Optimisation of tribological performance of electroless Ni–B coating using Taguchi method and grey relational analysis

2011 ◽  
Vol 5 (1) ◽  
pp. 16-24 ◽  
Author(s):  
S Kalyan Das ◽  
P Sahoo
Keyword(s):  
Taguchi Method ◽  
Grey Relational Analysis ◽  
Tribological Performance ◽  
Relational Analysis ◽  
Grey Relational ◽  
Electroless Ni

scholarly journals Tribological Performance Optimization of Al-7.5% SiCp Composites Using the Taguchi Method and Grey Relational Analysis

2013 ◽  
Vol 2013 ◽  
pp. 1-9 ◽  
Author(s):  
Shouvik Ghosh ◽  
Prasanta Sahoo ◽  
Goutam Sutradhar
Keyword(s):  
Taguchi Method ◽  
Metal Matrix Composite ◽  
Matrix Composite ◽  
Grey Relational Analysis ◽  
Metal Matrix ◽  
Friction And Wear ◽  
Tribological Performance ◽  
Relational Analysis ◽  
Test Parameters ◽  
Grey Relational

The present study considers an experimental study of tribological performance of Al-7.5% SiCp metal matrix composite and optimization of tribological testing parameters based on the Taguchi method coupled with grey relational analysis. A grey relational grade obtained from grey relational analysis is used as a performance index to study the behaviour of Al-7.5% SiCp MMC with respect to friction and wear characteristics. The tribological experiments are carried out by utilizing the combinations of tribological test parameters based on the L27 Taguchi orthogonal design with three test parameters, namely, load, speed, and time. The material Al-7.5% SiCp metal matrix composite is developed by reinforcing LM6 aluminium alloy with 7.5% (by weight) SiC particle of 400 mesh size (~37 μm) in an electric melting furnace. It is observed that sliding time has a significant contribution in controlling the friction and wear behaviour of Al-7.5% SiCp MMC. Furthermore, all the interactions between the parameters have significant influence on tribological performance. A confirmation test is also carried out to verify the accuracy of the results obtained through the optimization problem. In addition, a scanning electron microscopy (SEM) test is performed on the wear tracks to study the wear mechanism.

Robust Process Design towards through-Silicon via Quality Improvement Based on Grey-Taguchi Method

2012 ◽  
Vol 217-219 ◽  
pp. 2183-2186
Author(s):  
Chao Wei Tang ◽  
Li Chang Chuang ◽  
Hong Tsu Young ◽  
Mike Yang ◽  
Hsueh Chuan Liao
Keyword(s):  
Taguchi Method ◽  
Grey Relational Analysis ◽  
Chemical Etching ◽  
Through Silicon Via ◽  
Relational Analysis ◽  
Wet Chemical ◽  
Wet Chemical Etching ◽  
Etching Parameters ◽  
Grey Relational ◽  
Grey Taguchi

The robust design of chemical etching parameters is dealing with the optimization of the through-silicon via (TSV) roundness error and TSV lateral etching depth in the etching of silicon for laser drilled TSVs. The considered wet chemical etching parameters comprise the HNO3 molarity, HF molarity, and etching time. Grey-Taguchi method is combining the orthogonal array design of experiments with Grey relational analysis (GRA), which enables the determination of the optimal combination of wet chemical etching parameters for multiple process responses. The concept of Grey relational analysis is to find a Grey relational grade, which can be used for the optimization conversion from a multiple objective case to a single objective case. Also, GRG is used to investigate the parameter effects to the overall quality targets.

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