Thin film adhesion measurement by nanoindentation: Review of methodologies and validation by means of finite element simulations

2019 ◽  
Author(s):  
Jan Albrecht ◽  
Marie Weissbach ◽  
Juergen Auersperg ◽  
Rainer Dudek ◽  
Eberhard Kaulfersch ◽  
...  
Keyword(s):  
Thin Film ◽  
Finite Element ◽  
Finite Element Simulations ◽  
Film Adhesion ◽  
Adhesion Measurement ◽  
Thin Film Adhesion

Experimental Evaluation of the Probe Test for Measuring Thin Film Adhesion

2003 ◽  
Author(s):  
David A. Dillard ◽  
Caleb Scott ◽  
Kris Mount ◽  
Dingying Xu ◽  
Kai-Tak Wan ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Finite Element ◽  
Experimental Evaluation ◽  
Polymeric Coating ◽  
Finite Element Analyses ◽  
Film Adhesion ◽  
Thin Film Adhesion ◽  
Probe Test ◽  
Interfacial Fracture Energy

A probe test is proposed to quantify the adhesion of thin films and coatings. Using a micromanipulator, a tungsten probe is advanced into the edge of a polymeric coating. Debonds initiate at the loading point and propagate into semicircular cracks at the interface as the probe slides under the coating. The size of the debond is related to the interfacial fracture energy; poorer adhesion results in larger debonds for a given probe displacement. Approximate closed-form and finite element analyses of the geometry have been conducted, along with a significant number of experiments on as-produced and environmentally-conditioned specimens. The technique is showing considerable promise for characterizing coating adhesion, and has certain advantages over existing techniques for certain application.

Application of the Island Blister Test for Thin Film Adhesion Measurement

1989 ◽  
Vol 29 (1-4) ◽  
pp. 219-231 ◽  
Author(s):  
Mark G. Allen ◽  
Stephen D. Senturia
Keyword(s):  
Thin Film ◽  
Blister Test ◽  
Film Adhesion ◽  
Adhesion Measurement ◽  
Thin Film Adhesion

Thin-film adhesion measurement using laser-generated high-power surface acoustic wave

2006 ◽  
Vol 88 (19) ◽  
pp. 191911 ◽  
Author(s):  
V. Kireev ◽  
Y. Liu ◽  
Y. Braiman ◽  
B. Radhakrishnan ◽  
C. H. Hsueh ◽  
...  
Keyword(s):  
Thin Film ◽  
Acoustic Wave ◽  
Surface Acoustic Wave ◽  
High Power ◽  
Film Adhesion ◽  
Adhesion Measurement ◽  
Thin Film Adhesion

Recent Developments in Thin Film Adhesion Measurement

2004 ◽  
Vol 4 (2) ◽  
pp. 163-168 ◽  
Author(s):  
M.J. Cordill ◽  
D.F. Bahr ◽  
N.R. Moody ◽  
W.W. Gerberich
Keyword(s):  
Thin Film ◽  
Film Adhesion ◽  
Adhesion Measurement ◽  
Thin Film Adhesion ◽  
Recent Developments

Investigation of a new fracture mechanics specimen for thin film adhesion measurement

1997 ◽  
Vol 12 (10) ◽  
pp. 2673-2685 ◽  
Author(s):  
Maarten P. de Boer ◽  
Michael Kriese ◽  
William W. Gerberich
Keyword(s):  
Thin Film ◽  
Fracture Mechanics ◽  
Integrated Circuit ◽  
Carbon Layer ◽  
Tangential Load ◽  
Film Adhesion ◽  
Adhesion Measurement ◽  
Thin Carbon ◽  
Thin Film Adhesion ◽  
Processing Techniques

We have investigated mechanical probing of a precracked fine line structure as a new type of thin film fracture mechanics specimen. An idealized mechanics analysis is first presented. Experimentally, two types of precracks are formed. A thin carbon layer to which other layers weakly adhere creates a “processed precrack” by integrated circuit processing techniques. An “indented processed precrack” is formed by precision alignment of a sharp microwedge. The processed precrack is found to reduce the critical tangential load by 50% from a non-precracked line, while the indented processed precrack lowers the load by 200%. From this, a reasonable value of adhesion may be directly calculated. Crack path behavior is observed to depend on strength of the interface. In the case of a weak interface, the crack remains in the interface as it extends. For a strong interface, it kinks into the substrate if the crack is initially short, but remains in the interface if it is initially long. Given the experimental evidence, the mechanics are slightly modified to quantitatively model the experimental data.

Thin Film Adhesion Measurement Using Excimer Laser Ablation and Tensile Extension Tests

1991 ◽  
pp. 449-460 ◽  
Author(s):  
W.-C. Lee ◽  
V. W. Lindberg ◽  
P. H. Wojciechowski ◽  
F. J. Duarte
Keyword(s):  
Thin Film ◽  
Laser Ablation ◽  
Excimer Laser ◽  
Excimer Laser Ablation ◽  
Film Adhesion ◽  
Adhesion Measurement ◽  
Thin Film Adhesion
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