Thermal Analysis and Structural Optimization of Dual IGBT Module Heat Sink under Forced Air Cooling Condition

2019 ◽  
Author(s):  
Guangyi Li ◽  
Junhong Zhang ◽  
Jianxin Gao
Keyword(s):  
Thermal Analysis ◽  
Structural Optimization ◽  
Heat Sink ◽  
Cooling Condition ◽  
Air Cooling ◽  
Igbt Module ◽  
Forced Air

Structure Design for Heat Sink Based on Thermal Analysis

2011 ◽  
Vol 80-81 ◽  
pp. 767-773
Author(s):  
Hai Gang Sun ◽  
Yong Zhou
Keyword(s):  
Thermal Analysis ◽  
Thermal Performance ◽  
Heat Sink ◽  
Cfd Simulation ◽  
Thermal Control ◽  
Structure Design ◽  
Thermal Design ◽  
Structure Parameters ◽  
Igbt Module ◽  
Key Factor

Thermal design and the working temperature control have been a key factor in the design of electronic devices and system. In this paper, a sort of heat sink collocated with high-power IGBT module, which is commonly used in car-carrying motor control system, is designed based on thermal analysis by means of CFD simulation and computer-aided analyzing, also the influence relations of structure parameters with thermal performance are studied. With thermal control as the overall design objective, structure parameters of heat sink are determined according to the obtained relations. Further, thermal performance of the designed heat sink is simulated and analyzed in CFD software to examine the validity of the design result. In this way, a method of thermal analyzing and structure parameter design for heat sink, which is proved as an efficacious approach, is introduced and can be used to thermal design and analysis for similar products.

Thermal analysis of multibeam klystron collector with forced air cooling

2014 ◽  
Author(s):  
A. V. Konnov ◽  
A. P. Nikitin ◽  
P. I. Akimov ◽  
V. I. Panizkov ◽  
I. S. Vladykina
Keyword(s):  
Thermal Analysis ◽  
Air Cooling ◽  
Forced Air

“Heat Shield”—An Enhancement Device for an Unshrouded, Forced Convection Heat Sink

2006 ◽  
Vol 128 (2) ◽  
pp. 172-176 ◽  
Author(s):  
Suzana Prstic ◽  
Avram Bar-Cohen
Keyword(s):  
Pressure Drop ◽  
Thermal Performance ◽  
Heat Sink ◽  
Thin Sheet ◽  
Heat Sinks ◽  
Heat Shield ◽  
Air Cooling ◽  
Thermal Enhancement ◽  
Thin Sheet Metal ◽  
Forced Air

The inherent advantages of forced air cooling have led to the widespread use of fully and partially shrouded heat sinks for the thermal management of high power microprocessors. The superior thermal performance that is achievable in the fully shrouded configuration is accompanied by a significant pressure drop penalty. The concept introduced in the current study, employs a thin sheet-metal “heat shield,” placed around a partially shrouded heat sink, to channel the flow directly into the heat sink. A combined numerical and experimental study has shown that the use of this “heat shield” can substantially enhance heat sink thermal performance, in a channel geometry and air flow range typical of commercial chip packages; making it comparable to that of a fully shrouded heat sink, with a substantially lower pressure drop (∼50%). In addition, this thermal enhancement device can be easily retrofitted into existing systems; improving performance without major channel and/or fan modifications.

Least-Volume Optimization of Finned Heat Sinks for Burn-in Air-Cooling Solutions

2003 ◽  
Author(s):  
Zhaojuan He ◽  
Patrick E. Phelan
Keyword(s):  
Heat Sink ◽  
Heat Dissipation ◽  
Past Research ◽  
Heat Sinks ◽  
Air Cooling ◽  
Electronic Packages ◽  
Pin Fin ◽  
Heat Spreaders ◽  
Forced Air ◽  
Innovative Techniques

With the development and increasing use of high-density components with their high power dissipation needs, electronic packages have required the investigation of innovative techniques for the efficient dissipation of heat. One prevalent method is the use of forced convection heat spreaders, called heat sinks, which are also widely used in Burn-In (BI) ovens. There are some contradictions remaining in recent research on modeling and Nusselt number correlations of heat sinks in forced air convection. This paper begins by reviewing past research for different finned heat sink geometries with and without bypass flow over the heat sinks. A new method called Least Volume Optimization is then proposed to analyze the thermal performance of finned heat sinks for BI air-cooling solutions. The analysis shows that the volumetric heat dissipation of a parallel plate fin heat sink is higher than that of a pin fin heat sink, based on an optimal fin geometry.

Integrated Heterogeneous Design of Semiconductor Heat Sink via Scaled Direct Micro-Modeling, Upper Scale VAT Simulation and Experiment: Comparison and Verification of Properties

2001 ◽  
Author(s):  
V. S. Travkin ◽  
E. D. Sergievsky ◽  
E. V. Krinitsky ◽  
I. Catton
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Hydrodynamic Characteristic ◽  
Volume Averaging ◽  
Air Cooling ◽  
Simulation And Experiment ◽  
Micro Modeling ◽  
Forced Air ◽  
Work Supports ◽  
Effectiveness Parameter

Abstract The thermal and hydrodynamic characteristic of straight-channel longitudinal fin heat sink under forced air-cooling is studied experimentally and numerically using a Phoenics 3.3 (CHAM, UK) CFD software. The aim of the study is to simulate and compare the viability of employing Phoenics code as effective and efficient means gathering the vast amount of data required to adequately quantify heat sink characteristics on the lower scale with the two scale experimental data reduced according to requirements of VAT. For this case is analyzed the basic homogeneous heat transfer performance features and shown insolvency of using heat transfer and effectiveness parameter. A number of data reduction parameters and procedures were developed using scaling heterogeneous formulation by volume averaging theory (VAT). Analysis brought in this work supports the procedures used to connect the two scale VAT experiment with the full lower scale direct numerical modeling for the semiconductor heat sink.

scholarly journals Air circulation in a gastrointestinal light source box and endoscope in the era of SARS-CoV-2 and airborne transmission of microorganisms

2021 ◽  
Vol 09 (03) ◽  
pp. E482-E486
Author(s):  
Stanislas Chaussade ◽  
Einas Abou Ali ◽  
Rachel Hallit ◽  
Arthur Belle ◽  
Maximilien Barret ◽  
...  
Keyword(s):  
Light Source ◽  
Cooling System ◽  
Air Cooling ◽  
Airborne Transmission ◽  
Plastic Tube ◽  
Care Workers ◽  
Air Cooling System ◽  
Forced Air ◽  
Air Circulation ◽  
Closed Environment

Abstract Background and study aims The role that air circulation through a gastrointestinal endoscopy system plays in airborne transmission of microorganisms has never been investigated. The aim of this study was to explore the potential risk of transmission and potential improvements in the system. Methods We investigated and described air circulation into gastrointestinal endoscopes from Fujifilm, Olympus, and Pentax. Results The light source box contains a lamp, either Xenon or LED. The temperature of the light is high and is regulated by a forced-air cooling system to maintain a stable temperature in the middle of the box. The air used by the forced-air cooling system is sucked from the closed environment of the patient through an aeration port, located close to the light source and evacuated out of the box by one or two ventilators. No filter exists to avoid dispersion of particles outside the processor box. The light source box also contains an insufflation air pump. The air is sucked from the light source box through one or two holes in the air pump and pushed from the air pump into the air pipe of the endoscope through a plastic tube. Because the air pump does not have a dedicated HEPA filter, transmission of microorganisms cannot be excluded. Conclusions Changes are necessary to prevent airborne transmission. Exclusive use of an external CO2 pump and wrapping the endoscope platform with a plastic film will limit scatter of microorganisms. In the era of pandemic virus with airborne transmission, improvements in gastrointestinal ventilation systems are necessary to avoid contamination of patients and health care workers.

Sign in / Sign up

Export Citation Format

Share Document