scholarly journals 105 Solidification Simulation of Copper-Iron Alloy for Lead Frame by Phase-field Method

2012 ◽  
Vol 2012.20 (0) ◽  
pp. 9-10
Author(s):  
Takaaki HARA ◽  
Yoshiharu KANEGAE ◽  
Yuichi HIRAMOTO ◽  
Tatsuya TONOGI
2013 ◽  
Vol 830 ◽  
pp. 3-7
Author(s):  
Wei Zhou Hou ◽  
Hong Kui Mao

By optimizing the relevant dendrite growth parameters of Ni-Cu alloy undercooling melt, it has studied the effect that the dendrite evolution process of undercooled melt and the degree of undercooling melt have on the dendrite growth of undercooling melt. In the isothermal and non-isothermal solidification condition, relatively accurate result is obtained by applying the phase field method to simulate Ni-Cu alloy. Simulation results show non-isothermal simulation with Neuman boundary condition suit to the actual physical process better.


2021 ◽  
Vol 26 ◽  
pp. 102150
Author(s):  
Dong-Cho Kim ◽  
Tomo Ogura ◽  
Ryosuke Hamada ◽  
Shotaro Yamashita ◽  
Kazuyoshi Saida

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