scholarly journals Profiling a soft solid layer to passively control the conduit shape in a compliant microchannel during flow

2021 ◽  
Vol 104 (1) ◽  
Author(s):  
Pratyaksh Karan ◽  
Jeevanjyoti Chakraborty ◽  
Suman Chakraborty ◽  
Steven T. Wereley ◽  
Ivan C. Christov
Keyword(s):  
2021 ◽  
Author(s):  
Wenhuan Zhang ◽  
Zhaoping Deng ◽  
Hongwei Yuan ◽  
Shikai Luo ◽  
Huayin Wen ◽  
...  

AbstractIn this paper, silicone rubber materials with foam/solid alternating multilayered structures were successfully constructed by combining the two methods of multilayered hot-pressing and supercritical carbon dioxide (SCCO2) foaming. The cellular morphology and mechanical properties of the foam/solid alternating multilayered silicone rubber materials were systematically studied. The results show that the growth of the cell was restrained by the solid layer, resulting in a decrease in the cell size. In addition, the introduction of the solid layer effectively improved the mechanical properties of the microcellular silicone rubber foam. The tensile strength and compressive strength of the foam/solid alternating multilayered silicone rubber materials reached 5.39 and 1.08 MPa, which are 46.1% and 237.5% of the pure silicone rubber foam, respectively. Finite element analysis (FEA) was applied and the results indicate that the strength and proportion of the solid layer played important roles in the tensile strength of the foam/solid alternating multilayered silicone rubber materials. Moreover, the small cellular structures in silicone rubber foam can provided a high supporting counterforce during compression, meaning that the microcellular structure of silicone rubber foam improved the compressive property compared to that for the large cellular structure of silicone rubber foam.


2006 ◽  
Vol 49 (9) ◽  
pp. 831-850 ◽  
Author(s):  
Zongwen Feng ◽  
Weizhong Dai ◽  
Raja Nassar ◽  
James Palmer

Ultrasonics ◽  
1991 ◽  
Vol 29 (4) ◽  
pp. 288-293 ◽  
Author(s):  
M. Deschamps ◽  
Cao Chengwei
Keyword(s):  

2003 ◽  
Vol 255 (3-4) ◽  
pp. 369-378 ◽  
Author(s):  
Min Hsing Chang ◽  
Falin Chen
Keyword(s):  

1994 ◽  
Vol 47 (3) ◽  
pp. 101-112 ◽  
Author(s):  
K. E. Goodson ◽  
M. I. Flik

The thermal conductivities of solid layers of thicknesses from 0.01 to 100 μm affect the performance and reliability of electronic circuits, laser systems, and microfabricated sensors. This work reviews techniques that measure the effective thermal conductivity along and normal to these layers. Recent measurements using microfabricated experimental structures show the importance of measuring the conductivities of layers that closely resemble those in the application. Several promising non-contact techniques use laser light for heating and infrared detectors for temperature measurements. For transparent layers these methods require optical coatings whose impact on the measurements has not been determined. There is a need for uncertainty analysis in many cases, particularly for those techniques which apply to very thin layers or to layers with very high conductivities.


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