scholarly journals Characterization of A356 investment cast component produced using controlled liquid metal cooling technique

2018 ◽  
Vol 430 ◽  
pp. 012027
Author(s):  
TF Sishuba ◽  
P Rossouw ◽  
U Curle ◽  
K Mutombo
Keyword(s):  
Liquid Metal ◽  
Investment Cast ◽  
Cast Component ◽  
Liquid Metal Cooling ◽  
Cooling Technique

Effect of growth rate on the tensile properties of DS NiAl/Cr(Mo) eutectic alloy produced by liquid metal cooling technique

2010 ◽  
Vol 18 (3) ◽  
pp. 319-323 ◽  
Author(s):  
Y.C. Liang ◽  
J.T. Guo ◽  
Y. Xie ◽  
L.Y. Sheng ◽  
L.Z. Zhou ◽  
...  
Keyword(s):  
Growth Rate ◽  
Liquid Metal ◽  
Tensile Properties ◽  
Eutectic Alloy ◽  
Liquid Metal Cooling ◽  
Cooling Technique

scholarly journals Microstructural Characterization of Pure Tin Produced by the Drop-on-Demand Technique of Liquid Metal Jetting

2019 ◽  
Vol 50 (9) ◽  
pp. 4000-4005 ◽  
Author(s):  
Yaakov Idell ◽  
Nicholas Watkins ◽  
Andrew Pascall ◽  
Jason Jeffries ◽  
Kerri Blobaum
Keyword(s):  
Liquid Metal ◽  
Microstructural Characterization ◽  
On Demand ◽  
Drop On Demand

Characterization of a Liquid-Metal Micro Droplets Thermal Interface Material

2010 ◽  
Author(s):  
Amer M. Hamdan ◽  
Aric R. McLanahan ◽  
Robert F. Richards ◽  
Cecilia D. Richards
Keyword(s):  
Liquid Metal ◽  
Thermal Resistance ◽  
Contact Resistance ◽  
Applied Load ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Interface Resistance ◽  
Thermal Interface Resistance ◽  
Droplet Array

This work presents the characterization of a thermal interface material consisting of an array of mercury micro droplets deposited on a silicon die. Three arrays were tested, a 40 × 40 array (1600 grid) and two 20 × 20 arrays (400 grid). All arrays were assembled on a 4 × 4 mm2 silicon die. An experimental facility which measures the thermal resistance across the mercury array under steady state conditions is described. The thermal interface resistance of the arrays was characterized as a function of the applied load. A thermal interface resistance as low as 0.253 mm2 K W−1 was measured. A model to predict the thermal resistance of a liquid-metal micro droplet array was developed and compared to the experimental results. The model predicts the deformation of the droplet array under an applied load and then the geometry of the deformed droplets is used to predict the thermal resistance of the array. The contact resistance of the mercury arrays was estimated based on the experimental and model data. An average contact resistance was estimated to be 0.14 mm2 K W−1.

Magnetic Liquid Metal Marble: Characterization of Lyophobicity and Magnetic Manipulation for Switching Applications

2016 ◽  
Vol 25 (6) ◽  
pp. 1050-1057 ◽  
Author(s):  
Jinpyo Jeon ◽  
Jeong-Bong Lee ◽  
Sang Kug Chung ◽  
Daeyoung Kim
Keyword(s):  
Liquid Metal ◽  
Magnetic Liquid ◽  
Magnetic Manipulation

Recent Advancement on Liquid Metal Cooling for Thermal Management of Computer Chip

2010 ◽  
Author(s):  
Jing Liu ◽  
Yue-Guang Deng ◽  
Zhong-Shan Deng
Keyword(s):  
Liquid Metal ◽  
Thermal Management ◽  
New Technology ◽  
Air Cooling ◽  
Liquid Metal Coolant ◽  
Cooling Device ◽  
Chip Cooling ◽  
Cooling Method ◽  
Liquid Metal Cooling ◽  
Metal Coolant

Efficient cooling of a high performance computer chip has been an extremely important however becoming more and more tough issue. The recently invented liquid metal cooling method is expected to pave the way for high flux heat dissipation which is hard to tackle otherwise by many existing conventional cooling strategies. However, as a new thermal management method, its application also raised quite a few challenging fundamental and practical issues for solving. To illustrate the development of the new technology, this talk is dedicated to present an overview on the latest advancements made in the author’s lab in developing the new generation chip cooling device based on the liquid metal coolant with melting point around room temperature. The designing and optimization of the cooling device and component will be discussed. Several major barriers to prevent the new method from practical application such as erosion between liquid metal coolant and its substrate material will be outlined with good solutions clarified. Performance comparison between the new chip cooling method with commercially available products with highest quality such as air cooling, water cooling and heat pipe cooling devices were evaluated. Typical examples of using liquid metal cooling for the thermal management of a real PC or even super computer will be demonstrated. Further, miniaturizations on the prototype device by extending it as a MEMS cooling device or mini/micro channel liquid metal cooling device will also be explained. Along with the development of the hardware, some fundamental heat transfer issues in characterizing the liquid metal cooling device will be discussed through numerical or analytical model. Future challenging issues in pushing the new technology into large scale practices will be raised. From all the outputs obtained so far, it can be clearly seen that the new cooling strategy will find very promising and significant applications in a wide variety of engineering situations whenever thermal managements or heat transport are needed.

Liquid metal cooling issues for fusion and fission

2008 ◽  
Vol 83 (7-9) ◽  
pp. 943-947 ◽  
Author(s):  
H. Horiike ◽  
S. Konishi ◽  
H. Kondo ◽  
A. Yamaguchi
Keyword(s):  
Liquid Metal ◽  
Liquid Metal Cooling

Reliability and safety estimates for fusion reactor liquid metal cooling system

1994 ◽  
Vol 2 (3-4) ◽  
pp. 311-317
Author(s):  
P. Chaika ◽  
V. Danilin ◽  
I. Kirillov ◽  
V. Osipov
Keyword(s):  
Liquid Metal ◽  
Fusion Reactor ◽  
Cooling System ◽  
Liquid Metal Cooling

The applications of Cu substrate in liquid metal cooling systems

2018 ◽  
Vol 227 ◽  
pp. 116-119 ◽  
Author(s):  
Tomasz Gancarz ◽  
Katarzyna Berent
Keyword(s):  
Liquid Metal ◽  
Cooling Systems ◽  
Cu Substrate ◽  
Liquid Metal Cooling

scholarly journals Multi-scale simulation of single crystal hollow turbine blade manufactured by liquid metal cooling process

2018 ◽  
Vol 28 (1) ◽  
pp. 78-84 ◽  
Author(s):  
Xuewei Yan ◽  
Hang Zhang ◽  
Ning Tang ◽  
Changbo Sun ◽  
Qingyan Xu ◽  
...  
Keyword(s):  
Liquid Metal ◽  
Single Crystal ◽  
Turbine Blade ◽  
Cooling Process ◽  
Multi Scale ◽  
Hollow Turbine Blade ◽  
Liquid Metal Cooling
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