Solder Joint Strength Of Lead Free Solders under Multiple Reflow and High Temperature Storage Condition

2006 ◽  
Author(s):  
Ibrahim Ahmad ◽  
Azman Jalar ◽  
Burhanuddin Yeop Majlis ◽  
Eu Poh Leng ◽  
Yong Soo San
Keyword(s):  
High Temperature ◽  
Solder Joint ◽  
Joint Strength ◽  
Storage Condition ◽  
Lead Free ◽  
High Temperature Storage ◽  
Lead Free Solders ◽  
Temperature Storage

Effect of Fe content on the interfacial reliability of SnAgCu/Fe-Ni solder joint

2013 ◽  
Vol 2013 (1) ◽  
pp. 000109-000114
Author(s):  
Hao Zhang ◽  
Qing-Sheng Zhu ◽  
Zhi-Quan Liu ◽  
Li Zhang ◽  
Hongyan Guo ◽  
...  
Keyword(s):  
High Temperature ◽  
Solder Joint ◽  
Solder Joints ◽  
Temperature Cycling ◽  
Growth Speed ◽  
Fe Content ◽  
Ball Shear Test ◽  
High Temperature Storage ◽  
Interfacial Reliability ◽  
Temperature Storage

Fe-Ni films with compositions of Fe-75Ni, Fe-50Ni, and Fe-30Ni were used as under bump metallization (UBM) to evaluate the interfacial reliability of SnAgCu/Fe-Ni solder joints through ball shear test, high temperature storage, as well as temperature cycling. The shear strength for Fe-75Ni, Fe-50Ni, and Fe-30Ni solder joints after reflow were 42.57, 53.94, 53.98 MPa respectively, which are all satisfied with the requirement of industrialization (>34.3 MPa ). High temperature storage was conducted at 150°C and 200°C respectively. It was found that higher Fe content in Fe-Ni layer had the ability to inhibit the mutual diffusion at interface region at 150°C, and the growth speed of intermetallic compound (IMC) decreased with the increase of Fe concentration. When stored at 200°C, the thickness of IMC would reach a limitation for all these three films after 4 days, and cracks occurred at the interface between IMC and Fe-Ni layer. Temperature cycling tests revealed that SnAgCu/Fe-50Ni solder joint had the lowest failure rate (less than 10%), which has the best interfacial reliability among three compositions.

Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer (RDL)

2021 ◽  
Author(s):  
S. W. R. Lee ◽  
J. C. C. Lo ◽  
X. Qiu ◽  
N. Tu
Keyword(s):  
High Temperature ◽  
Solder Joint ◽  
Wafer Level ◽  
Joint Reliability ◽  
Ball Shear Test ◽  
Alternative Approach ◽  
High Temperature Storage ◽  
Bond Pads ◽  
Photolithography Process ◽  
Temperature Storage

Abstract Re-distribution layer (RDL) is one key enabling technology for advance packaging. RDL is usually fabricated in wafer level by photolithography process. An alternative approach for implementing RDL by additive manufacturing (AM) method is proposed in this study. This allows RDL to be fabricated on singulation chip. Nano-silver (nano-Ag) ink is printed on the silicon chip to form routing traces and bond pads. However, the Ag pad may be consumed by solder quickly if the process is not properly controlled. This paper studied the effect of nano-Ag ink sintering condition on the solderability of Ag pad. The solder joint mechanical integrity was evaluated by solder ball shear test. High temperature storage test was also carried out to evaluate the solder joint reliability. Experiment results showed that Ag pad fabricated by AM is SMT compatible. High temperature storage did not cause early failure to the samples. There was not significant change in the Ag3Sn IMC layer thickness and mechanical strength. The finding of the present study will serve as a very useful reference for future practice of forming solder joints on sintered nano-Ag pads.

scholarly journals Effect of Isothermal Aging and Copper Substrate Roughness on the SAC305 Solder Joint Intermetallic Layer Growth of High Temperature Storage (HTS)

2020 ◽  
Vol 49 (12) ◽  
pp. 2999-3008
Author(s):  
Rabiah Al Adawiyah Ab Rahim ◽  
Muhammad Nubli Zulkifli ◽  
Azman Jalar ◽  
Atiqah Mohd Afdzaluddin ◽  
Siow Shyong Kim
Keyword(s):  
High Temperature ◽  
Solder Joint ◽  
Aging Process ◽  
Turning Point ◽  
Copper Substrate ◽  
Sac305 Solder ◽  
Initial Exposure ◽  
Cu Substrate ◽  
High Temperature Storage ◽  
Temperature Storage

This study aims to evaluate the effect of copper (Cu) substrate surface roughness on the intermetallic compound (IMC) growth and interfacial reaction of SAC305 lead-free solder joint after undergone an aging process. Aging process was conducted using high temperature storage (HTS) at temperature of 150 °C and aging times of 200, 400, 600, 800, and 1000 h. IMC morphology and growth were examined using infinite focus microscope (IFM). Then, the SAC305 solder joint IMC growth kinetic was measured based on power law relationship and diffusion coefficient formula. It was noted that the morphology of IMC for the rougher Cu substrate has scallop-shaped and uniform layer as compared to that of smoother Cu substrate for the initial exposure to the HTS. In addition, Cu substrate with Ra of 579 nm is the turning point for the creation of Cu6Sn5 towards more Cu3Sn of IMC. In addition, Cu substrate with Ra of 579 nm also acts as the turning point for the IMC growth of SAC305 solder joint on Cu substrate for the solid-state diffusion to be happened during 150 °C of aging from grain boundary dominant toward volume diffusion dominant.

Shear Strength and Dsc Analysis of High-Temperature Solders

2013 ◽  
Vol 58 (2) ◽  
pp. 529-533 ◽  
Author(s):  
R. Koleňák ◽  
M. Martinkovič ◽  
M. Koleňáková
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Lead Free ◽  
Dsc Analysis ◽  
Ultrasonic Activation ◽  
Metallic Substrates ◽  
Cu Substrate ◽  
Lead Free Solders

The work is devoted to the study of shear strength of soldered joints fabricated by use of high-temperature solders of types Bi-11Ag, Au-20Sn, Sn-5Sb, Zn-4Al, Pb-5Sn, and Pb-10Sn. The shear strength was determined on metallic substrates made of Cu, Ni, and Ag. The strength of joints fabricated by use of flux and that of joints fabricated by use of ultrasonic activation without flux was compared. The obtained results have shown that in case of soldering by use of ultrasound (UT), higher shear strength of soldered joints was achieved with most solders. The highest shear strength by use of UT was achieved with an Au-20Sn joint fabricated on copper, namely up to 195 MPa. The lowest average values were achieved with Pb-based solders (Pb-5Sn and Pb-10Sn). The shear strength values of these solders used on Cu substrate varied from 24 to 27 MPa. DSC analysis was performed to determine the melting interval of lead-free solders.

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