Enhancement of PV Panel Power Production by Passive Cooling Using Heat Sinks with Perforated Fins

This paper presents a numerical model regarding the passive cooling of PV panels through perforated and non-perforated heat sinks. A typical PV panel was studied in a fixed position, tilted at 45 degrees from the horizontal with the wind direction towards its backside. A challenging approach was used in order to calibrate the base case of the numerical model according to the NOCT conditions. Further validation of the accuracy of the numerical simulation consisted of a comparison between the results obtained for the base case, or heat sink, with horizontal non-perforated fins and the experiments presented in the literature. Six types of heat sink attached to the backside of the PV panel were numerically studied. The analyzed configurations focused on heat sinks with both perforated and non-perforated fins that were distributed horizontally and vertically. The CFD simulation was also conducted by modeling the air volume around the PV panel in real wind conditions. The main output parameters were the average temperature and the convective heat transfer coefficient on the front and back of the PV panel. The most important effect of cooling was achieved in low wind conditions and high levels of solar radiation. For vair = 1 m/s, G = 1000 W/m2 and ambient temperature tair = 35 °C, the percentage of maximum power production achieved 83.33% for the base case, while in the best cooling scenario it reached 88.74%, assuring a rise in the power production of 6.49%.

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Numerical and Experimental Investigation of Air Cooling for Photovoltaic Panels Using Aluminum Heat Sinks

International Journal of Photoenergy ◽

10.1155/2020/1574274 ◽

2020 ◽

Vol 2020 ◽

pp. 1-9 ◽

Cited By ~ 4

Author(s):

Zainal Arifin ◽

Dominicus Danardono Dwi Prija Tjahjana ◽

Syamsul Hadi ◽

Rendy Adhi Rachmanto ◽

Gabriel Setyohandoko ◽

...

Keyword(s):

Heat Sink ◽

Cfd Simulation ◽

Operating Temperature ◽

Ambient Air ◽

Heat Sinks ◽

Solar Irradiation ◽

Electrical Performance ◽

Electricity Production ◽

Air Cooling ◽

Pv Panel

An increase in the operating temperature of photovoltaic (PV) panels caused by high levels of solar irradiation can affect the efficiency and lifespan of PV panels. This study uses numerical and experimental analyses to investigate the reduction in the operating temperature of PV panels with an air-cooled heat sink. The proposed heat sink was designed as an aluminum plate with perforated fins that is attached to the back of the PV panel. A comprehensive computational fluid dynamics (CFD) simulation was conducted using the software ANSYS Fluent to ensure that the heat sink model worked properly. The influence of heat sinks on the heat transfer between a PV panel and the circulating ambient air was investigated. The results showed a substantial decrease in the operating temperature of the PV panel and an increase in its electrical performance. The CFD analysis in the heat sink model with an air flow velocity of 1.5 m/s and temperature of 35°C under a heat flux of 1000 W/m2 showed a decrease in the PV panel’s average temperature from 85.3°C to 72.8°C. As a consequence of decreasing its temperature, the heat sink increased the open-circuit photovoltage (VOC) and maximum power point (PMPP) of the PV panel by 10% and 18.67%, respectively. Therefore, the use of aluminum heat sinks could provide a potential solution to prevent PV panels from overheating and may indirectly lead to a reduction in CO2 emissions due to the increased electricity production from the PV system.

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Cooling Performance of Heat Sinks Used in Electronic Devices

MATEC Web of Conferences ◽

10.1051/matecconf/201817102003 ◽

2018 ◽

Vol 171 ◽

pp. 02003

Author(s):

Ibrahim Mjallal ◽

Hussein Farhat ◽

Mohammad Hammoud ◽

Samer Ali ◽

Ali AL Shaer ◽

...

Keyword(s):

Heat Sink ◽

Electronic Devices ◽

Heat Fluxes ◽

Electronic Cooling ◽

Heat Sinks ◽

Passive Cooling ◽

Short Term ◽

Cooling Systems ◽

Thermal Output ◽

Electrical Devices

Existing passive cooling solutions limit the short-term thermal output of systems, thereby either limiting instantaneous performance or requiring active cooling solutions. As the temperature of the electronic devices increases, their failure rate increases. That’s why electrical devices should be cooled. Conventional electronic cooling systems usually consist of a metal heat sink coupled to a fan. This paper compares the heat distribution on a heat sink relative to different heat fluxes produced by electronic chips. The benefit of adding a fan is also investigated when high levels of heat generation are expected.

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Heat-Transfer Characteristics and Design Optimization for a Small-Sized Plate-Fin Heat Sink Array

Journal of Electronic Packaging ◽

10.1115/1.2804102 ◽

2007 ◽

Vol 129 (4) ◽

pp. 518-521 ◽

Cited By ~ 1

Author(s):

Gaowei Xu ◽

Yingjun Cheng ◽

Le Luo

Keyword(s):

Heat Transfer ◽

Heat Transfer Coefficient ◽

Transfer Coefficient ◽

Convective Heat Transfer ◽

Convective Heat ◽

Heat Sink ◽

Convective Heat Transfer Coefficient ◽

Heat Sinks ◽

Heat Transfer Characteristics ◽

Fin Thickness

The heat-transfer characteristics of 128 small-sized plate-fin heat sinks in a supercomputer chassis are investigated with CFD simulation. The V-shaped curves of the chip temperature versus fin pitch and fin thickness are derived and a thermal resistance model is built to explore the profile and obtain the convective heat-transfer coefficient of the heat sinks. It turns out that the V-shaped profile arises from the joint action of the thermal conduction and convection of heat sink, which can be attributed to the intricacy of the dependencies of thermal resistances on either fin pitch or thickness. It can be further concluded that Biot criterion is applicable to estimate the Biot number of large-scale plate-fin heat sink but not applicable for the small-sized one. The convective heat-transfer coefficient is a complicated function of fin pitch and fin thickness. The empirical formulas of heat transfer are obtained and the fin pitch and fin thickness are optimized.

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Optimal Shapes of Straight Fins and Finned Heat Sinks

Journal of Heat Transfer ◽

10.1115/1.4029854 ◽

2015 ◽

Vol 137 (6) ◽

Cited By ~ 9

Author(s):

Matti Lindstedt ◽

Kaj Lampio ◽

Reijo Karvinen

Keyword(s):

Numerical Model ◽

Analytical Solution ◽

Flow Velocity ◽

Power Electronics ◽

Heat Sink ◽

Base Plate ◽

Heat Sinks ◽

Optimal Shapes ◽

Cool Power

Finned heat sinks are used to cool power electronics components. We present optimization results for single rectangular, triangular, and trapezoidal fins. After that, we minimize the mass of an existing heat sink consisting of a base plate and a fin array by optimizing the geometrical variables and component locations on the base plate. An analytical solution is used with rectangular fins and a numerical model with trapezoidal fins. Whereas the triangle is the best shape for single fins, in a heat sink flow velocity coupled with geometry favors trapezoids over triangles and rectangles.

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Augmentation of Thermal Performance of Plate Fin Heat Sink

International Journal of Engineering and Advanced Technology - Regular Issue ◽

10.35940/ijrte.f1213.0886s19 ◽

2019 ◽

Vol 8 (6S) ◽

pp. 1087-1094

Keyword(s):

Heat Transfer ◽

Integrated Circuits ◽

Heat Sink ◽

Thermal Stresses ◽

Elevated Temperatures ◽

Convective Heat Transfer Coefficient ◽

Thermal Control ◽

Industrial Applications ◽

Heat Sinks ◽

Audio Amplifier

Heat sinks are popularly used in various industrial applications to cool electrical, electronics and automobile components. They are useful in removing the heat from the surfaces at elevated temperatures. The life of such devices depends on their operating temperature. Heat sinks are important parts of thermal management systems of most of these devices eg: Diods, thyristers, high power semiconductor devices such as integrated circuits of inverters, audio amplifier, microprocessors, microcontrollers etc. In many situations where heat transfer is by free convection where convective heat transfer coefficient is low, fins are the best solution because of their less cost and trouble free operation. The weight and size of equipment are the most important parameters of design. Present day demand, the use of compact systems in every application which leads to higher packing density. The failure rate of electronic equipments increase exponentially with the temperature. Also the high thermal stresses in the solder joints of electronic components mounted on circuit boards resulting from temperature variation are major causes of failure. Therefore thermal control has become an important factor in the design and operation of electronic equipment. The most preferred method for cooling these systems is passive cooling because it is cost effective and reliable. This leads to focus on development of effective fin heat sink. To make heat sink effective, geometry and orientation of the heat sink as well as heat transfer augmentation techniques plays important role. This paper highlights the use of heat sinks in electronic cooling applications and review of related literature of improving the heat transfer performance of plate fin heat sinks by surface modifications, interrupting the boundary layer and changing the orientation.

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Forced Convection upon Heat Sink of AL-Cu for Design Optimization by Experimental and CFD Analysis for Cooling of ICs in CPU

International Journal of Engineering and Advanced Technology - Regular Issue ◽

10.35940/ijeat.a9867.129219 ◽

2019 ◽

Vol 9 (2) ◽

pp. 251-255

Keyword(s):

Heat Sink ◽

Base Plate ◽

Power Input ◽

Heat Sinks ◽

Specific Power ◽

Cfd Analysis ◽

Cfd Simulations ◽

Average Temperature ◽

Specific Power Input ◽

Heat Sink Design

A heat sink device is used with specific power input at 100V and 20W by the heater attached at the base plate of copper and then obtaining the average temperature of Heat sink by the help of 10 thermocouples .Two specimens of heat sinks were designed and were tested for mass flow rate and heat transfer coefficient. With base of 1.5mm&2.5mmtip thickness and another specimen with dimensions as tip0.5mm and1.00mmbase thickness are used By experimenting and CFD simulations,optimization of heat sink design was done.Then correlation and Validation foe both the specimen was done and were found satisfactory results.

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Forced Convection upon Heat Sink of AL-Cu for Design Optimization by Experimental and CFD Analysis for cooling of ICs in CPU.

International Journal of Recent Technology and Engineering - 2 ◽

10.35940/ijrte.d7925.118419 ◽

2019 ◽

Vol 8 (4) ◽

pp. 11172-11176

Keyword(s):

Heat Sink ◽

Base Plate ◽

Power Input ◽

Heat Sinks ◽

Specific Power ◽

Cfd Analysis ◽

Cfd Simulations ◽

Average Temperature ◽

Specific Power Input ◽

Heat Sink Design

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A Preliminary Investigation of the Cooling of Electronic Components With Flat Plate Heat Sinks

Journal of Electronic Packaging ◽

10.1115/1.2905495 ◽

1994 ◽

Vol 116 (1) ◽

pp. 60-67 ◽

Cited By ~ 5

Author(s):

I. Ahmed ◽

R. J. Krane ◽

J. R. Parsons

Keyword(s):

Natural Convection ◽

Numerical Model ◽

Rectangular Plate ◽

Heat Sink ◽

Parametric Study ◽

Horizontal Component ◽

Heat Sinks ◽

Two Dimensional ◽

Electronic Components ◽

Plate Heat

Flat rectangular plate heat sinks are often used to cool large electronic components by the combined effects of natural convection and thermal radiation. There is, however, a paucity of rational design techniques for these devices. Thus, a systematic program to investigate the use of flat, rectangular plate heat sinks with surface coatings to enhance the net radiative exchange with the surroundings has been undertaken. The preliminary results of this program are presented in this work. A two-dimensional numerical model of a single electronic component mounted on a vertically oriented, flat rectangular plate heat sink that is located immediately above an upward-facing, horizontal component board was developed for this investigation. This model, which is solved using a control volume method based on the SIMPLER algorithm, accounts for the fully-coupled natural convection, conduction and radiative heat transfer processes that occur in the two-dimensional heat sink configuration described above. The results of a parametric study performed with the numerical model confirm the necessity of employing a heat sink, since for the ranges of values investigated, from 64 to 88 percent of the energy dissipated in the component is transferred to the surroundings from the heat sink. The parametric study examines the effects of component power, heat sink size (height), the thickness and emissivity of the heat sink, the vertical location of the component on the heat sink, and the temperature of the horizontal component board on the temperature of the component mounted on the heat sink.

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Impact of roof shading on building energy performance in warm & humid climatic places of India

iCRBE Procedia ◽

10.32438/icrbe.202037 ◽

2020 ◽

pp. 50-64

Author(s):

Kuladeep Kumar Sadevi ◽

Avlokita Agrawal

Keyword(s):

Energy Consumption ◽

Energy Conservation ◽

Energy Performance ◽

General Assumption ◽

Climatic Conditions ◽

Building Envelope ◽

Passive Cooling ◽

Base Case ◽

U Value ◽

The Impact

With the rise in awareness of energy efficient buildings and adoption of mandatory energy conservation codes across the globe, significant change is being observed in the way the buildings are designed. With the launch of Energy Conservation Building Code (ECBC) in India, climate responsive designs and passive cooling techniques are being explored increasingly in building designs. Of all the building envelope components, roof surface has been identified as the most significant with respect to the heat gain due to the incident solar radiation on buildings, especially in tropical climatic conditions. Since ECBC specifies stringent U-Values for roof assembly, use of insulating materials is becoming popular. Along with insulation, the shading of the roof is also observed to be an important strategy for improving thermal performance of the building, especially in Warm and humid climatic conditions. This study intends to assess the impact of roof shading on building’s energy performance in comparison to that of exposed roof with insulation. A typical office building with specific geometry and schedules has been identified as base case model for this study. This building is simulated using energy modelling software ‘Design Builder’ with base case parameters as prescribed in ECBC. Further, the same building has been simulated parametrically adjusting the amount of roof insulation and roof shading simultaneously. The overall energy consumption and the envelope performance of the top floor are extracted for analysis. The results indicate that the roof shading is an effective passive cooling strategy for both naturally ventilated and air conditioned buildings in Warm and humid climates of India. It is also observed that a fully shaded roof outperforms the insulated roof as per ECBC prescription. Provision of shading over roof reduces the annual energy consumption of building in case of both insulated and uninsulated roofs. However, the impact is higher for uninsulated roofs (U-Value of 3.933 W/m2K), being 4.18% as compared to 0.59% for insulated roofs (U-Value of 0.33 W/m2K).While the general assumption is that roof insulation helps in reducing the energy consumption in tropical buildings, it is observed to be the other way when insulation is provided with roof shading. It is due to restricted heat loss during night.

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