Determination of the coefficient of the temperature sensitivity of the burning rate for condensed systems from the heat conduction equation

2013 ◽  
Vol 51 (1) ◽  
pp. 106-110 ◽  
Author(s):  
O. F. Shlenskii ◽  
N. B. Shcherbak ◽  
N. N. Lyasnikova
Keyword(s):  
Heat Conduction ◽  
Burning Rate ◽  
Temperature Sensitivity ◽  
Heat Conduction Equation ◽  
Conduction Equation ◽  
Condensed Systems

Inverse determination of thermal conductivity in lumber based on genetic algorithms

Holzforschung ◽  
2016 ◽  
Vol 70 (3) ◽  
pp. 235-241 ◽  
Author(s):  
Jingyao Zhao ◽  
Zongying Fu ◽  
Xiaoran Jia ◽  
Yingchun Cai
Keyword(s):  
Thermal Conductivity ◽  
Genetic Algorithms ◽  
Heat Conduction ◽  
Heat Conduction Equation ◽  
Convective Heat Transfer Coefficient ◽  
Conduction Equation ◽  
New Equation ◽  
Volume Method ◽  
Good Agreement

Abstract A 3D numerical solution of the heat conduction equation is proposed based on the finite volume method to describe the heating of wood, where the thermal conductivity (ThC) is variable, and the convective heat transfer coefficient is constant. ThC parameters were found through an optimization process based on genetic algorithms. The objective function between measured and simulated curves is determined, and parameters with greatest correspondence between measured and estimated values were obtained. As a result, a new equation for ThC is proposed, which depends on moisture and temperature. The proposed coefficient is validated by experiments, and a good agreement was found between experimental heating curves and those obtained by simulation by means of the new heat conduction equation.

A study of the diffusion analogy technique for the photoelastic determination of transient thermal stresses

1988 ◽  
Vol 23 (1) ◽  
pp. 33-45
Author(s):  
P Stanley ◽  
Y J Yip
Keyword(s):  
Heat Conduction ◽  
Temperature Distribution ◽  
Isotropic Material ◽  
Heat Conduction Equation ◽  
Thermal Stresses ◽  
Conduction Equation ◽  
Formal Similarity ◽  
Photoelastic Study ◽  
Transient Thermal

The formal similarity between the equation governing the diffusion of a substance through a “porous” isotropic material and the heat conduction equation for the temperature distribution in an isotropic homogeneous solid is examined, and its use as a basis for the photoelastic study of transient thermal stresses is explored.

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