scholarly journals Modelling of piezoelectric micropositioning system using direct mapping and numerical analysis for precision grinding process control

2007 ◽  
Vol 1 (2) ◽  
pp. 143
Author(s):  
Y. Gao ◽  
S. Tse
Keyword(s):  
Numerical Analysis ◽  
Process Control ◽  
Grinding Process ◽  
Precision Grinding ◽  
Direct Mapping ◽  
Micropositioning System

Modeling of Micro-Positioning System Using Direct Mapping and Polynomial Fit for Precision Grinding Process Control

2007 ◽  
Vol 329 ◽  
pp. 791-796
Author(s):  
S. Tse ◽  
Y. Gao
Keyword(s):  
Process Control ◽  
Experimental Studies ◽  
Piezoelectric Constant ◽  
Grinding Process ◽  
Modeling Error ◽  
Precision Grinding ◽  
Positioning Systems ◽  
Direct Mapping ◽  
Polynomial Fit ◽  
Command Signals

For micro-positioning systems using piezoelectric actuators for precision grinding process control, sinusoidal command signals will be used and will give additional problems in comparison with the commonly used step signals due to the hysteresis effects, which require a good modeling approach. In order to avoid the discontinuity problem in obtaining the values of the piezoelectric constant, a new approach of direct mapping with polynomial fit is proposed. Theoretical and experimental studies are conducted and comparative studies are made. Compared with the single polynomial approach, the proposed method of direct mapping with polynomial fit is able to reduce the modeling error to 12.5%, which is 6.5% lower, and the problems in obtaining the values of the piezoelectric constant are avoided. The proposed approach is shown advantageous. Further studies are necessary to significantly reduce the modeling error.

scholarly journals Grinding in Ball Mills: Modeling and Process Control

2012 ◽  
Vol 12 (2) ◽  
pp. 51-68 ◽  
Author(s):  
Vladimir Monov ◽  
Blagoy Sokolov ◽  
Stefan Stoenchev
Keyword(s):  
Process Control ◽  
Control Strategies ◽  
Grinding Process ◽  
Ball Mills ◽  
Modeling And Control ◽  
Energy Models ◽  
And Control

Abstract The paper presents an overview of the current methodology and practice in modeling and control of the grinding process in industrial ball mills. Basic kinetic and energy models of the grinding process are described and the most commonly used control strategies are analyzed and discussed.

scholarly journals Fuzzy In-process Control Plunge Grinding Techniques. Study on Intelligent Automation of Grinding Process. (1st Report).

1992 ◽  
Vol 58 (2) ◽  
pp. 313-318 ◽  
Author(s):  
Toshikatsu NAKAJIMA ◽  
Shinya TSUKAMOTO ◽  
Daisuke MURAKAMI ◽  
Katsuhiro KURATA
Keyword(s):  
Process Control ◽  
Grinding Process ◽  
Plunge Grinding

Investigation into the Role of Cold Atmospheric Plasma on the Precision Grinding of RB-SiC Ceramic at Room Temperature

2021 ◽  
Author(s):  
Jiabin Xu ◽  
Xiaoshuang Rao ◽  
Xiaoyu Xu ◽  
Kechong Wang ◽  
Bao Guo ◽  
...  
Keyword(s):  
Surface Modification ◽  
Material Removal ◽  
Room Temperature ◽  
Atmospheric Plasma ◽  
Grinding Process ◽  
Plasma Oxidation ◽  
Precision Grinding ◽  
Cold Atmospheric Plasma ◽  
Sic Ceramic ◽  
Subsurface Material

Abstract RB-SiC ceramic is one of the most important and useful material as optical precision elements in many scientific research fields. In this paper, a novel cold atmospheric plasma (CAP), which is based on the precision grinding process in surface technology to modify at room temperature (RT) for grinding with a combination of plasma oxidation surface modification is proposed. To identify the performance of the proposed cold atmospheric plasma (CAP) method on the surface modification of RB-SiC ceramic, precision grinding test was conducted. To reveal the fundamental issue in the grinding of RB-SiC ceramic, numerical calculation and model analysis were conducted to investigate the effect of the composite process on grinding forces and the mechanism of subsurface material removal in the presence of plasma oxidation. As a result of the method included the kept constant during the precision grinding of the composite process self-adaption-grinding process to avoid the deviation caused by second grinding particle entry. As a summary, we provides a significant cold atmospheric plasma-precision grinding compound process toward the establishment of the basic theory by analyzing the mechanism of the simulated design and computation. The process and technical difficulties of RB-SiC ceramic and mechanism of subsurface material removal during precision grinding were be solved.

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