Design of a Branch Line Coupler Using Double-Sided Artificial Dielectric Substrate Structure

2015 ◽  
Vol 13 (4) ◽  
pp. 45 ◽  
Author(s):  
Jongsik Lim ◽  
Kyunghoon Kwon ◽  
Sang-Min Han ◽  
Dal Ahn ◽  
Yongchae Jeong
Keyword(s):  
Dielectric Substrate ◽  
Branch Line ◽  
Substrate Structure ◽  
Artificial Dielectric

Design of A Asymmetric Branch Line Coupler Using Artificial Dielectric Substrate

2012 ◽  
Vol 13 (5) ◽  
pp. 2319-2324 ◽  
Author(s):  
Jong-Sik Lim ◽  
Jae-Hoon Lee ◽  
Kyung-Hoon Kwon ◽  
Dal Ahn
Keyword(s):  
Dielectric Substrate ◽  
Branch Line ◽  
Artificial Dielectric

scholarly journals Size-Reduction of Frequency Mixers Using Artificial Dielectric Substrate

2013 ◽  
Vol 62 (5) ◽  
pp. 657-662
Author(s):  
Kyunghoon Kwon ◽  
Jongsik Lim ◽  
Yongchae Jeong ◽  
Dal Ahn
Keyword(s):  
Dielectric Substrate ◽  
Size Reduction ◽  
Artificial Dielectric

In‐Situ Measurements of Thermal Properties of Dielectric Films on Metal‐Dielectric‐Substrate Structures

1996 ◽  
Vol 445 ◽  
Author(s):  
P. Bloss ◽  
A.S. De Reggi ◽  
H. Schäfer
Keyword(s):  
Thermal Properties ◽  
Temperature Profile ◽  
Dielectric Film ◽  
Regularization Parameter ◽  
Laser Pulses ◽  
Dielectric Substrate ◽  
Dielectric Films ◽  
Thermal Mass ◽  
Metallic Electrode ◽  
Substrate Structure

AbstractWe show that the thermal diffusivity of a dielectric film and the heat‐transfer coefficient between the film and the substrate to which it is adhesively bonded can be determined from the electret‐like response stimulated by laser pulses applied to the voltage‐biased dielectric. The temperature profile is calculated as a function of time from the heat‐conduction equation with boundary conditions appropriate for the model structure representing the metallic electrode/ dielectric film/ glue layer/ substrate structure. The electrode, acting as a thermal mass, and the substrate, acting as a thermal sink, affect the temperature profile in different time ranges.The response is a convolution of the temperature and the electric‐field profiles across the dielectric. For nonideal dielectrics that acquire bulk charge under bias, deconvolution is necesssary to determine the field profile and the thermal properties. Deconvolution is accomplished using the Tikhonov‐regularization technique with a self‐consistent regularization parameter. This procedure yields information about the thermal properties of both the dielectric and the glue joint, as shown by actual measurements.

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