A Robust Shallow Trench Isolation High Density Plasma Chemical Vapor Deposition Void Free Process for 0.13μm CMOS Technology

2019 ◽  
Vol 34 (1) ◽  
pp. 743-748
Author(s):  
Grace Ning ◽  
Paulchang Lin ◽  
Charles Xing ◽  
Allen Bian ◽  
Hong-Bo Zhao ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Cmos Technology ◽  
Plasma Chemical ◽  
Shallow Trench Isolation ◽  
Plasma Chemical Vapor Deposition ◽  
Free Process ◽  
Trench Isolation ◽  
Density Plasma

Calibration Method for High-Density-Plasma Chemical Vapor Deposition Simulation

2002 ◽  
Vol 41 (Part 1, No. 4A) ◽  
pp. 1974-1980 ◽  
Author(s):  
Shigeru Kinoshita ◽  
Shigeyuki Takagi ◽  
Hidehiko Yabuhara ◽  
Hiroshi Nishimura ◽  
Hideichi Kawaguchi ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Calibration Method ◽  
High Density ◽  
Plasma Chemical ◽  
Plasma Chemical Vapor Deposition ◽  
Deposition Simulation ◽  
Density Plasma
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