scholarly journals Thermal signature of the Majorana fermion in a Josephson junction

2021 ◽  
Vol 103 (14) ◽  
Author(s):  
Aabir Mukhopadhyay ◽  
Sourin Das
1989 ◽  
Vol 9 (1) ◽  
pp. 109-120
Author(s):  
G. Liao ◽  
A.F. Lawrence ◽  
A.T. Abawi

1978 ◽  
Vol 39 (C6) ◽  
pp. C6-550-C6-551
Author(s):  
H. Suhl ◽  
J. Hurell ◽  
A. H. Silver ◽  
Y. Song

Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.


1982 ◽  
Vol 53 (11) ◽  
pp. 7464-7470 ◽  
Author(s):  
T. S. Kuan ◽  
S. I. Raider ◽  
R. E. Drake

2021 ◽  
Vol 31 (5) ◽  
pp. 1-5
Author(s):  
Ivan P. Nevirkovets ◽  
Mikhail A. Belogolovskii ◽  
Oleg A. Mukhanov ◽  
John B. Ketterson

Sign in / Sign up

Export Citation Format

Share Document