Interfacial Reaction and Failure Mechanism of SAC/Co-P Solder Joint under Rapid Thermal Fatigue

2020 ◽  
Author(s):  
Donghua Yang ◽  
Xiang Zhai ◽  
Chunhong Zhang ◽  
Guisheng Gan ◽  
Teng Ran ◽  
...  
Keyword(s):  
Solder Joint ◽  
Failure Mechanism ◽  
Interfacial Reaction ◽  
Thermal Fatigue

Thermal fatigue as a possible failure mechanism in copper interconnects

2006 ◽  
Vol 504 (1-2) ◽  
pp. 321-324 ◽  
Author(s):  
Young-Bae Park ◽  
Reiner Mönig ◽  
Cynthia A. Volkert
Keyword(s):  
Failure Mechanism ◽  
Thermal Fatigue ◽  
Copper Interconnects

Precision Evaluation for Thermal Fatigue Life of Power Module Using Coupled Electrical-Thermal-Structural Analysis

2011 ◽  
Author(s):  
Tomohiro Takahashi ◽  
Qiang Yu ◽  
Masahiro Kobayashi
Keyword(s):  
Fatigue Life ◽  
Temperature Distribution ◽  
Solder Joint ◽  
Thermal Fatigue ◽  
Thermal Structure ◽  
Inelastic Strain ◽  
Power Module ◽  
Thermal Fatigue Life ◽  
Power Cycling ◽  
Precision Evaluation

For power module, the reliability evaluation of thermal fatigue life by power cycling has been prioritized as an important concern. Since in power cycling produces there exists non-uniform temperature distribution in the power module, coupled thermal-structure analysis is required to evaluate thermal fatigue mechanism. The thermal expansion difference between a Si chip and a substrate causes thermal fatigue. In this study, thermal fatigue life of solder joints on power module was evaluated. The finite element method (FEM) was used to evaluate temperature distribution induced by joule heating. Higher temperature appears below the Al wire because the electric current flows through the bonding Al wire. Coupled thermal-structure analysis is also required to evaluate the inelastic strain distribution. The damage of each part of solder joint can be calculated from equivalent inelastic strain range and crack propagation was simulated by deleting damaged elements step by step. The initial cracks were caused below the bonding Al wire and propagated concentrically under power cycling. There is the difference from environmental thermal cycling where the crack initiated at the edge of solder layer. In addition, in order to accurately evaluate the thermal fatigue life, the factors affecting the thermal fatigue life of solder joint where verified using coupled electrical-thermal-structural analysis. Then, the relation between the thermal fatigue life of solder joint and each factor is clarified. The precision evaluation for the thermal fatigue life of power module is improved.

Predicting Thermal Fatigue Lifetimes for SMT Solder Joints

1992 ◽  
Vol 114 (4) ◽  
pp. 472-476 ◽  
Author(s):  
J. Sauber ◽  
J. Seyyedi
Keyword(s):  
Finite Element ◽  
Solder Joint ◽  
Thermal Cycling ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Finite Element Models ◽  
Creep Tests ◽  
Creep Equation ◽  
Joint Behavior ◽  
Creep Strains

A power-law type creep equation has been added to finite element models to calculate solder joint response to time, temperature, and stress level. The ability of the models to predict solder joint behavior was verified by running a series of creep tests. The models were then solved to determine the solder joint creep strains which occur during thermal cycling. These creep strains were used to predict the degradation of pull strength resulting from thermal cycling. More than 8,600 solder joints were thermally cycled and then individually pull tested to verify the accuracy of the method.

Thermal Fatigue Prediction for Leadless Solder Joint of TFBGA

2006 ◽  
Author(s):  
Chia-Lung Chang ◽  
Tzu-Jen Lin ◽  
Chih-Hao Lai
Keyword(s):  
Energy Density ◽  
Solder Joint ◽  
Creep Strain ◽  
Thermal Fatigue ◽  
Strain Energy Density ◽  
Strain Energy ◽  
Creep Property ◽  
Inelastic Strain ◽  
Temperature Cycling ◽  
Element Analysis

Nonlinear finite element analysis was performed to predict the thermal fatigue for leadless solder joint of TFBGA Package under accelerated TCT (Temperature Cycling Test). The solder joint was subjected to the inelastic strain that was generated during TCT due to the thermal expansion mismatch between the package and PCB. The solder was modeled with elastic-plastic-creep property to simulate the inelastic deformation under TCT. The creep strain rate of solder was described by double power law. The furthest solder away from the package center induced the highest strain during TCT was considered as the critical solder ball to be most likely damaged. The effects of solder meshing on the damage parameters of inelastic strain range, accumulated creep strain and creep strain energy density were compared to assure the accuracy of the simulation. The life prediction equation based on the accumulated creep strain and creep strain energy density proposed by Syed was used to predict the thermal fatigue life in this study. The agreement between the prediction life and experimental mean life is within 25 per cent. The effect of die thickness and material properties of substrate on the life of solder was also discussed.

Reliability Evaluation of BGA Solder Joints by Using Thermal Fatigue Models

2005 ◽  
Author(s):  
Ouk Sub Lee ◽  
No Hoon Myoung ◽  
Dong Hyeok Kim
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Thermal Fatigue ◽  
Failure Probability ◽  
Solder Joints ◽  
State Function ◽  
Mechanical Loads ◽  
First Order ◽  
Reliability Method ◽  
Fatigue Model

The use of Ball Grid Array (BGA) interconnects utilizing the BGA solder joint has grown rapidly because of its small volume and diversity of its application. Therefore, the continuous quantification and refinement of BGA solder joint in terms of its reliability are required. The creep and cyclically applied mechanical loads generally cause metal fatigue on the BGA solder joint which inevitably leads to an electrical discontinuity. In the field application, the BGA solder joints are known to experience mechanical loads during temperature changes caused by power up/down events as the result of the Coefficient of Thermal Expansion (CTE) mismatch between the substrate and the Si die. In this paper, extremely small resistance changes in the lead free joints corresponding to the through-cracks generated by the thermal fatigue were measured and the failure was defined in terms of anomalous changes in the joint resistance. Furthermore, the reliability of BGA solder joints under thermal cycling was evaluated by using a criterion that may define and distinguish a failure in the solder joint. Any changes in circuit resistance according to the accumulated damage induced by the thermal cycling in the joint were recorded and evaluated by the First Order Reliability Method (FORM) procedure in order to quantify the reliability of solder joint. The first order Taylor series expansion of the limit state function incorporating with thermal fatigue models is used in order to estimate the failure probability of solder joints under heated condition. Various thermal fatigue models are utilized in this study. Models based on various plastic-strain rates such as Coffin-Manson fatigue model, total strain fatigue model and Solomon fatigue model are utilized in this study. The effects of random variables such as the CTE, the pitch of solder joint, the diameter of solder joint, and the CTE difference solder joints on the failure probability of the solder joint are systematically investigated by using a failure probability model with the FORM.

The Influence of PV Module Materials and Design on Solder Joint Thermal Fatigue Durability

2016 ◽  
Vol 6 (6) ◽  
pp. 1407-1412 ◽  
Author(s):  
Nick Bosco ◽  
Timothy J. Silverman ◽  
Sarah Kurtz
Keyword(s):  
Solder Joint ◽  
Thermal Fatigue ◽  
Pv Module ◽  
Fatigue Durability

In situ TEM characterization of interfacial reaction in Sn–3.5Ag/electroless Ni(P) solder joint

2011 ◽  
Vol 64 (7) ◽  
pp. 597-600 ◽  
Author(s):  
Han-Byul Kang ◽  
Jee-Hwan Bae ◽  
Jeong-Won Yoon ◽  
Seung-Boo Jung ◽  
Jongwoo Park ◽  
...  
Keyword(s):  
Solder Joint ◽  
Interfacial Reaction ◽  
In Situ Tem ◽  
Tem Characterization ◽  
Electroless Ni
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