s):  
Jungwon Huh ◽  
In-Tae Kim ◽  
Jin-Hee Ahn
Keyword(s):  
Corrosion Damage ◽  
Element Analysis ◽  
Buckling Strength ◽  
Lower Shear ◽  
Out Of Plane ◽  
Shear Buckling ◽  
Buckling Failure ◽  
Plane Displacement ◽  
The Web ◽  
Plate Girder

The shear buckling failure and strength of a web panel stiffened by stiffeners with corrosion damage were examined according to the degree of corrosion of the stiffeners, using the finite element analysis method. For this purpose, a plate girder with a four-panel web girder stiffened by vertical and longitudinal stiffeners was selected, and its deformable behaviors and the principal stress distribution of the web panel at the shear buckling strength of the web were compared after their post-shear buckling behaviors, as well as their out-of-plane displacement, to evaluate the effect of the stiffener in the web panel on the shear buckling failure. Their critical shear buckling load and shear buckling strength were also examined. The FE analyses showed that their typical shear buckling failures were affected by the structural relationship between the web panel and each stiffener in the plate girder, to resist shear buckling of the web panel. Their critical shear buckling loads decreased from 82% to 59%, and their shear buckling strength decreased from 88% to 76%, due to the effect of corrosion of the stiffeners on their shear buckling behavior. Thus, especially in cases with over 40% corrosion damage of the vertical stiffener, they can have lower shear buckling strength than their design level.

Mechanism of the Transition From In-Plane Buckling to Helical Buckling for a Stiff Nanowire on an Elastomeric Substrate

2016 ◽  
Vol 83 (4) ◽  
Author(s):  
Youlong Chen ◽  
Yong Zhu ◽  
Xi Chen ◽  
Yilun Liu
Keyword(s):  
High Performance ◽  
Three Dimensional ◽  
Stretchable Electronics ◽  
Buckling Mode ◽  
Design And Optimization ◽  
Out Of Plane ◽  
Plane Direction ◽  
Plane Displacement ◽  
Helical Buckling ◽  
Selection Of

In this work, the compressive buckling of a nanowire partially bonded to an elastomeric substrate is studied via finite-element method (FEM) simulations and experiments. The buckling profile of the nanowire can be divided into three regimes, i.e., the in-plane buckling, the disordered buckling in the out-of-plane direction, and the helical buckling, depending on the constraint density between the nanowire and the substrate. The selection of the buckling mode depends on the ratio d/h, where d is the distance between adjacent constraint points and h is the helical buckling spacing of a perfectly bonded nanowire. For d/h > 0.5, buckling is in-plane with wavelength λ = 2d. For 0.27 < d/h < 0.5, buckling is disordered with irregular out-of-plane displacement. While, for d/h < 0.27, buckling is helical and the buckling spacing gradually approaches to the theoretical value of a perfectly bonded nanowire. Generally, the in-plane buckling induces smaller strain in the nanowire, but consumes the largest space. Whereas the helical mode induces moderate strain in the nanowire, but takes the smallest space. The study may shed useful insights on the design and optimization of high-performance stretchable electronics and three-dimensional complex nanostructures.

An out-of-plane displacement measurement system based on hardware tracking

2017 ◽  
Author(s):  
Chen Xiong ◽  
Ming Zhang ◽  
Wenxin Hu ◽  
Hong Miao
Keyword(s):  
Measurement System ◽  
Displacement Measurement ◽  
Out Of Plane ◽  
Plane Displacement

Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level

2012 ◽  
Vol 134 (4) ◽  
Author(s):  
D. N. Borza ◽  
I. T. Nistea
Keyword(s):  
Solder Joint ◽  
Fundamental Frequency ◽  
Printed Circuit Board ◽  
Speckle Interferometry ◽  
Circuit Board ◽  
Joint Failure ◽  
Printed Circuit ◽  
Out Of Plane ◽  
Fringe Patterns ◽  
Board Level

Reliability of electronic assemblies at board level and solder joint integrity depend upon the stress applied to the assembly. The stress is often of thermomechanical or of vibrational nature. In both cases, the behavior of the assembly is strongly influenced by the mechanical boundary conditions created by the printed circuit board (PCB) to casing fasteners. In many previously published papers, the conditions imposed to the fasteners are mostly aiming at an increase of the fundamental frequency and a decrease of static or dynamic displacement values characterizing the deformation. These conditions aim at reducing the fatigue in different parts of these assemblies. In the photomechanics laboratory of INSA Rouen, the origins of solder joint failure have been investigated by means of full-field measurements of the flexure deformation induced by vibrations or by forced thermal convection. The measurements were done both at a global level for the whole printed circuit board assembly (PCBA) and at a local level at the solder joints where failure was reported. The experimental technique used was phase-stepped laser speckle interferometry. This technique has a submicrometer sensitivity with respect to out-of-plane deformations induced by bending and its use is completely nonintrusive. Some of the results were comforted by comparison with a numerical finite elements model. The experimental results are presented either as time-average holographic fringe patterns, as in the case of vibrations, or as wrapped phase patterns, as in the case of deformation under thermomechanical stress. Both types of fringe patterns may be processed so as to obtain the explicit out-of-plane static deformation (or vibration amplitude) maps. Experimental results show that the direct cause of solder joint failure may be a high local PCB curvature produced by a supplementary fastening screw intended to reduce displacements and increase fundamental frequency. The curvature is directly responsible for tensile stress appearing in the leads of a large quad flat pack (QFP) component and for shear in the corresponding solder joints. The general principle of increasing the fundamental frequency and decreasing the static or dynamic displacement values has to be checked against the consequences on the PCB curvature near large electronic devices having high stiffness.

Phase-stepping holographic moiré: simultaneous in-plane and out-of-plane displacement measurement

1992 ◽  
Vol 31 (14) ◽  
pp. 2405 ◽  
Author(s):  
Eli Simova Simova ◽  
Krassimir Nedialkov Stoev
Keyword(s):  
Displacement Measurement ◽  
Phase Stepping ◽  
Out Of Plane ◽  
Plane Displacement
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