Accelerated Reliability Evaluation of Trimetal Integrated Circuit Chips in Plastic Packages

Mapping Intimacies ◽

10.1109/irps.1978.362850 ◽

1978 ◽

Author(s):

L. J. Gallace ◽

H. J. Khajezadeh ◽

A. S. Rose

Keyword(s):

Integrated Circuit ◽

Reliability Evaluation ◽

Plastic Packages

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Accelerated reliability evaluation of trimetal integrated circuit chips in plastic packages

Microelectronics Reliability ◽

10.1016/0026-2714(78)90030-6 ◽

1978 ◽

Vol 18 (6) ◽

pp. 476

Keyword(s):

Integrated Circuit ◽

Reliability Evaluation ◽

Plastic Packages

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Accelerated Reliability Evaluation of Trimetal Integrated Circuit Chips in Plastic Packages

IEEE Transactions on Components Hybrids and Manufacturing Technology ◽

10.1109/tchmt.1979.1135442 ◽

1979 ◽

Vol 2 (2) ◽

pp. 172-179

Author(s):

L. Gallace ◽

L. Jacobus ◽

E. Pfiffner ◽

C. West

Keyword(s):

Integrated Circuit ◽

Reliability Evaluation ◽

Plastic Packages

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Reliability evaluation of hermetic integrated circuit chips in plastic packages

Microelectronics Reliability ◽

10.1016/0026-2714(75)90063-3 ◽

1975 ◽

Vol 14 (5-6) ◽

pp. 405

Keyword(s):

Integrated Circuit ◽

Reliability Evaluation ◽

Plastic Packages

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Accelerated reliability evaluation of trimetal integrated circuit chips in plastic packages

Microelectronics Reliability ◽

10.1016/0026-2714(80)90226-7 ◽

1980 ◽

Vol 20 (3) ◽

pp. 375

Keyword(s):

Integrated Circuit ◽

Reliability Evaluation ◽

Plastic Packages

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Reliability Evaluation of Hermetic Integrated Circuit Chips in Plastic Packages

10.1109/irps.1975.362680 ◽

1975 ◽

Author(s):

H. Khajezadeh ◽

A. S. Rose

Keyword(s):

Integrated Circuit ◽

Reliability Evaluation ◽

Plastic Packages

Download Full-text

Reliability evaluation of trimetal integrated circuits in plastic packages

Microelectronics Reliability ◽

10.1016/0026-2714(78)90587-5 ◽

1978 ◽

Vol 17 (2) ◽

pp. 251

Keyword(s):

Integrated Circuits ◽

Reliability Evaluation ◽

Plastic Packages

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Predicted Bow of Plastic Packages of Integrated Circuit (IC) Devices

Thermal Stress and Strain in Microelectronics Packaging ◽

10.1007/978-1-4684-7767-2_12 ◽

1993 ◽

pp. 385-409 ◽

Author(s):

E. Suhir

Keyword(s):

Integrated Circuit ◽

Plastic Packages

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Delamination and Encapsulant Resin Cracking in LSI Plastic Packages Subjected to Temperature Cyclic Loading

Journal of Electronic Packaging ◽

10.1115/1.1602706 ◽

2003 ◽

Vol 125 (3) ◽

pp. 420-425

Author(s):

Takehiro Saitoh ◽

Hidehito Matsuyama ◽

Masayuki Toya

Keyword(s):

Integrated Circuit ◽

Large Scale ◽

Radioactive Tracer ◽

Cyclic Tests ◽

Delamination Growth ◽

Cu Alloy ◽

Plastic Packages ◽

Linear Fracture ◽

Tracer Techniques ◽

Finite Element Calculations

Using Kr85 radioactive tracer techniques, initial sites of edge delaminations occurring during temperature cyclic tests in large-scale integrated circuit (LSI) plastic packages with either Cu alloy or alloy 42 leadframes are experimentally identified. Based on the experimental results, the processes of delamination growth and subsequent resin cracking are clarified. The effect of the length of the delaminations on the resin cracking is numerically analyzed on the basis of the linear fracture mechanics approach combined with finite element calculations. The directions of resin cracking predicted from the analysis are found to agree well with those of actual packages.

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Failure criterion for moisture-sensitive plastic packages of integrated circuit (IC) devices: Application of von Kármán's equations with consideration of thermoelastic strains

International Journal of Solids and Structures ◽

10.1016/s0020-7683(96)00207-7 ◽

1997 ◽

Vol 34 (23) ◽

pp. 2991-3019 ◽

Author(s):

E. Suhir

Keyword(s):

Integrated Circuit ◽

Failure Criterion ◽

Plastic Packages ◽

Moisture Sensitive

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Packaging Technology Development for Silicon on Sapphire Based Commercial RF IC Products

ASME 2009 InterPACK Conference, Volume 1 ◽

10.1115/interpack2009-89199 ◽

2009 ◽

Author(s):

John Zhiyuan Yang

Keyword(s):

Technology Development ◽

Mechanical Performance ◽

Reliability Evaluation ◽

Electrical Performance ◽

Packaging Technology ◽

Plastic Packages ◽

This paper presents packaging solution for silicon on sapphire based commercial RF IC products for which package type is focused on traditional plastic packages such as MSOP, TSSOP, QFN and recently developed ultra thin QFN package. Package mechanical performance, reliability evaluation and electrical performance have been addressed.

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