Thermal evaluation of a cost-effective plastic ball grid array package-NuBGA

2002 ◽  
Author(s):  
F. Wu ◽  
J. Lau ◽  
K.-L. Chen
Keyword(s):  
Cost Effective ◽  
Ball Grid Array ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Ball Grid Array Package

Thermal and Mechanical Evaluations of a Cost-Effective Plastic Ball Grid Array Package

1997 ◽  
Vol 119 (3) ◽  
pp. 208-212 ◽  
Author(s):  
J. H. Lau ◽  
K.-L. Chen
Keyword(s):  
Thermal Loading ◽  
Printed Circuit Board ◽  
Cost Effective ◽  
Ball Grid Array ◽  
Organic Substrate ◽  
Circuit Board ◽  
Heat Spreader ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Ball Grid Array Package

The temperature distribution and thermal resistance of a facedown PBGA (Plastic Ball Grid Array) package assembled on a FR-4 epoxy glass PCB (Printed Circuit Board) are presented. By varying the thickness of the copper heat spreader and organic substrate, an optimum PBGA package is designed. The effect of power and ground planes in the PCB and the size of PCB on the thermal performance of the PBGA is also given. Furthermore, the warpage (deflection) of the package under thermal loading is predicted.

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