(Invited) Degradation in HfSiON Film Induced by Electrical Stress Application

2019 ◽  
Vol 28 (2) ◽  
pp. 263-272 ◽  
Author(s):  
Ryu Hasunuma ◽  
Chihiro Tamura ◽  
Tsuyoshi Nomura ◽  
Yuuki Kikuchi ◽  
Kenji Ohmori ◽  
...  
Author(s):  
Oussama Ben Abdellah ◽  
Andrea Al Haddad ◽  
Mustapha El Halaoui ◽  
Pascal Dupuis ◽  
Laurent Canale ◽  
...  

Author(s):  
Kai-Zhe Tan ◽  
See-Keong Lee ◽  
Heng-Chin Low

2021 ◽  
Vol 11 (11) ◽  
pp. 4838
Author(s):  
Je-Hyuk Kim ◽  
Youngjin Seo ◽  
Jun Tae Jang ◽  
Shinyoung Park ◽  
Dongyeon Kang ◽  
...  

Accurate circuit simulation reflecting physical and electrical stress is of importance in indium gallium zinc oxide (IGZO)-based flexible electronics. In particular, appropriate modeling of threshold voltage (VT) changes in different bias and bending conditions is required for reliability-aware simulation in both device and circuit levels. Here, we present SPICE compatible compact modeling of IGZO transistors and inverters having an atomic layer deposition (ALD) Al2O3 gate insulator on a polyethylene terephthalate (PET) substrate. Specifically, the modeling was performed to predict the behavior of the circuit using stretched exponential function (SEF) in a bending radius of 10 mm and operating voltages ranging between 4 and 8 V. The simulation results of the IGZO circuits matched well with the measured values in various operating conditions. It is expected that the proposed method can be applied to process improvement or circuit design by predicting the direct current (DC) and alternating current (AC) responses of flexible IGZO circuits.


2009 ◽  
Vol 48 (19) ◽  
pp. 8950-8953 ◽  
Author(s):  
Kyeongseok Oh ◽  
Mark Jemmett ◽  
Milind Deo

2013 ◽  
Vol 103 (16) ◽  
pp. 163504 ◽  
Author(s):  
C. Y. Zhu ◽  
F. Zhang ◽  
R. A. Ferreyra ◽  
V. Avrutin ◽  
Ü. Özgür ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document