scholarly journals STUDY ON ADJUSTABLE CONNECTOR OF RECIPROCAL FRAME

2021 ◽  
Vol 30 (2) ◽  
Author(s):  
Lin Qi ◽  
Zifei Li ◽  
Hui Pan ◽  
Lingtong Li ◽  
Xin Huang
Keyword(s):  
Mechanical Properties ◽  
Flexural Rigidity ◽  
Plastic Hinge ◽  
Three Dimensional ◽  
High Strength ◽  
Test Model ◽  
Hollow Section ◽  
Reciprocal Frames ◽  
Scale Test ◽  
Circular Hollow Section

In this paper, we design an adjustable connector of reciprocal frame, and a three-dimensional solid model of this connector with Circular Hollow Section has been created in the FEM software Abaqus CAE to study its mechanical properties. When the plastic hinge is formed at the end of the Circular Hollow Section, the connector is still in an elastic state. It is concluded that the adjustable connector of reciprocal frame has high strength and rigidity, realizing the goal for designing higher connector strength over Circular Hollow Section strength. Then parametric analysis is used to analyse the influence of the connector about each part on the mechanical properties, and the flexural rigidity of the connector has been derived. A three-dimensional wire model of reciprocal frames has been created in the FEM software Abaqus CAE, and a full-scale test model of the structure is designed. The numerical simulation results agree well with the test results. It is verified that the reliability of the modeling method and the accuracy of the connector mechanical model.

Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps

2011 ◽  
Author(s):  
Kohta Nakahira ◽  
Hironori Tago ◽  
Fumiaki Endo ◽  
Ken Suzuki ◽  
Hideo Miura
Keyword(s):  
Mechanical Properties ◽  
Residual Stress ◽  
Thermal Deformation ◽  
Flip Chip ◽  
Flexural Rigidity ◽  
Three Dimensional ◽  
Strain Gauges ◽  
Copper Interconnection ◽  
Induced Stress ◽  
Alignment Structure

Since the thickness of the stacked silicon chips in 3D integration has been thinned to less than 100 μm, the local thermal deformation of the chips has increased drastically because of the decrease of the flexural rigidity of the thinned chips. The clear periodic thermal deformation and thus, the thermal residual stress distribution appears in the stacked chips due to the periodic alignment of metallic bumps, and they deteriorate the reliability of products. In this paper, the dominant structural factors of the local residual stress in a silicon chip are discussed quantitatively based on the results of a three-dimensional finite element analysis and the measurement of the local residual stress in a chip using stress sensor chips. The piezoresistive strain gauges were embedded in the sensor chips. The length of each gauge was 2 μm, and an unit cell consisted of 4 gauges with different crystallographic directions. This alignment of strain gauges enables to measure the tensor component of three-dimensional stress fields separately. Test flip chip substrates were made by silicon chip on which the area-arrayed tin/copper bumps were electroplated. The width of a bump was fixed at 200 μm, and the bump pitch was varied from 400 μm to 1000 μm. The thickness of the copper layer was about 40 μm and that of tin layer was about 10 μm. This tin layer was used for the rigid joint formation by alloying with copper interconnection formed on a stress sensing chip. The measured amplitude of the residual stress increased from about 30 MPa to 250 MPa depending on the combination of materials such as bump, underfill, and interconnections. It was confirmed that both the material constant of underfill and the alignment structure of fine bumps are the dominant factors of the local deformation and stress of a silicon chip mounted on area-arrayed metallic bumps. It was also confirmed experimentally that both the hound’s-tooth alignment between a TSV (Through Silicon Via) and a bump and control of mechanical properties of electroplated copper thin films used for the TSV and bump is indispensable in order to minimize the packaging-induced stress in the three-dimensionally mounted chips. This test chip is very effective for evaluating the packaging-process induced stress in 3D stacked chips quantitatively.

scholarly journals Fabrication of High-Strength and Porous Hybrid Scaffolds Based on Nano-Hydroxyapatite and Human-Like Collagen for Bone Tissue Regeneration

Polymers ◽  
2020 ◽  
Vol 12 (1) ◽  
pp. 61 ◽  
Author(s):  
Yannan Liu ◽  
Juan Gu ◽  
Daidi Fan
Keyword(s):  
Mechanical Properties ◽  
Enzymatic Hydrolysis ◽  
Bone Tissue ◽  
Tissue Regeneration ◽  
Bone Repair ◽  
Three Dimensional ◽  
High Strength ◽  
Biological Properties ◽  
Bone Tissue Regeneration

A novel, three-dimensional, porous, human-like collagen (HLC)/nano-hydroxyapatite (n-HA) scaffold cross-linked by 1,2,7,8-diepoxyoctane (DEO) was successfully fabricated, which showed excellent mechanical and superior biological properties for bone tissue regeneration in this study. The physicochemical characterizations of different n-HA/HLC/DEO (nHD) scaffolds were investigated by determining the morphology, compression stress, elastic modulus, Young’s modulus and enzymatic hydrolysis behavior in vitro. The results demonstrated that nHD-2 and nHD-3 scaffolds showed superior mechanical properties and resistance to enzymatic hydrolysis compared to nHD-1 scaffolds. The cell viability, live cell staining and cell adhesion analysis results demonstrated that nHD-2 scaffolds exhibited low cytotoxicity and excellent cytocompatibility compared with nHD-1 and nHD-3 scaffolds. Furthermore, subcutaneous injections of nHD-2 scaffolds in rabbits produced superior anti-biodegradation effects and histocompatibility compared with injections of nHD-1 and nHD-3 scaffolds after 1, 2 and 4 weeks. In addition, the repair of bone defects in rabbits demonstrated that nHD-2 scaffolds presented an improved ability for guided bone regeneration and reconstruction compared to commercially available bone scaffold composite hydroxyapatite/collagen (HC). Collectively, the results show that nHD-2 scaffolds show promise for application in bone tissue engineering due to their excellent mechanical properties, anti-biodegradation, anti-biodegradation, biocompatibility and bone repair effects.

Behavior of plate-to-circular hollow section joints of 600 MPa high-strength steel

2012 ◽  
Vol 12 (4) ◽  
pp. 473-482 ◽  
Author(s):  
Swoo-Heon Lee ◽  
Kyung-Jae Shin ◽  
Hee-Du Lee ◽  
Woo-Bum Kim ◽  
Jae-Guen Yang
Keyword(s):  
High Strength Steel ◽  
High Strength ◽  
Hollow Section ◽  
Circular Hollow Section

scholarly journals Numerical Study on the Deformation Behavior of Longitudinal Plate-to-High-Strength Circular Hollow-Section X-Joints under Axial Load

2019 ◽  
Vol 9 (19) ◽  
pp. 3999
Author(s):  
Swoo-Heon Lee ◽  
Kyung-Jae Shin ◽  
So-Yeong Kim ◽  
Hee-Du Lee
Keyword(s):  
Yield Strength ◽  
High Strength Steel ◽  
Axial Load ◽  
Joint Strength ◽  
High Strength ◽  
Hollow Section ◽  
Strength Limit ◽  
Ultimate Deformation ◽  
Deformation Limit ◽  
Circular Hollow Section

This study aims to investigate the joint strength of longitudinal plate-to-high-strength steel circular hollow-section X-type joints under plate axial load. The material properties of high-strength steel with nominal yield strengths of 460, 650, 900, and 1100 MPa were used for parametric analysis. The variables for analysis were ratios of chord diameter to thickness, plate width to chord diameter, and utilization. To determine the capacity of connections, the joint strengths using a deformation limit and a strength limit were considered and compared with American Institute of Steel Construction (AISC), Eurocode 3, and ISO 14346. The joint strength determined by the ultimate deformation limit is approximately equal to the joint strength determined by the strength limit state at the yield strength of 460 MPa. The difference between both the joint strengths, however, becomes higher with increasing yield strength. The design equations estimate the joint strength based on the ultimate deformation limit approximately until the limitation of the nominal yield strength in each design code. As the nominal yield strength increases, the joint strengths are overestimated. In using high-strength steel in circular hollow-section X-type joints, the reduction factors of 0.75 and 0.62 for AISC and ISO 14346 are suggested for the nominal yield strengths of 900 and 1100 MPa, respectively. In Eurocode 3, the reduction factor of 0.67 is also suggested for a yield strength of 1100 MPa.

Harmonic Structure Design of Co-Cr-Mo Alloy with Outstanding Mechanical Properties

2014 ◽  
Vol 939 ◽  
pp. 60-67 ◽  
Author(s):  
Choncharoen Sawangrat ◽  
Osamu Yamaguchi ◽  
Sanjay Kumar Vajpai ◽  
Kei Ameyama
Keyword(s):  
Mechanical Properties ◽  
Mechanical Milling ◽  
Three Dimensional ◽  
High Strength ◽  
Surface Region ◽  
Structure Design ◽  
Coarse Grained ◽  
Harmonic Structure ◽  
Fine Grained ◽  
Plasma Sintering

Co-Cr-Mo alloy powders were subjected to controlled mechanical milling at room temperature under Ar atmosphere to fabricate bimodal microstructure in the MM powders, having nanosized grains in the surface region and micron-sized coarse grains in the center of the milled powders. Subsequently, the MM powder was compacted by spark-plasma sintering (SPS) process. The sintered compacts indicated two structure areas: (i) ultra-fine grained (UFG) regions, called shell, and (ii) the coarse grained regions called core. The shell and the core correspond to the surface and center of the MM powders, respectively. The shell regions established a continuous three dimensional network of high strength ultra-fine grained regions, which surrounded the discrete coarse grained ductile regions. Such a microstructure is referred as Harmonic Structure. The sintered Co-Cr-Mo alloy compacts exhibited outstanding mechanical properties. The yield strength increased from 605 to 635 MPa, and ultimate tensile strength increased from 1201 to 1283 MPa. Moreover, the elongation was maintained more or less same as that of coarse grained compacts. Therefore, the harmonic structure design leads to the new generation microstructure of Co-Cr-Mo alloy, which demonstrates outstanding mechanical properties, i.e. superior strength and excellent ductility as compared to conventional materials. Keywords: mechanical milling, Co-Cr-Mo alloys, mechanical properties, harmonic structure.

scholarly journals Mechanical Properties of Cemented Particulate Composite: A 3D Micromechanical Model

Materials ◽  
2021 ◽  
Vol 14 (14) ◽  
pp. 3875
Author(s):  
Chenglin Tao ◽  
Xi Liang ◽  
Xiaoxue Bi ◽  
Zeliang Liu ◽  
Huijian Li
Keyword(s):  
Mechanical Properties ◽  
Micromechanical Model ◽  
Three Dimensional ◽  
Particulate Composite ◽  
High Strength ◽  
High Energy ◽  
Engineering Practice ◽  
High Energy Absorption ◽  
Granular Composites ◽  
Properties Of Composites

Cemented particulate composite is a kind of composite material with high strength, high energy absorption, and multifunctional characteristics, which is widely used in engineering practice. The calculation of the mechanical properties of granular composites based on theoretical methods has always been a topic of discussion. A micromechanical model with a three-dimensional rigid beam-spring network (3D-RBSN) is proposed here. The stiffness matrix of the model was calculated theoretically. The model was applied to the analysis of the mechanical properties of composites material with glass beads and epoxy resin. The results indicate that the 3D-RBSN model can effectively predict the mechanical properties of composite materials, such as Young’s modulus and Poisson’s ratio. Furthermore, the damage evolution process of cemented particulate composite with initial defects was analyzed based on the 3D-RBSN model.

Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps

2012 ◽  
Vol 134 (2) ◽  
Author(s):  
Kota Nakahira ◽  
Hironori Tago ◽  
Fumiaki Endo ◽  
Ken Suzuki ◽  
Hideo Miura
Keyword(s):  
Mechanical Properties ◽  
Residual Stress ◽  
Thermal Deformation ◽  
Flip Chip ◽  
Flexural Rigidity ◽  
Three Dimensional ◽  
Strain Gauges ◽  
Copper Interconnection ◽  
Induced Stress ◽  
Alignment Structure

Since the thickness of stacked silicon chips in 3D integration has been thinned to less than 100 μm, the local thermal deformation of the chips has increased drastically because of the decrease of the flexural rigidity of the thinned chips. The clear periodic thermal deformation and thus, the local distribution of thermal residual stress appears in the stacked chips due to the periodic alignment of metallic bumps, and they sometimes deteriorate mechanical and electrical reliability of electronic products. In this paper, the dominant structural factors of the local residual stress in a silicon chip are investigated quantitatively based on the results of a three-dimensional finite element analysis and the measurement of the local residual stress in a chip using stress sensor chips. The piezoresistive strain gauges were embedded in the sensor chips. The length of each gauge was 2 μm, and an unit cell consisted of four gauges with different crystallographic directions. This alignment of the strain gauges enables us to measure the tensor component of three-dimensional stress fields separately. Test flip chip substrates were made of silicon chip on which the area-arrayed tin/copper bumps were electroplated. The width of a bump was fixed at 200 μm, and the bump pitch was varied from 400 μm to 1000 μm. The thickness of the copper bump was about 40 μm and that of tin layer was about 10 μm. This tin layer was used for the formation of rigid joint by alloying it with copper interconnection formed on a stress sensing chip. The measured amplitude of the residual stress increased from about 30 MPa to 250 MPa depending on the combination of materials such as bump, underfill, and interconnections. It was confirmed that both the material constant of underfill and the alignment structure of fine bumps are the dominant factors of the local deformation and stress of a silicon chip mounted on area-arrayed metallic bumps. It was also confirmed that not only the control of mechanical properties of electroplated copper thin films, but also the hound’s-tooth alignment of a through silicon via and a bump are indispensable for minimizing the packaging-induced stress in the three-dimensionally mounted chips. This test chip is very effective for evaluating the packaging-process-induced stress in 3D stacked chips quantitatively.

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