scholarly journals A complex-integration approach to the saddlepoint approximation for random-coding bounds

Author(s):  
Alfonso Martinez ◽  
Jonathan Scarlett ◽  
Marco Dalai ◽  
Albert Guillen i Fabregas
2011 ◽  
Vol 91 (1) ◽  
pp. 171-193
Author(s):  
Sladjana Andjelkovic ◽  
Zorica Stanisavljevic-Petrovic

In work, different possibilities are considered, which are offered by natural and social resources with the goal to change and modernize the teaching outside of the classroom in different environments. Modern teaching is based on the holistic, integrated approach in which the knowledge is viewed as a complete system in a constant process of transformation. Thus, the importance of the environment is asserted, the importance of the ambient in which the teaching process is being conducted. Authentic environment (natural and social resources) in which the teaching is realized, outside of the classroom, creates possibilities for learning through active working methods, independent research, exploration and noticing the relationships and connections. Teaching in the authentic environment offers a series of advantages for both the students and teacher-partners in the process of constructing a knowledge system. Using the resources and modern complex integration approach within the existing educational practice can significantly influence the modernization and innovation of the educational process, and can make the school, as a basic educational institution, a more suitable and more attractive for the generations to come.


Author(s):  
H. Sur ◽  
S. Bothra ◽  
Y. Strunk ◽  
J. Hahn

Abstract An investigation into metallization/interconnect failures during the process development phase of an advanced 0.35μm CMOS ASIC process is presented. The corresponding electrical failure signature was electrical shorting on SRAM test arrays and subsequently functional/Iddq failures on product-like test vehicles. Advanced wafer-level failure analysis techniques and equipment were used to isolate and identify the leakage source as shorting of metal lines due to tungsten (W) residue which was originating from unfilled vias. Further cross-section analysis revealed that the failing vias were all exposed to the intermetal dielectric spin-on glass (SOG) material used for filling the narrow spaces between metal lines. The outgassing of the SOG in the exposed regions of the via prior to and during the tungsten plug deposition is believed to be the cause of the unfilled vias. This analysis facilitated further process development in eliminating the failure mechanism and since then no failures of this nature have been observed. The process integration approach used to eliminate the failure is discussed.


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