Miniature SAW Device for RF-Wireless Applications Using MEMS Technology

2006 ◽  
Author(s):  
Amal Zaki ◽  
Hamed Elsimary ◽  
Mona Zaghloul
Keyword(s):  
Wireless Applications ◽  
Mems Technology ◽  
Rf Wireless

Low cost UTSi technology for RF wireless applications

2002 ◽  
Author(s):  
M. Megahed ◽  
M. Burgener ◽  
J. Cable ◽  
R. Benton ◽  
D. Staab ◽  
...  
Keyword(s):  
Low Cost ◽  
Wireless Applications ◽  
Rf Wireless

A Novel LDMOSFET on Patterned-SOI for RF Wireless Applications

2006 ◽  
Author(s):  
Wenjun Li ◽  
Zhanfei Chen ◽  
Jun Liu ◽  
Lingling Sun ◽  
XinHong Cheng ◽  
...  
Keyword(s):  
Wireless Applications ◽  
Rf Wireless

A LOW POWER CASCADED FEED-FORWARD DELTA-SIGMA MODULATOR FOR RF WIRELESS APPLICATIONS

2009 ◽  
Vol 18 (02) ◽  
pp. 407-429 ◽  
Author(s):  
SHAILESH B. NERURKAR ◽  
KHALID H. ABED
Keyword(s):  
Power Consumption ◽  
Cmos Technology ◽  
Third Order ◽  
Feed Forward ◽  
Analog To Digital ◽  
Wireless Applications ◽  
Fully Differential ◽  
Delta Sigma Modulator ◽  
Delta Sigma ◽  
Rf Wireless

This paper presents a design of a novel cascaded third-order feed-forward delta-sigma analog-to-digital converter (ADC). This ADC is realized using fully differential switched capacitor architecture and produces a 12-bit resolution at a data output rate (DOR) of 2.5 MS/s for RF wireless applications. The delta-sigma modulator consists of a second-order single-bit feed-forward modulator cascaded with a multi-bit first-order modulator. The cascaded feed-forward third-order (2-1) ADC is simulated using Matlab and Simulink. The delta-sigma modulator was designed using Cadence Virtuoso in TSMC 0.18 μm CMOS technology. The power consumption of the designed modulator is 12.74 mW, and the resolution is 11.85 bits for an over-sampling ratio (M = 32). The figure of merit is 1.38 pJ at a sample rate of 80 MS/s. The proposed delta-sigma modulator is compared with other state-of-the-art low-pass delta-sigma modulators in terms of their speed, power, DOR, and the proposed modulator has one of the lowest power consumption.

LOW POWER DIGITAL DECIMATION FILTER FOR RF WIRELESS COMMUNICATIONS

2008 ◽  
Vol 17 (02) ◽  
pp. 239-251 ◽  
Author(s):  
SHAILESH B. NERURKAR ◽  
KHALID H. ABED
Keyword(s):  
Low Power ◽  
Phase 1 ◽  
Low Power Design ◽  
Fir Filter ◽  
Wireless Applications ◽  
Multi Stage ◽  
Filter Architecture ◽  
Decimation Filter ◽  
Rf Wireless ◽  
Selection Of

In this paper, we present a unique low power decimation filter architecture for RF wireless applications. To implement the low power decimation filter, we considered low power design techniques such as multi-rate, multi-stage signal processing, proper selection of decimation factor, one multiplier realization of 1/3-band filters, and poly-phase 1/2-band filters. We have designed three conventional decimation filter architectures using a single-stage FIR filter, a three-stage FIR filter, and a three-stage half-band FIR filter. Compared to the 55-tap comb-FIR filter architecture, the proposed decimation filter has only 13 taps, and requires 76% less hardware and consumes 64% less power.

Add Ceramic “MEMS” to the Pallet of MicroSystems Technologies

2001 ◽  
Vol 687 ◽  
Author(s):  
David L. Wilcox ◽  
Jeremy W. Burdon ◽  
Rajnish Changrani ◽  
Chia-Fu Chou ◽  
Steve Dai ◽  
...  
Keyword(s):  
Integrated Circuit ◽  
Materials Science ◽  
Ceramic Materials ◽  
Micro Electro Mechanical Systems ◽  
Multiple Functions ◽  
Wireless Applications ◽  
Technology Applications ◽  
Mems Technology ◽  
Multilayer Ceramic ◽  
Morphing Technology

AbstractJust as the 40+ years of technology developments associated with the electronic application of semiconductor fabrication processes is “morphing” into a micro-electro- mechanical systems (MEMS) technology in the past dozen years or so, so it seems may the “mature” multilayer ceramic fabrication technology associated with capacitor components and interconnect substrates for the integrated circuit industry, be morphed into MEMS – microsystems technology applications. This paper highlights work underway in Motorola Labs aimed at exploring the potential to develop 3D multilayer ceramic structures to integrate (monolithic and hybrid) multiple functions to create microsystems for wireless, energy and life science applications. By multiple functions, we refer to the ability for a microsystem to perform electronic, fluidic, thermonic, photonic and mechatronic (or actuator) based functions. Current capabilities of the multilayer ceramic materials and processes to achieve integrated functionalities for wireless applications will be described including the development of a new dielectric enabling increased performance for wireless applications. Also to be highlighted will be exploratory microscale fuel cell prototypes exploiting advances in the multilayer ceramic lamination and feature forming technologies enabling the insertion of 3D microchannels for microfluidic functions. These prototypes also feature the ability of the technology to provide thermonic functionality for microreactor devices. Feasibility of a light source that can be integrated into the technology platform hinting at photonic applications will be described. Many materials science and engineering advancements are needed to achieve the potential of this “old” but newly “morphing” technology and some of these will be noted.

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