Through hole plating of printed circuit boards using ultrasonically dispersed copper nanoparticles

Circuit World ◽  
2010 ◽  
Vol 36 (3) ◽  
pp. 9-13 ◽  
Author(s):  
A.J. Cobley ◽  
D.J. Comeskey ◽  
L. Paniwnyk ◽  
T.J. Mason
2018 ◽  
Vol 185 ◽  
pp. 653-664 ◽  
Author(s):  
Samy Yousef ◽  
Maksym Tatariants ◽  
Vidas Makarevičius ◽  
Stasė-Irena Lukošiūtė ◽  
Regita Bendikiene ◽  
...  

1994 ◽  
Vol 39 (8-9) ◽  
pp. 1325-1338 ◽  
Author(s):  
H. Meyer ◽  
R.J. Nichols ◽  
D. Schröer ◽  
L. Stamp

2018 ◽  
Vol 78 ◽  
pp. 521-531 ◽  
Author(s):  
Maksym Tatariants ◽  
Samy Yousef ◽  
Sandra Sakalauskaitė ◽  
Rimantas Daugelavičius ◽  
Gintaras Denafas ◽  
...  

2021 ◽  
Vol 6 (1) ◽  
pp. 091-098
Author(s):  
S Celaschi ◽  
MS de Castro ◽  
Alecio Fernandes ◽  
A.L. Xavier

Automatic and innovative equipment was developed to inspect the assembly of pin-through-hole components on printed circuit boards. Its performance was tested on an industrial assembly line of motherboards for desktop computers. The test was conducted to inspect, under the binomial criterion Pass/Fail, the process of inserting PTH-DIMM components on semi-finished PCBs. Using the concept of Inspection Accuracy in binomial classification analysis it was estimated that the accuracy of this inspection is greater than 98%.


Author(s):  
Thamiris Auxiliadora Gonçalves Martins ◽  
Isabela Brandolis Alves Falconi ◽  
Giovani Pavoski ◽  
Viviane Tavares de Moraes ◽  
Marcela dos Passos Gallluzzi Baltazar ◽  
...  

1990 ◽  
Vol 56 (5) ◽  
pp. 837-842
Author(s):  
Yasuhiko HARA ◽  
Hideaki DOI ◽  
Kiyoshi NUMATA ◽  
Kenzo ENDO ◽  
Satoshi SHINADA

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