Silicide Based Low Temperature and Low Pressure Bonding of TI/SI for Microfludic and Hermetic Selaling Application
1988 ◽
Vol 46
◽
pp. 434-435
Keyword(s):
1987 ◽
Vol 48
(C6)
◽
pp. C6-487-C6-492
Keyword(s):
2001 ◽
Vol 231
(1-2)
◽
pp. 242-247
◽
Keyword(s):
2006 ◽
Vol 39
(8)
◽
pp. 1606-1618
◽
1998 ◽
Vol 10
(2)
◽
pp. 197-199
◽
Keyword(s):
2006 ◽
Vol 7
(1)
◽
pp. 36-41
◽
Keyword(s):
1988 ◽
Vol 17
(2)
◽
pp. 139-148
◽