Temperature and indenter radius effects on mechanical properties of copper during nanoindentation: a molecular dynamic simulation study
2016 ◽
Vol 380
(4)
◽
pp. 628-633
◽
2008 ◽
2016 ◽
Vol 58
◽
pp. 528-535
◽
2021 ◽
Vol 103
◽
pp. 107799
2017 ◽
Vol 68
◽
pp. 131-142
◽