Simulation of a flip chip bonding technique using reactive foils
2014 ◽
Vol 53
(4S)
◽
pp. 04EB04
◽
2005 ◽
Vol 23
(2)
◽
pp. 582-587
◽
Keyword(s):
1999 ◽
Vol 22
(4)
◽
pp. 586-591
◽