Three-Dimensional Analysis of Fluid Flow and Heat Transfer in Single- and Two-Layered Micro-Channel Heat Sinks
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Micro-channel heat sinks are currently at the forefront of cooling technologies for computer chips where the input heat flux is projected to exceed 100 W/cm2 [1, 2]. The quest for better heat-sink designs has produced different ideas, one of which is the idea of using multi-layered micro-channel heat sinks [3, 4]. The objectives of the present investigation were to conduct a detailed numerical study of the hydrodynamic and thermal behavior of a two-layered micro-channel heat sink and to compare the performance of the two-layered heat sink with that of a single-layered sink under laminar flow conditions.
2015 ◽
Vol 69
(2)
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pp. 195-208
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2011 ◽
Vol 47
(11)
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pp. 1375-1383
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2001 ◽
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2021 ◽
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2018 ◽
Vol 8
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pp. 477-493
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