A self-maintained memory module supporting DMM

Proceedings of the 2007 international conference on Compilers, architecture, and synthesis for embedded systems - CASES '07 ◽

10.1145/1289881.1289916 ◽

2007 ◽

Cited By ~ 4

Author(s):

Weixing Ji ◽

Feng Shi ◽

Baojun Qiao

Keyword(s):

Memory Module

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Design and Implementation Memory Module for Air Conditioners

International Journal of Scientific and Research Publications (IJSRP) ◽

10.29322/ijsrp.9.01.2019.p8535 ◽

2019 ◽

Vol 9 (1) ◽

pp. p8535

Author(s):

Abhinav Parashar ◽

Aditya Vineet

Keyword(s):

Memory Module ◽

Air Conditioners ◽

Design And Implementation

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Faculty Opinions recommendation of A positive-feedback-based bistable 'memory module' that governs a cell fate decision.

Faculty Opinions – Post-Publication Peer Review of the Biomedical Literature ◽

10.3410/f.1014093.206673 ◽

2004 ◽

Author(s):

Hiten Madhani

Keyword(s):

Cell Fate ◽

Positive Feedback ◽

Cell Fate Decision ◽

Memory Module ◽

A Cell ◽

Fate Decision

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ON-AFN: Generating Image Caption based on the Fusion of Residual Attention and Ordered Memory Module

2021 IEEE Asia-Pacific Conference on Image Processing, Electronics and Computers (IPEC) ◽

10.1109/ipec51340.2021.9421119 ◽

2021 ◽

Author(s):

Chenchen Lu ◽

Zhaowei Qu ◽

Xiaoru Wang ◽

Heng Zhang

Keyword(s):

Memory Module ◽

Image Caption

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An early evaluation of Intel's optane DC persistent memory module and its impact on high-performance scientific applications

Proceedings of the International Conference for High Performance Computing, Networking, Storage and Analysis ◽

10.1145/3295500.3356159 ◽

2019 ◽

Cited By ~ 3

Author(s):

Michèle Weiland ◽

Holger Brunst ◽

Tiago Quintino ◽

Nick Johnson ◽

Olivier Iffrig ◽

...

Keyword(s):

High Performance ◽

Scientific Applications ◽

Memory Module ◽

Early Evaluation ◽

Persistent Memory

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Thermal characterization of a 3-dimensional memory module

Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Proceedings STHERM-96 ◽

10.1109/stherm.1996.545086 ◽

2002 ◽

Author(s):

Tae-Hyun Kim ◽

JoongHyun Baek ◽

S.H. Seol ◽

J.J. Kim ◽

Y.S. Kim ◽

...

Keyword(s):

Thermal Characterization ◽

Memory Module ◽

3 Dimensional

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SCUBA: an HDL data-path/memory module generator for FPGAs

Proceedings VHDL International Users' Forum. Fall Conference ◽

10.1109/viuf.1997.623942 ◽

2002 ◽

Cited By ~ 1

Author(s):

S. Mohanty ◽

K. Maheswaran ◽

S. Haruyama ◽

Jiang Niu

Keyword(s):

Data Path ◽

Memory Module

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Development of 3-dimensional memory module using anisotropic conductive adhesive films

Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204) ◽

10.1109/iemte.1998.723054 ◽

2002 ◽

Cited By ~ 3

Author(s):

T. Kikkawa ◽

R. Ideda ◽

T. Matsuda ◽

T. Watanabe

Keyword(s):

Conductive Adhesive ◽

Memory Module ◽

3 Dimensional ◽

Anisotropic Conductive Adhesive

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A Novel Design of the Device for Measuring Draw and Plug Forces

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.542-543.1029 ◽

2012 ◽

Vol 542-543 ◽

pp. 1029-1032

Author(s):

Ye Hu ◽

Zhao Jun Yang ◽

Ming Jun Xiang ◽

Zi Chen Qiu ◽

Chuan Gui Yang ◽

...

Keyword(s):

Data Conversion ◽

Memory Module ◽

Novel Device ◽

Working Principle ◽

Tool Shank ◽

Novel Design

The purpose of this paper is to present a novel device for measuring draw and plug forces, which is composed chiefly of a pull stud, a top modified tool shank, a middle modified tool shank, a down modified tool shank, and an end cover. The modified tool shank structure is proposed, and the working principle of the device for measuring draw and plug forces is demonstrated. Also, the data conversion and memory module and the circuit principle are investigated.

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