THE IMPACT OF INTEGRATED TECHNOLOGIES ON THE FAULT TOLERANCE OF ELECTRONIC COMPONENTS FOR AEROSPACE EQUIPMENT

2020 ◽  
Author(s):  
Е. А. Suvorova ◽  
Keyword(s):  
Fault Tolerance ◽  
Electronic Components ◽  
The Impact

Refined Calculation Assessment of Failure and Fault Tolerance of Sensitive Electronic Components with Actual Mass Protection

2021 ◽  
Vol 8 (4) ◽  
pp. 77-85
Author(s):  
S. V. Golovanov ◽  
◽  
A. A. Meshcheryakov ◽  
V. Yu. Murzin ◽  
P. B. Lagov ◽  
...  
Keyword(s):  
Fault Tolerance ◽  
Large Scale ◽  
Three Dimensional ◽  
High Energy ◽  
Electronic Components ◽  
Heavy Charged Particles ◽  
Average Mass ◽  
The Impact ◽  
Onboard Equipment ◽  
Actual Mass

Nowadays rocket and space industry enterprises use a simplified method to evaluate failure and fault tolerance of the onboard equipment to single event effects (SEEs), when the calculation is performed for the minimum mass protection thickness (g/cm2 ) of potentially sensitive electronic components determined, as a rule, by the minimum wall thickness of the device under consideration. In this case, all structural elements of the onboard equipment, spacecraft, and neighboring devices are not included, which, in many cases, leads to a significant overestimation of the calculated SEEs frequency especially for large scale integration ICs. Neglecting the actual mass protection may require redundant measures to ensure failure and fault tolerance. The work proposes an improved approach of calculating failure and fault tolerance of sensitive electronic components and onboard equipment to the impact of heavy charged particles and high-energy protons that causes SEEs, which consists in using programs for calculating absorbed doses by the sectorization method in three-dimensional models, which makes possible to determine the minimum, maximum, and average mass protection of electronic components with the complete design of the onboard equipment and spacecraft.

A Musical Technography of John Bischoff

2004 ◽  
Vol 14 ◽  
pp. 75-79
Author(s):  
Douglas Kahn
Keyword(s):  
San Francisco ◽  
Early Development ◽  
Computer Music ◽  
Turning Point ◽  
San Francisco Bay Area ◽  
Experimental Music ◽  
Music Technology ◽  
Electronic Components ◽  
Bay Area ◽  
The Impact

John Bischoff has been part of the formation and growth of electronic and computer music in the San Francisco Bay Area for over three decades. In an interview with the author, he describes his early development as a student of experimental music technology, including the impact of hearing and assisting in the work of David Tudor. Bischoff, like Tudor, explored the unpredictable potentials within electronic components, and he brought this curiosity to bear when he began working on one of the first available micro-computers. He was a key individual at the historical turning point when computer music escaped its institutional restric-tions and began becoming widespread.

Efficient Fault Tolerance on Cloud Environments

2018 ◽  
Vol 8 (3) ◽  
pp. 20-31 ◽  
Author(s):  
Sam Goundar ◽  
Akashdeep Bhardwaj
Keyword(s):  
Fault Tolerance ◽  
Web Applications ◽  
Fault Tolerant ◽  
Cloud Services ◽  
Level Of Service ◽  
Cloud Environments ◽  
Computing Environments ◽  
Service Assurance ◽  
Mission Critical ◽  
The Impact

With mission critical web applications and resources being hosted on cloud environments, and cloud services growing fast, the need for having greater level of service assurance regarding fault tolerance for availability and reliability has increased. The high priority now is ensuring a fault tolerant environment that can keep the systems up and running. To minimize the impact of downtime or accessibility failure due to systems, network devices or hardware, the expectations are that such failures need to be anticipated and handled proactively in fast, intelligent way. This article discusses the fault tolerance system for cloud computing environments, analyzes whether this is effective for Cloud environments.

scholarly journals Dismantling of Waste Printed Circuit Boards with the Simultaneous Recovery of Copper: Experimental Study and Process Modeling

Materials ◽  
2021 ◽  
Vol 14 (18) ◽  
pp. 5186
Author(s):  
Szabolcs Fogarasi ◽  
Árpád Imre-Lucaci ◽  
Florica Imre-Lucaci
Keyword(s):  
Environmental Performance ◽  
Printed Circuit Boards ◽  
Electrochemical Process ◽  
Circuit Boards ◽  
Electronic Components ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards ◽  
Different Types ◽  
Leaching Solution ◽  
The Impact

The study was carried out with the aim to demonstrate the applicability of a combined chemical–electrochemical process for the dismantling of waste printed circuit boards (WPCBs) created from different types of electronic equipment. The concept implies a simple and less polluting process that allows the chemical dismantling of WPCBs with the simultaneous recovery of copper from the leaching solution and the regeneration of the leaching agent. In order to assess the performance of the dismantling process, various tests were performed on different types of WPCBs using the 0.3 M FeCl3 in 0.5 M HCl leaching system. The experimental results show that, through the leaching process, the electronic components (EC) together with other fractions can be efficiently dismounted from the surface of WPCBs, with the parallel electrowinning of copper from the copper rich leaching solution. In addition, the process was scaled up for the dismantling of 100 kg/h WPCBs and modeled and simulated using process flow modelling software ChemCAD in order to assess the impact of all steps and equipment on the technical and environmental performance of the overall process. According to the results, the dismantling of 1 kg of WPCBs requires a total energy of 0.48 kWh, and the process can be performed with an overall low environmental impact based on the obtained general environmental indexes (GEIs) values.

scholarly journals Overall Equipment Efficiency (OEE) Enhancement in Manufacture of Electronic Components & Boards Industry through Total Productive Maintenance Practices

2018 ◽  
Vol 150 ◽  
pp. 05037 ◽  
Author(s):  
Soo-Fen Fam ◽  
Ser Lee Loh ◽  
M. Haslinda ◽  
Heri Yanto ◽  
Linda Mei Sui Khoo ◽  
...  
Keyword(s):  
Semiconductor Industry ◽  
Primary Data ◽  
Global Competition ◽  
Maintenance Strategy ◽  
Electronic Components ◽  
Total Productive Maintenance ◽  
Die Attach ◽  
Effectiveness And Efficiency ◽  
The Impact ◽  
Better Than

In an environment of intense global competition, both creative and proven strategies need to be considered in order to bring about the effectiveness and efficiency in manufacturing operation. Total Productive Maintenance (TPM) is one of the effective maintenance strategy in enhancing the equipment effectiveness and to achieve a significant competitive advantage. This research paper addresses the impact of three TPM pillars namely planned maintenance (PM), autonomous maintenance (AM) and focused maintenance (FM) on overall equipment effectiveness (OEE) of die attach equipment in the production line of semiconductor industry. The effect of TPM on the OEE is also investigated depending on the equipment types, in where die attach process consist of two models-CANON and ESEC. The primary data was collected from an organization's database and was analysed by SPSS V23. The preliminary results of the analysis showed that the performance of OEE in ESEC is better than the CANON after the implementation of TPM. The analysis also showed that out of the three TPM practices deployed, planned maintenance of equipment by production and maintenance team played the biggest role in increasing the equipment effectiveness. In conclusion, this study provides insights the importance of implementing TPM in order to succeed in a highly demanding market arena.

Effect of Component Layout and Geometry on the Flow Distribution in Electronics Circuit Packs

1991 ◽  
Vol 113 (1) ◽  
pp. 50-57 ◽  
Author(s):  
K. Azar ◽  
E. T. Russell
Keyword(s):  
Experimental Investigation ◽  
Three Dimensional ◽  
Flow Distribution ◽  
Reynolds Numbers ◽  
Water Tunnel ◽  
Large Aspect Ratio ◽  
Electronic Components ◽  
Component Layout ◽  
Multiple Component ◽  
The Impact

An experimental investigation was conducted to study the impact of component layout and geometry on flow distribution on a circuit pack. The experiment was conducted in a water tunnel using aluminum blocks to simulate various electronic components. The experiments were conducted for laminar and onset of transition Reynolds numbers. Diluted ink was used as the flow visualization vehicle. The study looked at flow over single component, multiple component, and fully loaded circuit packs. The study drew a number of conclusions including the flows were highly three dimensional, and location and orientation of components with large aspect ratio will significantly affect circuit pack flow distribution.

Evaluation of Dynamic Property of Radiogram under Repetitive Drop Shock

2011 ◽  
Vol 101-102 ◽  
pp. 1087-1091
Author(s):  
Yan Feng Guo ◽  
Yan Hong Mao ◽  
Yun Gang Fu ◽  
Wen Cai Xu
Keyword(s):  
Natural Vibration ◽  
Amplification Factor ◽  
Impact Load ◽  
Railway Transportation ◽  
Electronic Components ◽  
Box Structure ◽  
Repetitive Impact ◽  
The Impact ◽  
And Storage ◽  
Impact Duration

Repetitive impact during highway and railway transportation has potential and severe harm for the product with fragile or damageable component. The radiogram belongs to a typical electronic product with panel and box structure, and occurs with the falling down of loudspeaker contacted on the top box, the failure of electronic components, and the fracture of outside box during transportation and storage. So the main feature of this article is the analysis on the natural vibration property, and the evaluation on the drop shock property including amplification factor and relevant curves under nine kinds of repetitive impact with different impact duration and drop height. The results show that the amplification factor markedly rise while the impact duration 2.02ms (nearly causing the resonance of radiogram), the repetitive drop shock may bring more serious damage than single impact load, so the case should be paid attention for the design of package cushioning.

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