Atomic diffusion of Zn in Sn-Zn based solder joints subjected to high temperature aging

2017 ◽  
Author(s):  
Jian-Chun Liu ◽  
Long Xiao ◽  
Zhi-Jun Yue ◽  
Gong Zhang
Keyword(s):  
High Temperature ◽  
Solder Joints ◽  
Atomic Diffusion ◽  
High Temperature Aging ◽  
Temperature Aging

Shear Toughness Evaluation of Solder Joints for the Reliability Tests

2013 ◽  
Vol 311 ◽  
pp. 467-471
Author(s):  
Chao Ming Hsu ◽  
Ah Der Lin ◽  
Tsung Pin Hung ◽  
Wen Chun Chiu ◽  
Jao Hwa Kuang
Keyword(s):  
High Temperature ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Load Testing ◽  
Thermal Cycling Testing ◽  
Toughness Evaluation ◽  
High Temperature Aging ◽  
The Difference ◽  
Ball Joints ◽  
Temperature Aging

The effects of isothermal aging and the thermal cycling loading on the shear toughness of different solder materials and ball sizes have been explored. The difference between shear toughness values of traditional Sn/37Pb eutectic solder ball joints and the lead free Sn/3.0Ag/0.5Cu solders are chosen for discussion. The experiment measurements under the ball shear test (BST) have been compared and studied for both solder joints. The fracture behaviors of the solder joints under the high temperature aging and thermal cycling testing are examined by scanning electron microscope (SEM). The variation of shear toughness of different ball joints reveals that the high temperature aging and thermal cyclic loading reduce the shear toughness significantly. The measured shear toughness values indicate that the Sn/3.0Ag/0.5Cu solder joints have better ductility for the joints undergoing the high temperature aging and the thermal cycle loadings. Based on the measured results, the better reliability for the Sn/3.0Ag/0.5Cu ball joints is expected, due to the aging and cycling load testing.

Evolution of the microstructure and phase composition of a subsurface of cast HP-type alloy during a long-term high-temperature aging

2019 ◽  
Vol 150 ◽  
pp. 166-173
Author(s):  
Sergey Yu. Kondrat'ev ◽  
Grigoriy P. Anastasiadi ◽  
Alina V. Ptashnik ◽  
Sergey N. Petrov
Keyword(s):  
Phase Composition ◽  
High Temperature ◽  
Type Alloy ◽  
High Temperature Aging ◽  
Temperature Aging

Effect of high temperature aging on luminescence properties of 5D0→7F2 transition of 8YSZ:Eu powder and coating

2014 ◽  
Vol 601 ◽  
pp. 57-62 ◽  
Author(s):  
Sumei Zhao ◽  
Yu Zhao ◽  
Binglin Zou ◽  
Xizhi Fan ◽  
Jiaying Xu ◽  
...  
Keyword(s):  
High Temperature ◽  
Luminescence Properties ◽  
High Temperature Aging ◽  
Temperature Aging

scholarly journals The Microstructural Change during High Temperature Aging in a 25%Cr-20%Ni Austenitic Steel Containing 0.41% Nitrogen

1976 ◽  
Vol 62 (8) ◽  
pp. 981-990 ◽  
Author(s):  
Makoto KIKUCHI ◽  
Takashi SEKITA ◽  
Saburo WAKITA ◽  
Ryohei TANAKA
Keyword(s):  
High Temperature ◽  
Austenitic Steel ◽  
Microstructural Change ◽  
High Temperature Aging ◽  
Temperature Aging

Variation of the adsorption properties of porous silicon in the course of natural and high-temperature aging

2001 ◽  
Vol 27 (1) ◽  
pp. 77-80 ◽  
Author(s):  
A. M. Orlov ◽  
A. A. Skvortsov ◽  
A. G. Klement’ev ◽  
A. V. Sindyaev
Keyword(s):  
High Temperature ◽  
Porous Silicon ◽  
Adsorption Properties ◽  
High Temperature Aging ◽  
Temperature Aging

High-temperature aging of fluoropolymers

1972 ◽  
Vol 10 (10) ◽  
pp. 2967-2982 ◽  
Author(s):  
Daniel W. Brown ◽  
Leo A. Wall
Keyword(s):  
High Temperature ◽  
High Temperature Aging ◽  
Temperature Aging
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