Wire bonding: Present and future trends

Author(s):  
A.S. Chen ◽  
L.T. Nguyen ◽  
T.S. Burke ◽  
J.G. Belani
Keyword(s):  
1989 ◽  
Vol 154 ◽  
Author(s):  
Nick Koopman

An in-depth review of controlled collapse chip connections (c-4), or otherwise known as Flip Chip Solder Joining Technology, is present. The C4 joint utilizes solder bumps deposited on wettable terminals on the chip and a matching footprint of the substrate. The upsidedown chip (flip chip) is aligned to the substrate and all joints are made simultaneously by reflowing the solder. An in depth review of this technology is presented. Materials, design factors, fabrication processes, tools, assembly, rework, and reliability are discussed. Future trends are indicated and comparisons make with wire bonding and Tab (tape automated bonding).


2001 ◽  
Vol 120 (5) ◽  
pp. A30-A30
Author(s):  
J HELM ◽  
J BARTHEL ◽  
D COPPOLA ◽  
P LAZARUS ◽  
S LUTHER ◽  
...  

1996 ◽  
Vol 41 (5) ◽  
pp. 466-467
Author(s):  
Lori A. Ingram
Keyword(s):  

2001 ◽  
Vol 89 ◽  
pp. 31-33
Author(s):  
L. Flandin ◽  
Y. Bréchet ◽  
J.Y. Cavaillé

Author(s):  
Shreya Joshi ◽  
Ms Bhavyaa ◽  
Suhani Gupta ◽  
Lalita Luthra

Blockchain is considered to be a disruptive core technology. Although many researchers have realized the importance of blockchain, but the research of it is still emerging. It is the record-keeping technology behind bitcoin and is one of the hottest and fastest growing skills in the IT sector today. It serves as an immutable ledger which allows transactions to take place in a decentralized man Blockchain-based applications are rising up, covering numerous fields including finance, healthcare, product management, Internet of Things (IoT), and many more. However, there are still some challenges of blockchain technology such as scalability and security problems which need to be overcome. This paper comprises of a comprehensive study of Blockchain technology. We have included here a deep dive into how blockchains work, its architecture, consensus and various applications. Furthermore, technical challenges are briefly listed.


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