Effect of Three-Dimensional Electric Field and Heat Conduction to Electrodes on the Temperature Rise During Irreversible Electroporation

2011 ◽  
Author(s):  
Seiji Nomura ◽  
Kosaku Kurata ◽  
Hiroshi Takamatsu
Keyword(s):  
Heat Conduction ◽  
Electric Field ◽  
Temperature Rise ◽  
Heat Conduction Equation ◽  
Thermal Damage ◽  
Irreversible Electroporation ◽  
Three Dimensional ◽  
End Effects ◽  
Abnormal Cells ◽  
Novel Method

The irreversible electroporation (IRE) is a novel method to ablate abnormal cells by applying a high voltage between two electrodes that are stuck into abnormal tissues. One of the advantages of the IRE is that the extracellular matrix (ECM) may be kept intact, which is favorable for healing. For a successful IRE, it is therefore important to avoid thermal damage of ECM resulted from the Joule heating within the tissue. A three-dimensional (3-D) analysis was conducted in this study to predict temperature rise during the IRE. The equation of electric field and the heat conduction equation were solved numerically by a finite element method. It was clarified that the highest temperature rise occurred at the base of electrodes adjacent to the insulated surface. The result was significantly different from a two-dimensional (2-D) analysis due to end effects, suggesting that the 3-D analysis is required to determine the optimal condition.

scholarly journals The Effect of Conductivity Changes on Temperature Rise During Irreversible Electroporation

2020 ◽  
Author(s):  
Amir Khorasani
Keyword(s):  
Electrical Conductivity ◽  
Cell Death ◽  
Electric Field ◽  
Electric Field Intensity ◽  
Thermal Damage ◽  
Pulse Sequence ◽  
Irreversible Electroporation ◽  
Tissue Temperature ◽  
Comsol Multiphysics ◽  
Simulation Results

Purpose: Irreversible electroporation is a physical process which is used for killing the cancer cells. The process that leads to cell death in this method is a unique process. Thermal damage does not exist in this process. However, the temperature of the tissue also increases during the electroporation. In this study, we aim to investigate the effect of conductivity changes on tissue temperature increase during the irreversible electroporation process. Materials and Methods: To perform simulations and solve equations, COMSOL MultiPhysics has been used. Standard electroporation pulse sequence (8 pulses with different electric field intensities) was used as a pulse sequence in the simulation. Results: During the electroporation process, the electrical conductivity and the temperature of the tissue were increased. Changes in the tissue temperature in the simulation with variable electrical conductivity are more than in the simulation with constant electrical conductivity during the electroporation process. This difference for pulses with more vigorous electric field intensity and points closer to the electrodes has been achieved more. Conclusion: To more accurately estimate and calculate the temperature and thermal damage inside the tissue during the irreversible electroporation process, it is suggested to consider the effect of conductivity changes during this process.

Analytical Solution for Three-Dimensional Hyperbolic Heat Conduction Equation with Time-Dependent and Distributed Heat Source

2016 ◽  
Vol 33 (1) ◽  
pp. 65-75 ◽  
Author(s):  
M. R. Talaee ◽  
V. Sarafrazi
Keyword(s):  
Heat Conduction ◽  
Analytical Solution ◽  
Heat Source ◽  
Heat Conduction Equation ◽  
Numerical Solutions ◽  
Three Dimensional ◽  
Closed Form Solution ◽  
Time Dependent ◽  
Conduction Equation ◽  
Hyperbolic Heat Conduction

AbstractThis paper is devoted to the analytical solution of three-dimensional hyperbolic heat conduction equation in a finite solid medium with rectangular cross-section under time dependent and non-uniform internal heat source. The closed form solution of both Fourier and non-Fourier profiles are introduced with Eigen function expansion method. The solution is applied for simple simulation of absorption of a continues laser in biological tissue. The results show the depth of laser absorption in tissue and considerable difference between the Fourier and Non-Fourier temperature profiles. In addition the solution can be applied as a verification branch for other numerical solutions.

Endovascular Nonthermal Irreversible Electroporation: A Finite Element Analysis

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Elad Maor ◽  
Boris Rubinsky
Keyword(s):  
Finite Element ◽  
Electric Field ◽  
Electric Fields ◽  
Joule Heating ◽  
Arterial Wall ◽  
Thermal Damage ◽  
Irreversible Electroporation ◽  
Phospholipid Bilayer ◽  
Tissue Ablation ◽  
Nonthermal Irreversible Electroporation

Tissue ablation finds an increasing use in modern medicine. Nonthermal irreversible electroporation (NTIRE) is a biophysical phenomenon and an emerging novel tissue ablation modality, in which electric fields are applied in a pulsed mode to produce nanoscale defects to the cell membrane phospholipid bilayer, in such a way that Joule heating is minimized and thermal damage to other molecules in the treated volume is reduced while the cells die. Here we present a two-dimensional transient finite element model to simulate the electric field and thermal damage to the arterial wall due to an endovascular NTIRE novel device. The electric field was used to calculate the Joule heating effect, and a transient solution of the temperature is presented using the Pennes bioheat equation. This is followed by a kinetic model of the thermal damage based on the Arrhenius formulation and calculation of the Henriques and Moritz thermal damage integral. The analysis shows that the endovascular application of 90, 100 μs pulses with a potential difference of 600 V can induce electric fields of 1000 V/cm and above across the entire arterial wall, which are sufficient for irreversible electroporation. The temperature in the arterial wall reached a maximum of 66.7°C with a pulse frequency of 4 Hz. Thermal damage integral showed that this protocol will thermally damage less than 2% of the molecules around the electrodes. In conclusion, endovascular NTIRE is possible. Our study sets the theoretical basis for further preclinical and clinical trials with endovascular NTIRE.

A Numerical Approximation Structured by Mixed Finite Element and Upwind Fractional Step Difference for Semiconductor Device with Heat Conduction and Its Numerical Analysis

2017 ◽  
Vol 10 (3) ◽  
pp. 541-561
Author(s):  
Yirang Yuan ◽  
Qing Yang ◽  
Changfeng Li ◽  
Tongjun Sun
Keyword(s):  
Finite Element ◽  
Heat Conduction ◽  
Numerical Analysis ◽  
Partial Differential Equations ◽  
Heat Conduction Equation ◽  
Semiconductor Device ◽  
Mixed Finite Element ◽  
Three Dimensional ◽  
Fractional Step ◽  
Dimensional Problem

AbstractA coupled mathematical system of four quasi-linear partial differential equations and the initial-boundary value conditions is presented to interpret transient behavior of three dimensional semiconductor device with heat conduction. The electric potential is defined by an elliptic equation, the electron and hole concentrations are determined by convection-dominated diffusion equations and the temperature is interpreted by a heat conduction equation. A mixed finite element approximation is used to get the electric field potential and one order of computational accuracy is improved. Two concentration equations and the heat conduction equation are solved by a fractional step scheme modified by a second-order upwind difference method, which can overcome numerical oscillation, dispersion and computational complexity. This changes the computation of a three dimensional problem into three successive computations of one-dimensional problem where the method of speedup is used and the computational work is greatly shortened. An optimal second-order error estimate in L2 norm is derived by prior estimate theory and other special techniques of partial differential equations. This type of parallel method is important in numerical analysis and is most valuable in numerical application of semiconductor device and it can successfully solve this international famous problem.

Transient Thermoelastic Fields in a Transversely Isotropic Infinite Solid With a Penny-Shaped Crack

1987 ◽  
Vol 54 (4) ◽  
pp. 854-860 ◽  
Author(s):  
N. Noda ◽  
F. Ashida
Keyword(s):  
Heat Conduction ◽  
Heat Conduction Equation ◽  
Three Dimensional ◽  
Transversely Isotropic ◽  
Transient Heat Conduction ◽  
Thermoelastic Problem ◽  
Conduction Equation ◽  
Thermal Stress Field ◽  
Penny Shaped Crack ◽  
Shaped Crack

The present paper deals with a transient thermoelastic problem for an axisymmetric transversely isotropic infinite solid with a penny-shaped crack. A finite difference formulation based on the time variable alone is proposed to solve a three-dimensional transient heat conduction equation in an orthotropic medium. Using this formulation, the heat conduction equation reduces to a differential equation with respect to the spatial variables. This formulation is applied to attack the transient thermoelastic problem for an axisymmetric transversely isotropic infinite solid containing a penny-shaped crack subjected to heat absorption and heat exchange through the crack surface. Thus, the thermal stress field is analyzed by means of the transversely isotropic potential function method.

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